Patents by Inventor Pei-Lien Tseng
Pei-Lien Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 12200875Abstract: A method for metallizing through-glass vias in a glass substrate includes functionalizing a surface of the glass substrate with a silane. The glass substrate has an average thickness t and comprises a plurality of vias extending through the thickness t. The method further includes applying an electroless plating solution comprising a copper ion to deposit a copper seed layer on the functionalized surface, disposing an electrolyte within the plurality of vias, wherein the electrolyte comprises copper ions to be deposited on the copper seed layer within the plurality of vias; positioning an electrode within the electrolyte; and applying a current between the electrode and the glass substrate, thereby reducing the copper ions into copper within the plurality of vias such that each of the plurality of vias is filled with copper and the copper has a void volume fraction of less than 5%.Type: GrantFiled: September 20, 2019Date of Patent: January 14, 2025Assignee: Industrial Technology Research InstituteInventors: Yiu-Hsiang Chang, Jen-Chieh Lin, Prantik Mazumder, Scott Christopher Pollard, Pei-Lien Tseng
-
Patent number: 11999135Abstract: Described herein are articles and methods of making articles, for example glass articles, comprising a thin sheet and a carrier, wherein the thin sheet and carrier are bonded together using a modification (coating) layer, for example a cationic polymer coating layer, and associated deposition methods, the carrier, or both, to control van der Waals, hydrogen and covalent bonding between the thin sheet and the carrier. The modification layer bonds the thin sheet and carrier together with sufficient bond strength to prevent delamination of the thin sheet and the carrier during high temperature (?600° C.) processing while also preventing formation of a permanent bond between the sheets during such processing.Type: GrantFiled: August 20, 2018Date of Patent: June 4, 2024Assignee: CORNING INCORPORATEDInventors: Kaveh Adib, Indrani Bhattacharyya, Pei-Chen Chiang, Hong-goo Choi, Dae youn Kim, Jen-Chieh Lin, Prantik Mazumder, Pei-Lien Tseng
-
Patent number: 11777067Abstract: Display tiles comprising pixel elements on a first surface of a substrate connected by an electrode, a driver located opposite the first surface, and a connector wrapped around an edge surface of the substrate connecting the driver to the pixel elements. Displays comprised of display tiles and methods of manufacturing display tiles and displays are also disclosed.Type: GrantFiled: March 17, 2022Date of Patent: October 3, 2023Assignee: Corning IncorporatedInventors: Jiangwei Feng, Sean Matthew Garner, Jen-Chieh Lin, Robert George Manley, Timothy James Orsley, Richard Curwood Peterson, Michael Lesley Sorensen, Pei-Lien Tseng, Rajesh Vaddi, Lu Zhang
-
Publication number: 20230294382Abstract: A functional laminated glass article includes: a backer substrate; a flexible glass substrate comprising a thickness of no greater than 300 ?m, and laminated to the backer substrate with an adhesive; a plurality of conductive traces disposed on one or both of the backer substrate and the flexible glass substrate; and a plurality of electronic device elements disposed between the backer substrate and the flexible glass substrate and in contact with the plurality of conductive traces. Further, the adhesive encapsulates the conductive traces and the electronic device elements between the backer substrate and the flexible glass substrate.Type: ApplicationFiled: June 25, 2021Publication date: September 21, 2023Inventors: Li-Wei Chou, Sean Matthew Garner, Jen-Chieh Lin, Pei-Lien Tseng
-
Patent number: 11629096Abstract: Described herein are articles and methods of making articles, for example glass articles, comprising a thin sheet and a carrier, wherein the thin sheet and carrier are bonded together using a modification (coating) layer, for example a coating layer comprising a cationic surfactant or a coating layer comprising an organic salt, and associated deposition methods. The modification layer bonds the thin sheet and carrier together with sufficient bond strength to prevent delamination of the thin sheet and the carrier during high temperature (? 500° C.) processing while also preventing formation of a permanent bond between the sheets during such processing.Type: GrantFiled: November 20, 2018Date of Patent: April 18, 2023Assignee: Corning IncorporatedInventors: Daniel Florian Acquard, Indrani Bhattacharyya, Sushmit Sunil Kumar Goyal, Prantik Mazumder, Pei-Lien Tseng
-
Publication number: 20220209087Abstract: Display tiles comprising pixel elements on a first surface of a substrate connected by an electrode, a driver located opposite the first surface, and a connector wrapped around an edge surface of the substrate connecting the driver to the pixel elements. Displays comprised of display tiles and methods of manufacturing display tiles and displays are also disclosed.Type: ApplicationFiled: March 17, 2022Publication date: June 30, 2022Inventors: JIANGWEI FENG, SEAN MATTHEW GARNER, JEN-CHIEH LIN, ROBERT GEORGE MANLEY, TIMOTHY JAMES ORSLEY, RICHARD CURWOOD PETERSON, MICHAEL LESLEY SORENSEN, PEI-LIEN TSENG, RAJESH VADDI, LU ZHANG
-
Publication number: 20220173296Abstract: Display tiles comprising pixel elements on a first surface of a substrate connected by an electrode, a driver located opposite the first surface, and a connector wrapped around an edge surface of the substrate connecting the driver to the pixel elements. Displays comprised of display tiles and methods of manufacturing display tiles and displays are also disclosed.Type: ApplicationFiled: February 18, 2022Publication date: June 2, 2022Inventors: JIANGWEI FENG, SEAN MATTHEW GARNER, JEN-CHIEH LIN, ROBERT GEORGE MANLEY, TIMOTHY JAMES ORSLEY, RICHARD CURWOOD PETERSON, MICHAEL LESLEY SORENSEN, PEI-LIEN TSENG, RAJESH VADDI, LU ZHANG
-
Patent number: 11282994Abstract: Display tiles comprising pixel elements on a first surface of a substrate connected by an electrode, a driver located opposite the first surface, and a connector wrapped around an edge surface of the substrate connecting the driver to the pixel elements. Displays comprised of display tiles and methods of manufacturing display tiles and displays are also disclosed.Type: GrantFiled: October 16, 2018Date of Patent: March 22, 2022Assignee: Corning IncorporatedInventors: Jiangwei Feng, Sean Matthew Garner, Jen-Chieh Lin, Robert George Manley, Timothy James Orsley, Richard Curwood Peterson, Michael Lesley Sorensen, Pei-Lien Tseng, Rajesh Vaddi, Lu Zhang
-
Publication number: 20210360797Abstract: A method for metallizing through-glass vias in a glass substrate includes functionalizing a surface of the glass substrate with a silane. The glass substrate has an average thickness t and comprises a plurality of vias extending through the thickness t. The method further includes applying an electroless plating solution comprising a copper ion to deposit a copper seed layer on the functionalized surface, disposing an electrolyte within the plurality of vias, wherein the electrolyte comprises copper ions to be deposited on the copper seed layer within the plurality of vias; positioning an electrode within the electrolyte; and applying a current between the electrode and the glass substrate, thereby reducing the copper ions into copper within the plurality of vias such that each of the plurality of vias is filled with copper and the copper has a void volume fraction of less than 5%.Type: ApplicationFiled: September 20, 2019Publication date: November 18, 2021Inventors: Yiu-Hsiang Chang, Jen-Chieh Lin, Prantik Mazumder, Scott Christopher Pollard, Pei-Lien Tseng
-
Publication number: 20200392040Abstract: Described herein are articles and methods of making articles, for example glass articles, comprising a thin sheet and a carrier, wherein the thin sheet and carrier are bonded together using a modification (coating) layer, for example a coating layer comprising a cationic surfactant or a coating layer comprising an organic salt, and associated deposition methods. The modification layer bonds the thin sheet and carrier together with sufficient bond strength to prevent delamination of the thin sheet and the carrier during high temperature (? 500° C.) processing while also preventing formation of a permanent bond between the sheets during such processing.Type: ApplicationFiled: November 20, 2018Publication date: December 17, 2020Inventors: Daniel Florian Acquard, Indrani Bhattacharyya, Sushmit Sunil Kumar Goyal, Prantik Mazumder, Pei-Lien Tseng
-
Patent number: 10809766Abstract: A glass element having a thickness from 25 ?m to 125 ?m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress ?I of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.Type: GrantFiled: December 15, 2017Date of Patent: October 20, 2020Assignee: Corning IncorporatedInventors: Polly Wanda Chu, Adam James Ellison, Timothy Michael Gross, Robert Bumju Lee, Jen-Chieh Lin, Chouhwan Moon, Pei-Lien Tseng
-
Publication number: 20200243738Abstract: Display tiles comprising pixel elements on a first surface of a substrate connected by an electrode, a driver located opposite the first surface, and a connector wrapped around an edge surface of the substrate connecting the driver to the pixel elements. Displays comprised of display tiles and methods of manufacturing display tiles and displays are also disclosed.Type: ApplicationFiled: October 16, 2018Publication date: July 30, 2020Applicant: CORNING INCORPORATEDInventors: JIANGWEI FENG, SEAN MATTHEW GARNER, JEN-CHIEH LIN, ROBERT GEORGE MANLEY, TIMOTHY JAMES ORSLEY, RICHARD CURWOOD PETERSON, MICHAEL LESLEY SORENSEN, PEI-LIEN TSENG, RAJESH VADDI, LU ZHANG
-
Publication number: 20200171799Abstract: Described herein are articles and methods of making articles, for example glass articles, comprising a thin sheet and a carrier, wherein the thin sheet and carrier are bonded together using a modification (coating) layer, for example a cationic polymer coating layer, and associated deposition methods, the carrier, or both, to control van der Waals, hydrogen and covalent bonding between the thin sheet and the carrier. The modification layer bonds the thin sheet and carrier together with sufficient bond strength to prevent delamination of the thin sheet and the carrier during high temperature (?600° C.) processing while also preventing formation of a permanent bond between the sheets during such processing.Type: ApplicationFiled: August 20, 2018Publication date: June 4, 2020Applicant: CORNING INCORPORATEDInventors: Kaveh Adib, Indrani Bhattacharyya, Pei-Chen Chiang, Hong-goo Choi, Dae youn Kim, Jen-Chieh Lin, Prantik Mazumder, Pei-Lien Tseng