Patents by Inventor Pei-Ling Li

Pei-Ling Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10381316
    Abstract: The disclosure relates to a semiconductor package device. The semiconductor package device includes a substrate having a first surface and a second surface opposite to the first surface and including a first conductive contact. The semiconductor package device further includes an electronic component disposed on the first surface of the substrate. The semiconductor package device further includes a metal frame disposed on the first surface of the substrate. The semiconductor package device further includes an antenna disposed on the metal frame, wherein the antenna is electrically isolated from the metal frame and electrically connected to the first conductive contact of the substrate.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: August 13, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chia-Liang Chung, Pei-Ling Li
  • Publication number: 20180331050
    Abstract: The disclosure relates to a semiconductor package device. The semiconductor package device includes a substrate having a first surface and a second surface opposite to the first surface and including a first conductive contact. The semiconductor package device further includes an electronic component disposed on the first surface of the substrate. The semiconductor package device further includes a metal frame disposed on the first surface of the substrate. The semiconductor package device further includes an antenna disposed on the metal frame, wherein the antenna is electrically isolated from the metal frame and electrically connected to the first conductive contact of the substrate.
    Type: Application
    Filed: May 10, 2017
    Publication date: November 15, 2018
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chia-Liang CHUNG, Pei-Ling LI
  • Publication number: 20150013759
    Abstract: A microcrystalline silicon solar cell structure and a manufacturing method thereof are revealed to comprise a substrate, a n-type semiconductor layer deposited on the substrate, an intrinsic layer deposited on n-type semiconductor layer and a p-type semiconductor layer deposited on the intrinsic layer and a transparent conductive oxide layer on the p-type semiconductor layer, wherein the intrinsic layer also acts as a major light-absorbing layer of the microcrystalline silicon solar cell by doping 8˜12 vppm p-type ions of the group III element therein, which enables to modify the intrinsic layer with slight n type to improve the conversion efficiency of a battery.
    Type: Application
    Filed: June 20, 2014
    Publication date: January 15, 2015
    Inventors: Chie Gau, Yeu-Long Jiang, Pei-Ling Li