Abstract: An etch-resistant composition is provided. The etch-resistant composition comprises a polymer and a first organic solvent. The polymer is prepared by copolymerizing a polymerization unit comprising styrene-based monomer(s) and acrylate-based monomer(s), and has a weight average molecular weight of at least about 35,000. Based on the total weight of the etch-resistant composition, the amount of the polymer is about 20.0 to about 60.0 wt % and the amount of the solvent is about 40.0 to about 80.0 wt %. The etch-resistant composition can be used for preparing a selective emitter of a solar cell.

Abstract: A label includes a protective layer, an adhesive layer formed on the protective layer, and a number of bearing particles dispersed in the adhesive layer. Each resisting particle includes an elastic shell filled with adhesive. The shell defines a number of through holes. The adhesive can flow into the adhesive layer via the through holes under stress.

Abstract: An anisotropic conductive film includes a base board and an insulation adhesive layer coated on a side surface of the base board. The insulation adhesive layer includes a plurality of conductive particles dispersed in the insulation adhesive layer. Each of the plurality of conductive particles includes a spherical base portion, a conductive film formed on the spherical base portion, and an insulation layer with ceramic materials formed on the conductive film. The insulation layer defines a plurality of holes, thus the insulation layer is porous, the insulation layer is capable of being partly exposed from the plurality of holes when the plurality of conductive particles is pressed. A method for manufacturing the anisotropic conductive film is also provided.

Abstract: An adhesive tape is disclosed. The adhesive tape includes a protective layer, an adhesive layer formed on the protective layer, and a plurality of bearing particles dispersed in the adhesive layer. The bearing particles are hollow and elastic. An impact resistance of the adhesive tape is improved, and an adhering performance is improved.

Abstract: An adhesive tape is disclosed. The adhesive tape includes a protective layer, an adhesive layer formed on the protective layer, and a plurality of bearing particles dispersed in the adhesive layer. The bearing particle is hollow, and includes an elastic shell and a filling body received in the elastic shell. The elastic shell defines a plurality of through holes. The filling body is adhesive. An impact resistance of the adhesive tape is improved, and an adhering performance is improved.

Abstract: A masking method used in a surface treating process is disclosed. The masking method includes the following steps: preparing paint, coating the paint on inner surfaces of a hole in a workpiece, and curing the paint, thereby forming a protection coating layer on the inner surfaces of the hole to protect the inner surfaces of the hole during a surface treatment process. The paint is resistant to the surface treatment process, and includes resin and solvent. A surface tension of the paint is smaller than or equal to 22 mN/m.

Abstract: A masking method for a surface treating process provides an injector filled with infilling material and injecting the infilling material in holes having any shape or size or irregularity in a workpiece. The infilling material is cured to form a protective plug in the hole. The infilling material includes resin resistant to the surface treating process. The infilling material overfills the hole and partly protrudes out from the hole. The protective plug adheres to every inner surface of the hole to protect the inner surfaces of the hole from the surface treating process. Gripping and pulling on the partial protrusion of the protective plugs, that are formed from the cured resin, from the hole elastically reduces the original girth or diameter of the infilling material in the hole to allow easier physical removal.

Abstract: An adhesive tape making equipment, includes a coating roll, a spraying member, and a plurality of transporting rolls. A first adhesive is coated on the coating roll. A second adhesive is placed in the spraying member. An adhesive force of the first adhesive is higher than an adhesive force of the second adhesive. The coating roll and the spraying member are located between the plurality of transporting rolls. A method of making the adhesive tape is further provided.

Abstract: A method of synthesizing an acrylic polymer used for a pressure sensitive adhesive includes steps as follows: polymerizing one or more acrylic monomers in the presence of a first initiator to obtain an acrylic prepolymer; and polymerizing the acrylic prepolymer and one or more silane coupling agents in the presence of a second initiator to obtain the acrylic polymer.

Abstract: An anisotropic conductive film includes a base board and an insulation adhesive layer coated on a side surface of the base board. The insulation adhesive layer includes a plurality of conductive particles dispersed in the insulation adhesive layer. Each of the plurality of conductive particles includes a spherical base portion, a conductive film formed on the spherical base portion, and an insulation layer with ceramic materials formed on the conductive film. When the conductive particle is being pressed, the insulation layer is capable of being peeled to partly expose the conductive layer. A method for manufacturing the anisotropic conductive film is also provided.

Abstract: An etch-resistant composition is provided. The etch-resistant composition comprises a polymer and a first organic solvent. The polymer is prepared by copolymerizing a polymerization unit comprising styrene-based monomer(s) and acrylate-based monomer(s), and has a weight average molecular weight of at least about 35,000. Based on the total weight of the etch-resistant composition, the amount of the polymer is about 20.0 to about 60.0 wt % and the amount of the solvent is about 40.0 to about 80.0 wt %. The etch-resistant composition can be used for preparing a selective emitter of a solar cell.