Abstract: The invention provides methods, devices and non-transitory tangible computer-readable storage media for estimating a state of charge of a battery and extracting a charging curve of the battery. The method for estimating the state of charge of the battery includes estimating a first state of charge of the battery; determining a charging curve that conforms to the present charging scenario, wherein the present charging scenario is characterized by at least one of parameters including an ambient temperature, a charging rate, an internal resistance, a state of health, a lifespan, and an open circuit voltage of the battery; and correcting the first state of charge according to the charging curve to obtain a final state of charge of the battery.

Abstract: The invention provides a method, a system and a terminal device for analyzing states of battery packs in a battery cluster. The method includes acquiring cell voltages of each battery pack in the battery cluster within a preset time; performing data cleaning on the acquired cell voltages; calculating a voltage standard score of each cell based on the cell voltages after data cleaning; calculating a mean value and a standard deviation of said voltage standard score; for each battery pack, plotting scattered points based on the mean value and the standard deviation, and performing closed curve fitting to the scattered points to obtain a closed curve; and analyzing the state of the battery pack based on the closed curve.

Abstract: The invention provides methods, systems and terminal devices for analyzing a state of a battery pack based on cell parameters thereof. The method comprises acquiring cell voltages of each cell and total voltages of the battery pack within a preset time; performing data cleaning on the cell voltages and the total voltages of the battery pack; calculating a voltage standard score of the cells based on the cell voltages after data cleaning, and calculating a voltage standard score of the battery pack based on the total voltages after data cleaning; and performing a time-domain analysis on the voltage standard score of each cell and/or the voltage standard score of the battery pack.

Abstract: A shared optic assembly for combined flood and dot illumination modules is disclosed. The shared optic assembly includes a first high-powered VCSEL element for providing a flood beam and a second high-powered VCSEL element for providing a dot beam, where both the first and second VCSEL elements share the same optics and are incorporated onto the same module for space savings.

Abstract: An illumination device includes a laser source, a conventional diffuser element, and an extender optic with a curved interior surface and a curved outer surface. Light emitted by the laser source with a given field of illumination (FOI) is received by the conventional diffuser element and outputted towards the interior surface of the extender optic with an increased FOI; the outer surface of the extender optic then outputs the light received by the interior surface as light with an even greater FOI, typically in the range of 120° to 185°.

Abstract: A light-emitting module structure includes a substrate, a plurality of light-emitting diodes (LEDs) disposed on the substrate, and a light-guiding layer covering the light-emitting diodes. The light-guiding layer has an upper surface, the upper surface has a plurality of recesses, and the recesses are above the light-emitting diodes or between the light-emitting diodes. This light-emitting module structure can improve the brightness and uniformity of the light-emitting module.

Abstract: An illumination device includes a laser source, a conventional diffuser element, and an extender optic with a curved interior surface and a curved exterior surface. Light emitted by the laser source with a given field of illumination (FOI) is received by the conventional diffuser element and outputted towards the interior surface of the extender optic with an increased FOI; the exterior surface of the extender optic then outputs the light received by the interior surface as light with an even greater FOI usually in the range of 120°-185°.

Abstract: An illumination device includes a laser source, a conventional diffuser element, and an extender optic with a curved interior surface and a curved exterior surface. Light emitted by the laser source with a given field of illumination (FOI) is received by the conventional diffuser element and outputted towards the interior surface of the extender optic with an increased FOI; the exterior surface of the extender optic then outputs the light received by the interior surface as light with an even greater FOI, usually in the range of 120°-185°.

Abstract: A light-emitting module structure includes a substrate, a plurality of light-emitting diodes (LEDs) disposed on the substrate, and a light-guiding layer covering the light-emitting diodes. The light-guiding layer has an upper surface, the upper surface has a plurality of recesses, and the recesses are above the light-emitting diodes or between the light-emitting diodes. This light-emitting module structure can improve the brightness and uniformity of the light-emitting module.

Abstract: A light-emitting module structure includes a substrate, a plurality of light-emitting diodes (LEDs) disposed on the substrate, and a light-guiding layer covering the light-emitting diodes. The light-guiding layer has an upper surface, the upper surface has a plurality of recesses, and the recesses are above the light-emitting diodes or between the light-emitting diodes. This light-emitting module structure can improve the brightness and uniformity of the light-emitting module.

Abstract: A display device assembly adapted to assemble a display unit to a display device includes a frame body, an optical element, and a supporting element connected to the frame body. The frame body fixes the display unit to be inclined to a viewing direction by a first angle. The display unit provides an image beam. The optical element is disposed on the frame body and inclined to the viewing direction by a second angle, and the optical element and the display unit face each other. The optical element has a multi-layer coating and located on a transmission path of the image beam. The image beam is transmitted to the optical element for reflection and transmitted to a user, so that the user observing the optical element in the viewing direction obtains a combination of a virtual image and an environmental image presented by the real world.

Abstract: A light-emitting diode (LED) device and a manufacturing method thereof are provided. The LED device includes a frame body, a first conductive extension structure, a second conductive extension structure, and a LED chip. The frame body includes an upper surface, a bottom, a recess on the opposite side of the bottom, and a first side surface and a second side surface opposite to each other. The first and second conductive extension structures are located in the frame body. The first and second conductive extension structures extend from the first side surface to the second side surface of the frame body. The frame body encapsulates a left side surface, a right side surface, a top surface, and a bottom surface of each of the first and second conductive extension structures. The LED chip is disposed in the recess and includes a first conductive pad and a second conductive pad.

Abstract: A light-emitting diode (LED) package includes a substrate with upper and lower surfaces, including: a metal block; an electrically insulating region surrounding at least a portion of the metal block; an LED chip mounted on the substrate and in electrical communication with the metal block; and an encapsulant covering at least an upper surface of the LED chip. A light-emitting system includes a plurality of light-emitting diode (LED) chips; and a package support for the plurality of LED chips.

Abstract: A light-emitting module structure includes a substrate, a plurality of light-emitting diodes (LEDs) disposed on the substrate, and a light-guiding layer covering the light-emitting diodes. The light-guiding layer has an upper surface, the upper surface has a plurality of recesses, and the recesses are above the light-emitting diodes or between the light-emitting diodes. This light-emitting module structure can improve the brightness and uniformity of the light-emitting module.

Abstract: A light-emitting device includes a base having an insulating part and a metal block; a light-emitting diode (LED) chip over the base; a water soluble paste between the LED chip and the base metal block for chip fixing and heat conduction; packaging glue covering the LED chip; and the LED chip bottom, water soluble paste and the base metal block form an all-metal thermal conducting path to achieve low a thermal resistance.

Abstract: A display device assembly adapted to assemble a display unit to a display device includes a frame body, an optical element, and a supporting element connected to the frame body. The frame body fixes the display unit to be inclined to a viewing direction by a first angle. The display unit provides an image beam. The optical element is disposed on the frame body and inclined to the viewing direction by a second angle, and the optical element and the display unit face each other. The optical element has a multi-layer coating and located on a transmission path of the image beam. The image beam is transmitted to the optical element for reflection and transmitted to a user, so that the user observing the optical element in the viewing direction obtains a combination of a virtual image and an environmental image presented by the real world.

Abstract: A light-emitting diode (LED) device and a manufacturing method thereof are provided. The LED device includes a frame body, a first conductive extension structure, a second conductive extension structure, and a LED chip. The frame body includes an upper surface, a bottom, a recess on the opposite side of the bottom, and a first side surface and a second side surface opposite to each other. The first and second conductive extension structures are located in the frame body. The first and second conductive extension structures extend from the first side surface to the second side surface of the frame body. The frame body encapsulates a left side surface, a right side surface, a top surface, and a bottom surface of each of the first and second conductive extension structures. The LED chip is disposed in the recess and includes a first conductive pad and a second conductive pad.

Abstract: A light emitting diode package structure allows for an improved light-emitting efficiency by including a first reflecting material layer with through holes; a flip chip on the first reflecting material layer, with the electrodes inlaid in the through holes of the first reflecting material layer; a first transparent material layer surrounding the side surface of the flip chip except the electrodes; and a second reflecting material layer surrounding the first transparent material layer. An interface between the first transparent material layer and the reflecting material layer is an inclined plane, an arc plane, or an irregular shape, to thereby facilitate upward light reflection of the flip chip. A wavelength conversion material layer is over the first reflecting material layer, the flip chip, and the second reflecting material layer.

Abstract: A light source module includes a substrate, a first illumination element, a second illumination element and a third illumination element. The first illumination element includes a blue LED chip disposed on the substrate and a first wavelength converting layer that covers the blue LED chip, in which blue light emitted from the blue LED chip can be converted to light in the range of a first wavelength. The second illumination element includes a blue LED chip disposed on the substrate and a second wavelength converting layer that covers the blue LED chip, in which blue light emitted from the blue LED chip can be converted to light in the range of a second wavelength. The third illumination element includes a blue LED chip.

Abstract: A light-emitting diode (LED) package includes a substrate with upper and lower surfaces, including: a metal block; an electrically insulating region surrounding at least a portion of the metal block; an LED chip mounted on the substrate and in electrical communication with the metal block; and an encapsulant covering at least an upper surface of the LED chip. A light-emitting system includes a plurality of light-emitting diode (LED) chips; and a package support for the plurality of LED chips.