Abstract: A package for semiconductor is disclosed. It comprises four major related parts: semiconductor chips, solder layer, conductive element, and encapsulation body, especially refer to a leadless DIP (dual-in-line package) or SIP (single-in-line package). The conductive elements and bonding contacts are part of the lead frame. Each of the conductive elements is composed of three connected portions, including terminal, bridging lead and bonding contact(s). A connecting bridge is made in between each two terminals. Thus all conductive elements are linked and associated to the frame of the lead frame and the master strip. Apply solder paste and attach semiconductor chip(s). Form the unit into U shape and make the upper contact(s) attaching the bonding pad(s) of semiconductor(s). Re-flow the solder paste to form solid joints. Adhere tape to seal the openings in between terminals. The in-line units thus form a subassembly piece with a U-shape-like trough.