Abstract: A land grid array socket (1) in accordance with the present invention is provided. The socket comprises an insulative housing (2) having a plurality of passageways (24) extending throughout an upper mating surface (22) and a lower mounting surface (20). A plurality of electrical terminals (3) are received in corresponding passageways, each terminal comprises a first part (32) having a first spring arm (322) extending out of the upper mating surface for electrically connected to an IC chip (4) and a second spring arm (306) extending out of the lower mounting surface for electrically connected to a motherboard (5). The first part and the second part are accommodated in a same passageway and separate from each other while interconnected by a third spring arm (304) settled therebetween.

Abstract: A land grid array socket (1) in accordance with the present invention is provided. The socket comprises an insulative housing (2) having a plurality of passageways (24) extending throughout an upper mating surface (22) and a lower mounting surface (20). A plurality of electrical terminals (3) are received in corresponding passageways, each terminal comprises a first part (32) having a first spring arm (322) extending out of the upper mating surface for electrically connected to an IC chip (4) and a second spring arm (306) extending out of the lower mounting surface for electrically connected to a motherboard (5). The first part and the second part are accommodated in a same passageway and separate from each other while interconnected by a third spring arm (304) settled therebetween.

Abstract: A dual band slot antenna (1) for an electronic device includes an antenna body (10) with elongated first and second slots (11, 12) defined therein and a coaxial feeder cable (20) having a conductive inner core wire (21) and a conductive outer shield (22). The inner core wire is electrically connected to the antenna body at an outer side of the first slot 11 and the outer shield is electrically connected to the antenna body at an opposite, outer side of the second slot. The coaxial cable acts as a common feed line of the first and second slots.

Abstract: A dual band slot antenna (1) for an electronic device includes an antenna body (10) with elongated first and second slots (11, 12) defined therein and a coaxial feeder cable (20) having a conductive inner core wire (21) and a conductive outer shield (22). The inner core wire is electrically connected to the antenna body at an outer side of the first slot 11 and the outer shield is electrically connected to the antenna body at an opposite, outer side of the second slot. The coaxial cable acts as a common feed line of the first and second slots.

Abstract: A high current capacity socket (1) includes a base (10) and a number of side contacts (20). The base includes a bottom plate (100), a pair of sidewalls (101) extending upwardly from opposite sides of the bottom plate. A number of passageways (102) are defined in the bottom plate and corresponding terminals (11) are received in the passageways. A receiving room (104) is defined in the center of the bottom plate. The side contacts are fixed in the sidewall (101) of the base (10) to transmit current to a printed circuit board or grounded to reduce the dimension of an integrated circuit package that is received in the receiving room.

Abstract: A high current capacity socket (1) for connecting with an IC package (5) includes a base (10) with a number of side contacts (40) disposed at a side thereof, a cover (20) movably mounted on the base and defining a number of channels (24) therein, and an actuation mechanism for actuating the side contacts to releasably engage with current/grounding conductors (54) of the IC package. The actuation mechanism includes a lever (31), a number of projections (32) formed on the side contacts, and a number of embossments (34) formed on the cover and extending into the channels.

Abstract: A high current capacity socket (1) comprises a base (10) and a number of side contacts (20). The base includes a bottom plate (100), a pair of sidewalls (101) extending upwardly from opposite sides of the bottom plate. A number of passageways (102) are defined in the bottom plate and corresponding terminals (11) are received in the passageways. A receiving room (104) is defined in the center of the bottom plate. The side contacts are fixed in the sidewall (101) of the base (10) to transmit current to a printed circuit board or grounded to reduce the dimension of an integrated circuit package that is received in the receiving room.