Patents by Inventor Pei Siang Lim

Pei Siang Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package and a method for forming an integrated circuit package
    Patent number: 8357565
    Abstract: A method of forming an integrated circuit package, such as a Flip Chip package, in which a void is provided in the underfill material in the central region of the package between the chip or die and the substrate on which the chip or die is mounted. This reduces delamination of the package as a result of moisture.
    Type: Grant
    Filed: October 1, 2010
    Date of Patent: January 22, 2013
    Assignee: Infinenon Technologies AG
    Inventors: Gerald Ofner, Swain Hong Yeo, Mary Teo, Pei Siang Lim, Khoon Lam Chua
  • Magnetically alignable integrated circuit device
    Patent number: 7994608
    Abstract: An integrated circuit device includes a semiconductor chip having an active surface with a plurality of chip contact pads, a rewiring substrate and an electrically conductive inductor coil for magnetically aligning the semiconductor chip with the rewiring substrate.
    Type: Grant
    Filed: August 24, 2005
    Date of Patent: August 9, 2011
    Assignee: Infineon Technologies AG
    Inventors: Ai Min Tan, Gerald Ofner, Swain Hong Yeo, Mary Teo, Pei Siang Lim
  • Integrated Circuit Package and a Method for Forming an Integrated Circuit Package
    Publication number: 20110020985
    Abstract: A method of forming an integrated circuit package, such as a Flip Chip package, in which a void is provided in the underfill material in the central region of the package between the chip or die and the substrate on which the chip or die is mounted. This reduces delamination of the package as a result of moisture.
    Type: Application
    Filed: October 1, 2010
    Publication date: January 27, 2011
    Inventors: Gerald OFNER, Swain Hong YEO, Mary TEO, Pei Siang LIM, Khoon Lam CHUA
  • Magnetically Alignable Integrated Circuit Device
    Publication number: 20080265367
    Abstract: An integrated circuit device includes a semiconductor chip having an active surface with a plurality of chip contact pads, a rewiring substrate and an electrically conductive inductor coil for magnetically aligning the semiconductor chip with the rewiring substrate.
    Type: Application
    Filed: August 24, 2005
    Publication date: October 30, 2008
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Ai Min Tan, Gerald Ofner, Swain Hong Yeo, Mary Teo, Pei Siang Lim
  • Integrated Circuit Package and a Method for Forming an Integrated Circuit Package
    Publication number: 20080122053
    Abstract: A method of forming an integrated circuit package, such as a Flip Chip package, in which a void is provided in the underfill material in the central region of the package between the chip or die and the substrate on which the chip or die is mounted. This reduces delamination of the package as a result of moisture.
    Type: Application
    Filed: February 4, 2008
    Publication date: May 29, 2008
    Inventors: Gerald Ofner, Swain Hong Yeo, Mary Teo, Pei Siang Lim, Khoon Lam Chua