Abstract: The embodiments described herein are directed to a method for reducing fin oxidation during the formation of fin isolation regions. The method includes providing a semiconductor substrate with an n-doped region and a p-doped region formed on a top portion of the semiconductor substrate; epitaxially growing a first layer on the p-doped region; epitaxially growing a second layer different from the first layer on the n-doped region; epitaxially growing a third layer on top surfaces of the first and second layers, where the third layer is thinner than the first and second layers. The method further includes etching the first, second, and third layers to form fin structures on the semiconductor substrate and forming an isolation region between the fin structures.

Abstract: The embodiments described herein are directed to a method for reducing fin oxidation during the formation of fin isolation regions. The method includes providing a semiconductor substrate with an n-doped region and a p-doped region formed on a top portion of the semiconductor substrate; epitaxially growing a first layer on the p-doped region; epitaxially growing a second layer different from the first layer on the n-doped region; epitaxially growing a third layer on top surfaces of the first and second layers, where the third layer is thinner than the first and second layers. The method further includes etching the first, second, and third layers to form fin structures on the semiconductor substrate and forming an isolation region between the fin structures.

Abstract: A fingerprint identification module test system includes a light source, a projection surface, a low-end image pickup device and a judgment module. The light source emits and projects a light beam onto an under-test fingerprint identification module. After the light beam is reflected by the under-test fingerprint identification module and projected onto the projection surface, a projected image is formed on the projection surface. Then, the low-end image pickup device photographs the projected image to acquire an under-test corresponding to the under-test fingerprint identification module. According to the result of comparing the under-test image with the predetermined image, the judgment module judges whether the under-test fingerprint identification module complies with the production specifications. Since the fingerprint identification module test system uses parity devices to test the under-test fingerprint identification module, the fingerprint identification module test system is cost-effective.