Patents by Inventor Pei-Nong Lu

Pei-Nong Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Forming method of via hole and manufacturing method of pixel structure
    Patent number: 10256261
    Abstract: The invention provides a forming method of a via hole, including: sequentially stacking a patterned first conductive layer, a first insulating layer, a patterned second conductive layer, and a second insulating layer on a substrate. The second conductive layer and the first conductive layer overlap in a normal direction of the substrate, such that the second insulating layer has a protrusion portion protruding away from the substrate. A photosensitive material layer covers the second insulating layer. The photosensitive material layer is exposed, wherein a depth of exposure is equal to a vertical distance from a top surface of the protrusion portion to a surface of the photosensitive material layer. The exposed photosensitive material layer is removed by development to form a first via hole exposing the second insulating layer. The exposed second insulating layer is etched to form a second via hole to expose the second conductive layer, and then the photosensitive material layer is removed.
    Type: Grant
    Filed: October 20, 2017
    Date of Patent: April 9, 2019
    Assignee: Chunghwa Picture Tubes, LTD.
    Inventors: Chin-Tzu Kao, Chien-Pang Tai, Pei-Nong Lu
  • FORMING METHOD OF VIA HOLE AND MANUFACTURING METHOD OF PIXEL STRUCTURE
    Publication number: 20190057987
    Abstract: The invention provides a forming method of a via hole, including: sequentially stacking a patterned first conductive layer, a first insulating layer, a patterned second conductive layer, and a second insulating layer on a substrate. The second conductive layer and the first conductive layer overlap in a normal direction of the substrate, such that the second insulating layer has a protrusion portion protruding away from the substrate. A photosensitive material layer covers the second insulating layer. The photosensitive material layer is exposed, wherein a depth of exposure is equal to a vertical distance from a top surface of the protrusion portion to a surface of the photosensitive material layer. The exposed photosensitive material layer is removed by development to form a first via hole exposing the second insulating layer. The exposed second insulating layer is etched to form a second via hole to expose the second conductive layer, and then the photosensitive material layer is removed.
    Type: Application
    Filed: October 20, 2017
    Publication date: February 21, 2019
    Applicant: Chunghwa Picture Tubes, LTD.
    Inventors: Chin-Tzu Kao, Chien-Pang Tai, Pei-Nong Lu