Patents by Inventor Pei-Ti Yu

Pei-Ti Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive pattern and integrated fan-out package having the same
    Patent number: 9941216
    Abstract: A conductive pattern including a teardrop shaped portion, a routing line, and a connection portion is provided. The routing line links to the teardrop shaped portion through the connection portion, and a width of the connection portion decreases along an extending direction from the teardrop shaped portion to the routing line. Furthermore, an integrated fan-out package including the above-mentioned conductive pattern is also provided.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: April 10, 2018
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ming-Yen Chiu, Ching-Fu Chang, Chien-Chia Chiu, Hsin-Chieh Huang, Tsung-Shu Lin, Pei-Ti Yu
  • CONDUCTIVE PATTERN AND INTEGRATED FAN-OUT PACKAGE HAVING THE SAME
    Publication number: 20170345762
    Abstract: A conductive pattern including a teardrop shaped portion, a routing line, and a connection portion is provided. The routing line links to the teardrop shaped portion through the connection portion, and a width of the connection portion decreases along an extending direction from the teardrop shaped portion to the routing line. Furthermore, an integrated fan-out package including the above-mentioned conductive pattern is also provided.
    Type: Application
    Filed: September 29, 2016
    Publication date: November 30, 2017
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ming-Yen Chiu, Ching-Fu Chang, Chien-Chia Chiu, Hsin-Chieh Huang, Tsung-Shu Lin, Pei-Ti Yu