Patents by Inventor PEI-JYUN SU

PEI-JYUN SU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PRINTED CIRCUIT BOARD
    Publication number: 20130153272
    Abstract: A printed circuit board includes a top layer, a bottom layer, and a mounting hole vertically extending through the top layer and the bottom layer. A first copper ring is located on a top surface of the top layer and around the mounting hole. A second copper ring is located a bottom surface of the bottom layer and around the mounting hole. A number of first pads are positioned on the first copper ring. A number of second pads are positioned on the second copper ring. The first and second copper rings are covered with solder mask, but the first and second pads are not covered with the solder mask.
    Type: Application
    Filed: August 30, 2012
    Publication date: June 20, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: HSING-HUI CHIU, PEI-JYUN SU, SZE-YU LIN