Abstract: In semiconductor manufacturing, deionized (DI) water or another process fluid is flowed through a nonmetallic pipe and onto a semiconductor wafer. Static electric charge is discharged from the DI water or other process fluid flowing through the nonmetallic pipe via an electrically conductive material disposed on an outside of the nonmetallic pipe. The electrically conductive material disposed on the outside of the nonmetallic pipe is electrically grounded. The nonmetallic pipe may comprise fluoropolymer (PFA) based tubing. In some embodiments, the nonmetallic pipe includes: a PFA-NE pipe connected with a chamber or housing containing the wafer, and a second pipe connected with the PFA-NE pipe by a pipe connector, in which the second pipe is more electrically insulating than the PFA-NE pipe.

Abstract: In semiconductor manufacturing, deionized (DI) water or another process fluid is flowed through a nonmetallic pipe and onto a semiconductor wafer. Static electric charge is discharged from the DI water or other process fluid flowing through the nonmetallic pipe via an electrically conductive material disposed on an outside of the nonmetallic pipe. The electrically conductive material disposed on the outside of the nonmetallic pipe is electrically grounded. The nonmetallic pipe may comprise fluoropolymer (PFA) based tubing. In some embodiments, the nonmetallic pipe includes: a PFA-NE pipe connected with a chamber or housing containing the wafer, and a second pipe connected with the PFA-NE pipe by a pipe connector, in which the second pipe is more electrically insulating than the PFA-NE pipe.