Patents by Inventor Pei-Shan Yu

Pei-Shan Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240043164
    Abstract: A buffer structure includes at least one internal main layer, at least one external main layer, and a rib portion. An inner side of the internal main layer forms an accommodating space, and the external main layer surrounds an outer side of the internal main layer. The rib portion is located between two first folding lines and forms a ring shape. The two first folding lines are parallel to each other. One of the two first folding lines is connected to the internal main layer, and the other one of the two first folding lines is connected to the external main layer. The rib portion is connected between the internal main layer and the external main layer.
    Type: Application
    Filed: February 23, 2023
    Publication date: February 8, 2024
    Inventors: Pei Shan YU, Hsiao Hsuan HUANG, Wei Chun CHEN
  • Publication number: 20230365291
    Abstract: A supporting structure and a packing box are provided. The supporting structure includes a plate-shaped body that has a first supporting area with at least one first through hole, a second supporting area with at least one second through hole, and a foldable area located between the first supporting area and the second supporting area. The first through hole includes a supporting portion and a passage portion in communication with the supporting portion and the second through hole. The first supporting area and the second supporting area are folded relative to each other along the foldable area so as to form an accommodating space between the first through hole and the second through hole.
    Type: Application
    Filed: March 30, 2023
    Publication date: November 16, 2023
    Inventors: Wei Chun CHEN, Pei Shan YU, Hsiao Hsuan HUANG
  • Patent number: 8286796
    Abstract: A satellite antenna package is provided. The satellite antenna package includes a receiving structure, an antenna device and a cable. A recess and a groove are formed on the receiving structure, and the recess communicates with the groove. The antenna device is disposed in the recess. The cable connects to the antenna device, wherein the cable is connected with the antenna device and partially disposed in the groove, travels along an edge of the receiving structure, and surrounds the antenna device.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: October 16, 2012
    Assignee: Wistron NeWeb Corp.
    Inventor: Pei-Shan Yu
  • Publication number: 20110005965
    Abstract: A satellite antenna package is provided. The satellite antenna package includes a receiving structure, an antenna device and a cable. A recess and a groove are formed on the receiving structure, and the recess communicates with the groove. The antenna device is disposed in the recess. The cable connects to the antenna device, wherein the cable is connected with the antenna device and partially disposed in the groove, travels along an edge of the receiving structure, and surrounds the antenna device.
    Type: Application
    Filed: November 24, 2009
    Publication date: January 13, 2011
    Applicant: WISTRON NEWEB CORP.
    Inventor: Pei-Shan Yu