Patents by Inventor Pei Wei Yeh

Pei Wei Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Diaphragm for chemical mechanical polisher
    Patent number: 6582288
    Abstract: A diaphragm for a chemical mechanical polisher is composed of a rubber layer and a fiber layer. The size and shape of the diaphragm are suitably designed according to a gap and relative shifting between the rotary unit and holder to prevent creasing of the diaphragm and thereby decrease friction with a sidewall of the rotary unit and holder. The fibrous layer can improve the strength of the diaphragm in order to improve the lifetime of the diaphragm, reduce the frequency of maintenance of the polisher, and increase throughput.
    Type: Grant
    Filed: July 13, 2001
    Date of Patent: June 24, 2003
    Assignee: Applied Materials, Inc.
    Inventors: Pei Wei Yeh, Sun Kuo Lang
  • Diaphragm for chemical mechanical polisher
    Publication number: 20020072314
    Abstract: A diaphragm for a chemical mechanical polisher is composed of a rubber layer and a fiber layer. The size and shape of the diaphragm are suitably designed according to a gap and relative shifting between the rotary unit and holder to prevent creasing of the diaphragm and thereby decrease friction with a sidewall of the rotary unit and holder. The fibrous layer can improve the strength of the diaphragm in order to improve the lifetime of the diaphragm, reduce the frequency of maintenance of the polisher, and increase throughput.
    Type: Application
    Filed: July 13, 2001
    Publication date: June 13, 2002
    Inventors: Pei Wei Yeh, Sun Kuo Lang
  • Method and apparatus for preventing particle contamination in a polishing machine
    Patent number: 6206760
    Abstract: The present invention discloses a method for preventing particle contamination in a polishing machine that utilizes slurry composition for the removal of material from the surface of a substrate. The novel method is particularly suited for use in a chemical mechanical polishing apparatus in which a slurry composition is used. The method includes the step of providing a plurality of cleaning devices each having a bendable, shapable conduit and a spray nozzle for dispensing a cleaning solvent on the spindle and the conditioner arm utilized in the CMP apparatus. The present invention further discloses an apparatus for use in carrying out a method for preventing particle contamination in a CMP apparatus by using bendable, shapable conduits for dispensing a cleaning solvent such as deionized water onto the chamber components for removing slurry deposits that may have splattered thereon and therefore, eliminating sources for particle contamination.
    Type: Grant
    Filed: June 29, 1999
    Date of Patent: March 27, 2001
    Assignees: Taiwan Semiconductor Manufacturing Company, Ltd., Applied Materials, Inc.
    Inventors: Yu-Chia Chang, Jain-Li Wu, Chung-I Cheng, Chih-Chiang Yang, Pei Wei Yeh, Yung-Tai Tseng