Abstract: A solar cell includes a silicon semiconductor substrate, a composite multifunctional protective film, a plurality of front electrodes and a plurality of back electrodes. The silicon semiconductor substrate has a roughened first surface. A depth of the doped layer arranged under the first surface ranges from 200 nm to 1000 nm. A surface doping concentration of the doped layer ranges from 1×1019 to 5×1020 atoms/cm3. The composite multifunctional protective film is disposed above the doped layer. The composite multifunctional protective film has a plurality of layers, so as to reduce reflectance of incident light. A layer thickness of a layer closest to the doped layer among these layers is less than 40 nm. The plurality of front electrodes penetrates the composite multifunctional protective film and is disposed on the doped layer. The plurality of back electrodes is disposed on a second surface of the silicon semiconductor substrate.

Abstract: A process of manufacturing a solar cell is disclosed. The process comprises steps of (a) providing a semiconductor substrate, (b) forming a dielectric layer with amorphous silicon structure on the semiconductor substrate, (c) partially removing the dielectric layer with amorphous silicon structure to expose parts of the semiconductor substrate, (d) simultaneously forming a heavily doped region on a surface of the exposed semiconductor substrate and a lightly doped region on a surface of the unexposed semiconductor substrate using the dielectric layer with amorphous silicon structure as a translucent barrier layer, (e) removing the dielectric layer with amorphous silicon structure, (f) forming an anti-reflection coating on the semiconductor substrate, and (g) forming a first electrode on the anti-reflection coating and coupled with the heavily doped region.

Abstract: A process of manufacturing a solar cell is disclosed. The process comprises steps of (a) providing a semiconductor substrate, (b) forming a dielectric layer with amorphous silicon structure on the semiconductor substrate, (c) partially removing the dielectric layer with amorphous silicon structure to expose parts of the semiconductor substrate, (d) simultaneously forming a heavily doped region on a surface of the exposed semiconductor substrate and a lightly doped region on a surface of the unexposed semiconductor substrate using the dielectric layer with amorphous silicon structure as a translucent barrier layer, (e) removing the dielectric layer with amorphous silicon structure, (f) forming an anti-reflection coating on the semiconductor substrate, and (g) forming a first electrode on the anti-reflection coating and coupled with the heavily doped region.