Patents by Inventor Pei-Yi Ho

Pei-Yi Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140293168
    Abstract: A touch panel including a substrate, a plurality of sensor units, a decoration layer, first signal lines, second signal lines, and at least one conductive component is provided. The substrate has an operation region and a periphery region surrounding the operation region. The sensor units are located within the operation region for sensing a coordinate of a touch point. The decoration layer is located within the periphery region. The first and second signal lines and the conductive component are located within the periphery region and disposed on the decoration layer. The conductive component has a widen portion located between the first and second signal lines, and the widen portion has a line width greater than those of the other portions of the conductive component.
    Type: Application
    Filed: June 13, 2014
    Publication date: October 2, 2014
    Applicant: WINTEK CORPORATION
    Inventors: Di-Shing Tsai, Wen-Chieh Liu, Pei-Yi Ho, Ping-Wen Huang, Peng-Chih Yu
  • Publication number: 20130328806
    Abstract: A touch panel including a substrate, a plurality of sensing units, a decoration layer, first signal lines, second signal lines, and a conductive component is provided. The substrate has an operation region and a periphery region surrounding the operation region. The sensing units are located within the operation region for sensing a coordinate of a touch point. The decoration layer is located within the periphery region. The first and second signal lines and the conductive component are located within the periphery region and disposed on the decoration layer. The conductive component has a widen portion located between the first and second signal lines, and the widen portion has a line width greater than those of the other portions of the conductive component.
    Type: Application
    Filed: June 6, 2013
    Publication date: December 12, 2013
    Applicant: WINTEK CORPORATION
    Inventors: Di-Shing Tsai, Wen-Chieh Liu, Pei-Yi Ho, Ping-Wen Huang, Peng-Chih Yu