Patents by Inventor Pei Pei Kong

Pei Pei Kong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of electrically isolating shared leads of a lead frame strip
    Patent number: 9324642
    Abstract: A lead frame strip includes a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame. A semiconductor die is attached to the die paddles. A molding compound covers the unit lead frames, including the semiconductor dies. Prior to testing or other processing of the lead frame strip, a gap is etched into a region of the leads which are shared by adjacent ones of the unit lead frames. The gap extends at least mostly through the shared leads. A partial cut is made in the molding compound around the periphery of the unit lead frames prior to the subsequent processing, including below the gap in the shared leads, to electrically isolate the leads of the unit lead frames.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: April 26, 2016
    Assignee: Infineon Technologies AG
    Inventors: Frank Püschner, Bernhard Schätzler, Teck Sim Lee, Franz Gabler, Pei Pei Kong, Boon Huat Lim
  • Method of Electrically Isolating Shared Leads of a Lead Frame Strip
    Publication number: 20150130037
    Abstract: A lead frame strip includes a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame. A semiconductor die is attached to the die paddles. A molding compound covers the unit lead frames, including the semiconductor dies. Prior to testing or other processing of the lead frame strip, a gap is etched into a region of the leads which are shared by adjacent ones of the unit lead frames. The gap extends at least mostly through the shared leads. A partial cut is made in the molding compound around the periphery of the unit lead frames prior to the subsequent processing, including below the gap in the shared leads, to electrically isolate the leads of the unit lead frames.
    Type: Application
    Filed: November 12, 2013
    Publication date: May 14, 2015
    Inventors: Frank Püschner, Bernhard Schätzler, Teck Sim Lee, Franz Gabler, Pei Pei Kong, Boon Huat Lim