Abstract: A humanized anti-neurotensin receptor 1 (NTSR1) antibody or an antigen-binding fragment thereof. Also, a method for treating, prophylactic treating and/or preventing diseases and/or disorders caused by or related to NTSR1 activity and/or signaling, and a method or kit for detecting NTSR1 in a sample.

Abstract: A humanized anti-neurotensin receptor 1 (NTSR1) antibody or an antigen-binding fragment thereof. Also, a method for treating, prophylactic treating and/or preventing diseases and/or disorders caused by or related to NTSR1 activity and/or signaling, and a method or kit for detecting NTSR1 in a sample.

Abstract: The present invention provides a fusion protein, comprising a chemokine polypeptide, which is a chemokine or a receptor binding domain thereof; and a cytokine polypeptide connected to said chemokine polypeptide, which is an interleukin, a TNF-superfamily cytokine or a receptor-binding domain thereof; wherein the chemokine polypeptide and the cytokine polypeptide have a common target cell, and the fusion protein has an improved chemokine activity as compared to the chemokine polypeptide, and an improved cytokine activity as compared to the cytokine polypeptide.

Abstract: An isolated antibody, comprising: a heavy chain variable domain (VH) that is at least 75% identical to the amino acid sequence of SEQ ID NO: 1; and a light chain variable domain (VL) that is at least 75% identical to the amino acid sequence of SEQ ID NO: 2; wherein the antibody binds specifically to human neurotensin receptor 1 (hNTSR1).

Abstract: A micro light-emitting device includes an epitaxial structure, a first electrode, a second electrode and a conductive layer. The epitaxial structure includes a first-type semiconductor layer, a light-emitting layer, and a second-type semiconductor layer. The first-type semiconductor layer includes a first portion and a second portion. A bottom area of the first portion is smaller than a top area of the second portion. A thickness of the second portion is greater than 10% of a thickness of the first-type semiconductor layer. The first electrode is disposed on the epitaxial structure and located on the first portion of the first-type semiconductor layer. The second electrode is disposed on the epitaxial structure. The conductive layer is disposed between the first electrode and the first portion, wherein an orthographic projection area of the conductive layer on the first portion is greater than or equal to 90% of an area of the first portion.

Abstract: The present invention provides a fusion protein, comprising a chemokine polypeptide, which is a chemokine or a receptor binding domain thereof; and a cytokine polypeptide connected to said chemokine polypeptide, which is an interleukin, a TNF-superfamily cytokine or a receptor-binding domain thereof; wherein the chemokine polypeptide and the cytokine polypeptide have a common target cell, and the fusion protein has an improved chemokine activity as compared to the chemokine polypeptide, and an improved cytokine activity as compared to the cytokine polypeptide.

Abstract: The present invention provides a fusion protein, comprising a chemokine polypeptide, which is a chemokine or a receptor binding domain thereof; and a cytokine polypeptide connected to said chemokine polypeptide, which is an interleukin, a TNF-superfamily cytokine or a receptor-binding domain thereof; wherein the chemokine polypeptide and the cytokine polypeptide have a common target cell, and the fusion protein has an improved chemokine activity as compared to the chemokine polypeptide, and an improved cytokine activity as compared to the cytokine polypeptide.

Abstract: A bonding apparatus includes a wafer stage, a first chip stage, a first chip transporting device, a second stage and a second chip transporting device. The wafer stage is used for holding a wafer. The first chip stage is used for holding at least one first chip. The first chip transporting device is used for transporting the first chip from the first chip stage onto the wafer. The second chip stage is used for holding at least one second chip. The second chip transporting device is used for transporting the second chip from the second chip stage onto the wafer.

Abstract: An eccentric oscillating speed reducer includes: first and second external gears, each having shaft penetration holes in respective circumferences thereof; eccentric shafts, having first and second crank portions passing through the shaft penetration holes, with the first and second external gears furnished on the first and second crank portions, respectively; a supporting member inserted through a first shaft penetration hole of the first external gear and a second shaft penetration hole of the second external gear, and being in eccentric contact with inner peripheries of the shaft penetration holes; first and second output portions, each having shaft penetration holes on respective circumferences thereof, with both ends of an axis of each of the eccentric shafts furnished in the shaft penetration holes, and the first and second output portion being connected by the supporting member; and an annular gear engaged with the first and second external gears.

Abstract: An eccentric oscillating speed reducer includes: first and second external gears, each having shaft penetration holes in respective circumferences thereof; eccentric shafts, having first and second crank portions passing through the shaft penetration holes, with the first and second external gears furnished on the first and second crank portions, respectively; a supporting member inserted through a first shaft penetration hole of the first external gear and a second shaft penetration hole of the second external gear, and being in eccentric contact with inner peripheries of the shaft penetration holes; first and second output portions, each having shaft penetration holes on respective circumferences thereof, with both ends of an axis of each of the eccentric shafts furnished in the shaft penetration holes, and the first and second output portion being connected by the supporting member; and an annular gear engaged with the first and second external gears.

Abstract: The present invention provides a fusion protein, comprising a chemokine polypeptide, which is a chemokine or a receptor binding domain thereof; and a cytokine polypeptide connected to said chemokine polypeptide, which is an interleukin, a TNF-superfamily cytokine or a receptor-binding domain thereof; wherein the chemokine polypeptide and the cytokine polypeptide have a common target cell, and the fusion protein has an improved chemokine activity as compared to the chemokine polypeptide, and an improved cytokine activity as compared to the cytokine polypeptide.

Abstract: A rotary positioning apparatus includes a fixing base, a rotation mechanism, two driving modules and a carrier. The rotation mechanism is disposed on the fixing base, the first driving module is disposed on the fixing base and coupled to the rotation mechanism to drive the rotation mechanism rotating around a first rotation axis relatively to the fixing base. The carrier has plural accommodating slots on a circular-arc surface thereof and is pivoted to the rotation mechanism through a second rotation axis passing through the curvature center of the circular-arc surface and perpendicular to the first rotation axis, on which the curvature center is located. The second driving module is disposed on the rotation mechanism and coupled to the carrier to drive the carrier rotating around the second rotation axis relatively to the rotation mechanism. An automatic pick-and-place system and an operation method using the rotary positioning apparatus are also provided.

Abstract: A bonding apparatus includes a wafer stage, a first chip stage, a first transporting device, a second stage and a second transporting device. The wafer stage is used for holding a wafer. The first chip stage is used for holding at least one first chip. The first transporting device is used for transporting the first chip from the first chip stage onto the wafer. The second chip stage is used for holding at least one second chip. The second transporting device is used for transporting the second chip from the second chip stage onto the wafer.

Abstract: A rotatable locating apparatus including a fixing base, a rotatable rack, a first driving module, a carrier, and a second driving module is provided. The rotatable rack is pivoted on the fixing base through a first rotation axis. The first driving module is coupled to the rotatable rack to drive the rotatable rack rotating with respect to the fixing base along the first rotation axis. The carrier is provided with accommodating slots on an arc surface of the carrier, and the carrier is pivoted on the rotatable rack through a second rotation axis. The second rotation axis passes through a curvature center of the arc surface and is perpendicular to the first rotation axis. The curvature center is located on the first rotation axis. The second driving module is coupled to the carrier to drive the carrier rotating with respect to the rotatable rack along the second rotation axis.

Abstract: A rotary positioning apparatus includes a fixing base, a rotation mechanism, two driving modules and a carrier. The rotation mechanism is disposed on the fixing base, the first driving module is disposed on the fixing base and coupled to the rotation mechanism to drive the rotation mechanism rotating around a first rotation axis relatively to the fixing base. The carrier has plural accommodating slots on a circular-arc surface thereof and is pivoted to the rotation mechanism through a second rotation axis passing through the curvature center of the circular-arc surface and perpendicular to the first rotation axis, on which the curvature center is located. The second driving module is disposed on the rotation mechanism and coupled to the carrier to drive the carrier rotating around the second rotation axis relatively to the rotation mechanism. An automatic pick-and-place system and an operation method using the rotary positioning apparatus are also provided.

Abstract: A cathode discharge device is provided. The cathode discharge apparatus includes an anode, a cathode and plural cathode chambers. The cathode is located inside the anode, where the cathode has plural flow channels and at least one flow channel hole, and the plural flow channels are connected to one another through the flow channel hole. The plural cathode chambers are located inside the cathode, wherein each of the cathode chambers has a chamber outlet and a chamber inlet connected with at least one of the flow channels.

Abstract: A plasma processing apparatus is disclosed, which includes: a cathode module comprising a plurality of first channels which generate plasma; an anode having a chamber which contains the cathode and having at least one plasma outlet corresponding to the first channels; an electrode connected to a high-frequency electrical power and the cathode; and a plurality of second channels penetrating through the anode; wherein each first channel and each second channel are disposed alternately. A first gas is introduced into the first channels ionized under high frequency electrical power. In the first channels, the free electrons collided brings high density of plasma. The generated plasma is expelled through the plasma outlet to form a plasma diffusion region. A second gas is introduced into the plasma diffusion region through the second channels to take part in the reaction of plasma.

Abstract: A vacuum apparatus of rotary motion entry is disclosed, which comprises: a shaft sleeve, disposed on a cavity wall of a vacuum system; a rotary shaft, ensheathed by the shaft sleeve; and a transmission set, connected to the rotary shaft for driving the same; wherein, the rotary shaft is disposed passing through a hole formed on the base of the shaft sleeve while there are a first bearing, a second bearing, a sealing ring and a shaft seal being arranged separately inside the hole. Moreover, the shaft seal has a flake-like lip flange formed extending toward the center of the hole, that is capable of being extended away from the vacuum system by the inserting of the rotary shaft into the hole, and thereby, enabling the lip flange to engage with the rotary shaft tightly by the atmospheric pressure and thus isolating the outside world from the vacuum system.

Abstract: A vacuum apparatus of rotary motion entry is disclosed, which comprises: a shaft sleeve, disposed on a cavity wall of a vacuum system; a rotary shaft, ensheathed by the shaft sleeve; and a transmission set, connected to the rotary shaft for driving the same; wherein, the rotary shaft is disposed passing through a hole formed on the base of the shaft sleeve while there are a first bearing, a second bearing, a sealing ring and a shaft seal being arranged separately inside the hole. Moreover, the shaft seal has a flake-like lip flange formed extending toward the center of the hole, that is capable of being extended away from the vacuum system by the inserting of the rotary shaft into the hole, and thereby, enabling the lip flange to engage with the rotary shaft tightly by the atmospheric pressure and thus isolating the outside world from the vacuum system.

Abstract: A cathode discharge device is provided. The cathode discharge apparatus includes an anode, a cathode and plural cathode chambers. The cathode is located inside the anode, where the cathode has plural flow channels and at least one flow channel hole, and the plural flow channels are connected to one another through the flow channel hole. The plural cathode chambers are located inside the cathode, wherein each of the cathode chambers has a chamber outlet and a chamber inlet connected with at least one of the flow channels.