Abstract: A semiconductor structure is provided. The semiconductor structure includes a semiconductor wafer and a test structure. The semiconductor wafer has a substrate having a scribe line area, a first die area and a second die area. The first die area and the second die area are separated by the scribe line area extending along a first direction. The test structure is disposed in the scribe line area. The test structure includes a test device and a first test pad. The test device has a physical characteristic similar to a semiconductor device fabricated in the first die area or the second die area. The first test pad is electrically connected to the test device. A first distance between the first test pad and the first die area gradually increases from a center region to a peripheral region of the first test pad in the first direction.

Abstract: An encoder with a tri-color LED includes an insulating base, five terminals, a conductive elastic piece, a tri-color LED assembly, an encoder substrate assembly, a conductive wiper assembly, and an insulated light shaft. The five terminals and the insulating base are formed integrally. The conductive elastic piece is received in a receiving chamber of the insulating base. The tri-color LED assembly is disposed in the receiving chamber. The encoder substrate assembly covers on both the conductive elastic piece and the tri-color LED assembly. The conductive wiper assembly is received in the encoder substrate assembly. The insulated light shaft passes through a through hole of the conductive wiper assembly and a through hole of the encoder substrate assembly. Thereby, through voltage variation of an independent tri-color LED loop, color mixing can be controlled, and that to combine the same with the encoder a function of lighting and marking can be achieved.

Abstract: An encoder with a tri-color LED includes an insulating base, five terminals, a conductive elastic piece, a tri-color LED assembly, an encoder substrate assembly, a conductive wiper assembly, and an insulated light shaft. The five terminals and the insulating base are formed integrally. The conductive elastic piece is received in a receiving chamber of the insulating base. The tri-color LED assembly is disposed in the receiving chamber. The encoder substrate assembly covers on both the conductive elastic piece and the tri-color LED assembly. The conductive wiper assembly is received in the encoder substrate assembly. The insulated light shaft passes through a through hole of the conductive wiper assembly and a through hole of the encoder substrate assembly. Thereby, through voltage variation of an independent tri-color LED loop, color mixing can be controlled, and that to combine the same with the encoder a function of lighting and marking can be achieved.

Abstract: A tri-color LED module structure includes an insulating base, four terminals, a tri-color LED chip, and a cover. The insulating base has a receiving recess. The four terminals do not contact with one another, and each of them includes an inserting portion and a touching portion which are connected with each other. The touching portion is received in the receiving recess; while the inserting portion extends out of the insulating base. The four terminals and the insulating base are an integrally formed structure. The tri-color LED chip is disposed in the receiving recess of the insulating base, with four pins of the tri-color LED chip in touch with the touching portions of the four terminals, respectively. Further, the cover covers on the receiving chamber of the insulating base. Thereby, an independent red-green-blue tri-color LED loop can be constituted, making color mixing become possible by controlling various voltage combination.