Patents by Inventor Pei-Jung Tsai

Pei-Jung Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12260245
    Abstract: A method for deploying remote desktop gateways (RDGWs), a computer device, and a storage medium are provided. Application data of virtual machines (VMs) is obtained in RDGWs, the application data includes historical data and real-time data. A neural network is trained by using the historical data and a target classification model is obtained. The real-time data is inputted into the target classification model and a classification result of the real-time data is obtained. The VMs are deployed to a designated RDGW based on the classification result. The method allocates and deploys resources with greater efficiency.
    Type: Grant
    Filed: April 13, 2022
    Date of Patent: March 25, 2025
    Assignee: Fulian Precision Electronics (Tianjin) Co., LTD.
    Inventors: Pei-Jung Tsai, Cheng-Ta Hsu
  • Patent number: 12151452
    Abstract: The present invention relates to a composite laminate plate, a housing and a mobile communication device. The composite laminate includes a top metal layer with a through hole and an array antenna, and an area ratio of the array antenna to the through hole meets a specific range, thereby enhancing wave transmissivity of a millimeter wave. Moreover, the composite laminate has a specific material structure, such that it has good mechanical properties and low density. The housing and the mobile communication device made by the composite laminate have advantages of metallic texture, high signal intensity and excellent effect for light weight tendency.
    Type: Grant
    Filed: October 8, 2021
    Date of Patent: November 26, 2024
    Assignee: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
    Inventors: Yen-Lin Huang, Pei-Jung Tsai, Li-De Wang, Chun-Chieh Wang
  • Patent number: 11766847
    Abstract: A multilayer plate with composite material and a method thereof are described. The multilayer plate includes an aluminum-based thin sheet and a composite material layer. The aluminum-based thin sheet includes a first passivation layer, an aluminum-based metal layer, and a second passivation layer sequentially. The aluminum-based thin sheet includes a first surface and a second surface opposite to the first surface. The first and second surfaces are set with micro holes. A diameter of the micro holes in the second surface is ranging from 0.5 ?m to 10 ?m. The composite material layer includes a thermoplastic polymer and a fiber material. The composite material layer has a third surface and a fourth surface opposite each other. The second surface is adjacent to or connected to the third surface. At least one portion of the thermoplastic polymer fills into the micro holes in the second surface.
    Type: Grant
    Filed: April 8, 2021
    Date of Patent: September 26, 2023
    Assignee: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
    Inventors: Yen-Lin Huang, Pei-Jung Tsai, Chi-Wah Keong
  • Publication number: 20220342692
    Abstract: A method for deploying remote desktop gateways (RDGWs), a computer device, and a storage medium are provided. Application data of virtual machines (VMs) is obtained in RDGWs, the application data includes historical data and real-time data. A neural network is trained by using the historical data and a target classification model is obtained. The real-time data is inputted into the target classification model and a classification result of the real-time data is obtained. The VMs are deployed to a designated RDGW based on the classification result. The method allocates and deploys resources with greater efficiency.
    Type: Application
    Filed: April 13, 2022
    Publication date: October 27, 2022
    Inventors: PEI-JUNG TSAI, CHENG-TA HSU
  • Publication number: 20220176677
    Abstract: The present invention relates to a composite laminate plate, a housing and a mobile communication device. The composite laminate includes a top metal layer with a through hole and an array antenna, and an area ratio of the array antenna to the through hole meets a specific range, thereby enhancing wave transmissivity of a millimeter wave. Moreover, the composite laminate has a specific material structure, such that it has good mechanical properties and low density. The housing and the mobile communication device made by the composite laminate have advantages of metallic texture, high signal intensity and excellent effect for light weight tendency.
    Type: Application
    Filed: October 8, 2021
    Publication date: June 9, 2022
    Inventors: Yen-Lin HUANG, Pei-Jung TSAI, Li-De WANG, Chun-Chieh WANG
  • Publication number: 20210370643
    Abstract: A multilayer plate with composite material and a method thereof are described. The multilayer plate includes an aluminum-based thin sheet and a composite material layer. The aluminum-based thin sheet includes a first passivation layer, an aluminum-based metal layer, and a second passivation layer sequentially. The aluminum-based thin sheet includes a first surface and a second surface opposite to the first surface. The first and second surfaces are set with micro holes. A diameter of the micro holes in the second surface is ranging from 0.5 ?m to 10 ?m. The composite material layer includes a thermoplastic polymer and a fiber material. The composite material layer has a third surface and a fourth surface opposite each other. The second surface is adjacent to or connected to the third surface. At least one portion of the thermoplastic polymer fills into the micro holes in the second surface.
    Type: Application
    Filed: April 8, 2021
    Publication date: December 2, 2021
    Inventors: Yen-Lin HUANG, Pei-Jung TSAI, Chi-Wah KEONG
  • Patent number: 10631400
    Abstract: A strain gauge driving piezoelectric device is disclosed. A piezoelectric element is arranged between a plurality of layers of first strain gauges correspondingly spaced from each other and a plurality of layers of second strain gauges correspondingly spaced from each other. The first strain gauges and the second strain gauges are arranged on different layers of the flexible circuit board. The first strain gauges and the second strain gauges generate a driving voltage according to variations of resistance values of the first strain gauges and the second strain gauges when a stress is applied to the flexible circuit board, and the driving voltage induces the piezoelectric effect of the piezoelectric element and then drives the piezoelectric element to generate an output voltage for haptic feedback.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: April 21, 2020
    Assignees: Interface Technology (Chengdu) Co., Ltd., Interface Optoelectronics (Shenzhen) Co., Ltd., General Interface Solution Limited
    Inventors: Pei-Jung Tsai, Yu-Chieh Tu
  • Patent number: 7871835
    Abstract: Disclosed is a method for packaging an LED by a thermoplastic copolymer. The copolymer is polymerized by 100 parts by weight of an acrylic ester, 0.1 to 30 parts by weight of a hydrogen bond monomer, and 0.1 to 70 parts by weight of a bulky monomer. The copolymer has transparency greater than 90%, thermal resistance greater than 130° C., and moisture absorption less than 0.5 wt %, such that the copolymer may be applied as packaging material for a light emitting device.
    Type: Grant
    Filed: April 3, 2009
    Date of Patent: January 18, 2011
    Assignees: Industrial Technology Research Institute, Topco Technologies Corp.
    Inventors: Shu-Ling Yeh, Ya-Lan Chuang, Pei-Jung Tsai, Chih-Hsiang Lin, Hsin-Ching Kao, Feng-Chih Chang, Tang-Jung Wu
  • Publication number: 20100047936
    Abstract: Disclosed is a method for packaging an LED by a thermoplastic copolymer. The copolymer is polymerized by 100 parts by weight of an acrylic ester, 0.1 to 30 parts by weight of a hydrogen bond monomer, and 0.1 to 70 parts by weight of a bulky monomer. The copolymer has transparency greater than 90%, thermal resistance greater than 130° C., and moisture absorption less than 0.5 wt %, such that the copolymer may be applied as packaging material for a light emitting device.
    Type: Application
    Filed: April 3, 2009
    Publication date: February 25, 2010
    Applicants: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Topco Technologies Corp.
    Inventors: Shu-Ling YEH, Ya-Lan CHUANG, Pei-Jung TSAI, Chih-Hsiang LIN, Hsin-Ching KAO, Feng-Chih CHANG, Tang-Jung WU