Abstract: A flat type heat pipe device includes a packaging unit and a bonding member. The packaging unit further includes a first shell member and a second shell member. The first shell member has a work zone, a first joining part surrounding the work zone and an upright stop part disposed between the work zone and the joining part. The second shell member provides a shape corresponding to the first shell member to cover the first shell member and has a shell lid part spacing apart from the work zone and a second joining part disposed on the first joining part. The bonding member is disposed between the first joining part and the second joining part to adhere the first joining part to the second joining part. When the first shell member is pressingly fit with second shell member, the stop part is capable of preventing the bonding member from entering the packaging unit.

Abstract: A manufacturing system for processing a container body into a heat dissipating device includes: a support for supporting the container body thereon; an elastically deformable member covering a periphery of an opening in an upper wall of the container body and defining a cavity in fluid communication with interior of the container body through the opening; a vacuuming device connected to the elastically deformable member for vacuuming the inner space; a working fluid-loading device connected to the elastically deformable member for filling a predetermined amount of the working fluid into the container body; a depressing device including opposite upper and lower pressing members; and a driving mechanism for driving movement of at least one of the upper and lower pressing members.

Abstract: A heat dissipating device includes: a container body defining an inner space therein and having a fluid passage and opposite upper and lower walls; a working fluid received in the inner space in the container body; a wick structure mounted in the inner space; and a sealing material that seals the fluid passage of the container body. One of the upper and lower walls has a wall portion that is disposed adjacent to the fluid passage and that is depressed in such a manner that the depressed wall portion cooperates with the other of the upper and lower walls to form a sealing mechanism that functions to isolate the fluid passage from the inner space.

Abstract: A method for making a heat dissipating device includes the steps of: mounting an elastically deformable member on a container body in such a manner that the elastically deformable member covers a periphery of an opening in the container body and that the elastically deformable member cooperates with the container body to define a cavity in fluid communication with an inner space in the container body through the opening; vacuuming the inner space in such a manner that air in the inner space is drawn through the opening and the cavity to the outside of the container body; filling the inner space with a predetermined amount of a working fluid through the opening and the cavity; and forming a sealing mechanism that functions to isolate the inner space from the opening.

Abstract: A method for making a heat dissipating device includes the steps of: preparing a container body that has a fluid passage and opposite upper and lower walls, the fluid passage being in fluid communication with an inner space in the container body; vacuuming the inner space through the fluid passage; filling the inner space with a predetermined amount of a working fluid through the fluid passage; and depressing a wall portion of a selected one of the upper and lower walls in such a manner that the depressed wall portion is deformed toward the other of the upper and lower walls so as to form a depression in the selected one of the upper and lower walls, and so as to form a sealing mechanism that functions to isolate the fluid passage from the inner space.

Abstract: A flat type heat pipe device includes a packaging unit and a bonding member. The packaging unit further includes a first shell member and a second shell member. The first shell member has a work zone, a first joining part surrounding the work zone and an upright stop part disposed between the work zone and the joining part. The second shell member provides a shape corresponding to the first shell member to cover the first shell member and has a shell lid part spacing apart from the work zone and a second joining part disposed on the first joining part. The bonding member is disposed between the first joining part and the second joining part to adhere the first joining part to the second joining part. When the first shell member is pressingly fit with second shell member, the stop part is capable of preventing the bonding member from entering the packaging unit.

Abstract: A method for making a plate type heat pipe includes the steps of: stacking a wick structure on a first plate, the wick structure defining a plurality of capillaries; high frequency welding the wick structure to the first plate; stacking a second plate on the wick structure; and connecting hermetically peripheral edges of the first and second plates together so as to form an enclosed cavity between the first and second plates for enclosing the wick structure.

Abstract: A method for making a plate type heat pipe includes following steps: (A) providing a metallic hollow casing unit, which includes a first casing member with a first joining part at the periphery thereof and a second casing member with a second joining part at the periphery thereof corresponding to and matching the first joining part to form a containing space, and an injection part being arranged at one of the casing members for the containing space communicating with outside; (B) forming a bonding layer on a surface of at least one of the joining parts facing the other one of the joining parts with a treatment of gas phase deposit; and (C) the first joining part being disposed on the second joining part and being heated up to melt the bonding layer. The bonding layer is adhered to the second joining part with consistent thickness to allow the first joining part engaging with the second joining part air-tightly.

Abstract: A method of making a microstructure includes the steps of providing a circuit board that includes a dielectric layer and a conductor layer formed on the dielectric layer, forming a metal structure on the circuit board such that the metal structure extends through the dielectric layer, and removing at least a portion of the dielectric layer adjacent to the conductor layer and the metal structure to result in the microstructure.

Abstract: A heat dissipating microdevice is made from comprising the steps of: a board including an insulator layer having a first and facing second surfaces and a conductor layer on the first surface by forming in the layer a hole that extends between the surfaces to form a fluid microsystem including: first and second micro-channel structures disposed respectively in first and second areas of the board and bounded by the layer, and first and second micro-conduit structures that permit fluid communication between the micro-channel structures. The first micro-conduit structure has a first end in fluid communication with the second micro-channel structure and a second end section in fluid communication with the first micro-channel structure. The second micro-conduit structure has a first end section in fluid communication with the first micro-channel structure and a second end section in fluid communication with the second micro-channel structure. A cover is put on the second surface.

Abstract: A manufacturing system for processing a container body into a heat dissipating device includes: a support for supporting the container body thereon; an elastically deformable member covering a periphery of an opening in an upper wall of the container body and defining a cavity in fluid communication with interior of the container body through the opening; a vacuuming device connected to the elastically deformable member for vacuuming the inner space; a working fluid-loading device connected to the elastically deformable member for filling a predetermined amount of the working fluid into the container body; a depressing device including opposite upper and lower pressing members; and a driving mechanism for driving movement of at least one of the upper and lower pressing members.

Abstract: A method for making a heat dissipating device includes the steps of: preparing a container body that has a fluid passage and opposite upper and lower walls, the fluid passage being in fluid communication with an inner space in the container body; vacuuming the inner space through the fluid passage; filling the inner space with a predetermined amount of a working fluid through the fluid passage; and depressing a wall portion of a selected one of the upper and lower walls in such a manner that the depressed wall portion is deformed toward the other of the upper and lower walls so as to form a depression in the selected one of the upper and lower walls, and so as to form a sealing mechanism that functions to isolate the fluid passage from the inner space.

Abstract: A method for making a heat dissipating device includes the steps of: mounting an elastically deformable member on a container body in such a manner that the elastically deformable member covers a periphery of an opening in the container body and that the elastically deformable member cooperates with the container body to define a cavity in fluid communication with an inner space in the container body through the opening; vacuuming the inner space in such a manner that air in the inner space is drawn through the opening and the cavity to the outside of the container body; filling the inner space with a predetermined amount of a working fluid through the opening and the cavity; and forming a sealing mechanism that functions to isolate the inner space from the opening.

Abstract: A heat dissipating device includes: a container body defining an inner space therein and having a fluid passage and opposite upper and lower walls; a working fluid received in the inner space in the container body; a wick structure mounted in the inner space; and a sealing material that seals the fluid passage of the container body. One of the upper and lower walls has a wall portion that is disposed adjacent to the fluid passage and that is depressed in such a manner that the depressed wall portion cooperates with the other of the upper and lower walls to form a sealing mechanism that functions to isolate the fluid passage from the inner space.

Abstract: A heat dissipating microdevice includes a board, a fluid microsystem, and a coolant. The board includes an insulator layer that has first and second surfaces, a conductor layer formed on the first surface, and a cover member disposed on the second surface. The fluid microsystem is formed in the insulator layer of the board, and includes first and second micro-channel structures, and first and second micro-conduit structures that permit fluid communication between the first and second micro-channel structures. The coolant is contained in the fluid microsystem, and flows from the second micro-channel structure to the first micro-channel structure through the first micro-conduit structure, and from the first micro-channel structure back to the second micro-channel structure through the second micro-conduit structure.

Abstract: A heat dissipating microdevice includes a board, a fluid microsystem, and a coolant. The board includes an insulator layer that has first and second surfaces, a conductor layer formed on the first surface, and a cover member disposed on the second surface. The fluid microsystem is formed in the insulator layer of the board, and includes first and second micro-channel structures, and first and second micro-conduit structures that permit fluid communication between the first and second micro-channel structures. The coolant is contained in the fluid microsystem, and flows from the second micro-channel structure to the first micro-channel structure through the first micro-conduit structure, and from the first micro-channel structure back to the second micro-channel structure through the second micro-conduit structure.

Abstract: A method of making a microstructure includes the steps of providing a circuit board that includes a dielectric layer and a conductor layer formed on the dielectric layer, forming a metal structure on the circuit board such that the metal structure extends through the dielectric layer, and removing at least a portion of the dielectric layer adjacent to the conductor layer and the metal structure to result in the microstructure.