Patents by Inventor Pei Ooi

Pei Ooi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF MAKING SEMICONDUCTOR PACKAGE WITH REDUCED MOISTURE SENSITIVITY
    Publication number: 20070092996
    Abstract: A method of making a semiconductor package (10) includes placing an integrated circuit (IC) die (12) on a first side (14) of a substrate (16) and electrically connecting the IC die (12) to the first side (14) of the substrate (16). First solder balls (22) are attached to a second side (24) of the substrate (16). An interposer (28) is attached to the IC die (12). A molding operation is performed to encapsulate the IC die (12), the substrate (16), at least a portion of the interposer (28) and at least a portion of the first solder balls (22).
    Type: Application
    Filed: October 20, 2006
    Publication date: April 26, 2007
    Applicant: Freescale Semiconductor, Inc.
    Inventors: Wai Lo, Pei Ooi