Patents by Inventor Pei-Yang Weng

Pei-Yang Weng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10813211
    Abstract: Traces on a PCB can be spaced closer together than in conventional layouts, which previously required the pair-to-pair spacing for the high-speed differential stripline signals to be at least 5H if the signals are originating from the same source and 7H when the signals on two pairs of transmission lines in the traces originate from different sources. Traces may be spaced closer together when, for example, a ratio of the core height to the prepreg height of the printed circuit board is approximately equal to one. Traces may be spaced closer together when, for example, a ratio of the trace spacing distance to the core height distance is less than approximately one.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: October 20, 2020
    Assignee: Dell Products L.P.
    Inventors: Pei-Yang Weng, Chun-Lin Liao, Bhyrav Murthy Mutnury
  • Publication number: 20200196437
    Abstract: Traces on a PCB can be spaced closer together than in conventional layouts, which previously required the pair-to-pair spacing for the high-speed differential stripline signals to be at least 5H if the signals are originating from the same source and 7H when the signals on two pairs of transmission lines in the traces originate from different sources. Traces may be spaced closer together when, for example, a ratio of the core height to the prepreg height of the printed circuit board is approximately equal to one. Traces may be spaced closer together when, for example, a ratio of the trace spacing distance to the core height distance is less than approximately one.
    Type: Application
    Filed: December 14, 2018
    Publication date: June 18, 2020
    Applicant: Dell Products L.P.
    Inventors: Pei-Yang Weng, Chun-Lin Liao, Bhyrav Murthy Mutnury