Abstract: In an embodiment, a device includes: a package component including: integrated circuit dies; an encapsulant around the integrated circuit dies; a redistribution structure over the encapsulant and the integrated circuit dies, the redistribution structure being electrically coupled to the integrated circuit dies; sockets over the redistribution structure, the sockets being electrically coupled to the redistribution structure; and a support ring over the redistribution structure and surrounding the sockets, the support ring being disposed along outermost edges of the redistribution structure, the support ring at least partially laterally overlapping the redistribution structure.

Abstract: A stacked package structure and a manufacturing method thereof are provided. The stacked package structure includes an upper redistribution layer, a first chip, and an upper molding layer. The first chip is disposed on the upper redistribution layer and is electrically connected to the upper redistribution layer. The upper molding layer is disposed on the first chip and the upper redistribution layer, and is configured to package the first chip. The upper molding layer includes a recess, the recess is recessed relative to a surface of the upper molding layer away from the upper redistribution layer, and the recess is circumferentially formed around a periphery of the upper molding layer.

Abstract: A transconductor to convert an input voltage to an output current, includes: a primary transconductance stage to provide the output current from the input voltage and a driving current; an adaptive transconductance stage coupled in series with the primary transconductance stage to generate the driving current from the input voltage; and a bias circuit coupled to provide a primary bias voltage to the primary transconductance stage and an adaptive bias voltage to the adaptive transconductance stage.

Abstract: A transconductor to convert an input voltage to an output current, includes: a primary transconductance stage to provide the output current from the input voltage and a driving current; an adaptive transconductance stage coupled in series with the primary transconductance stage to generate the driving current from the input voltage; and a bias circuit coupled to provide a primary bias voltage to the primary transconductance stage and an adaptive bias voltage to the adaptive transconductance stage.