Patents by Inventor Pei-Yi Lin

Pei-Yi Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240144467
    Abstract: A hot spot defect detecting method and a hot spot defect detecting system are provided. In the method, hot spots are extracted from a design of a semiconductor product to define a hot spot map comprising hot spot groups, wherein local patterns in a same context of the design yielding a same image content are defined as a same hot spot group. During runtime, defect images obtained by an inspection tool performing hot scans on a wafer manufactured with the design are acquired and the hot spot map is aligned to each defect image to locate the hot spot groups. The hot spot defects in each defect image are detected by dynamically mapping the hot spot groups located in each defect image to a plurality of threshold regions and respectively performing automatic thresholding on pixel values of the hot spots of each hot spot group in the corresponding threshold region.
    Type: Application
    Filed: January 8, 2024
    Publication date: May 2, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Huei Chen, Pei-Chao Su, Xiaomeng Chen, Chan-Ming Chang, Shih-Yung Chen, Hung-Yi Chung, Kuang-Shing Chen, Li-Jou Lee, Yung-Cheng Lin, Wei-Chen Wu, Shih-Chang Wang, Chien-An Lin
  • Publication number: 20240145650
    Abstract: A package comprises a substrate including a first surface, and an upper conductive layer arranged on the first surface, a first light-emitting unit arranged on the upper conductive layer, and comprises a first semiconductor layer, a first substrate, a first light-emitting surface and a first side wall, a second light-emitting unit, which is arranged on the upper conductive layer, and comprises a second light-emitting surface and a second side wall, a light-transmitting layer arranged on the first surface and covers the upper conductive layer, the first light-emitting unit, and the second light-emitting unit, a light-absorbing layer, which is arranged between the substrate and the light-transmitting layer in a continuous configuration of separating the first light-emitting unit and the second light-emitting unit from each other, and a reflective wall arranged on the first side wall, wherein a height of the reflective wall is lower than that of the light-absorbing layer.
    Type: Application
    Filed: January 8, 2024
    Publication date: May 2, 2024
    Inventors: Shau-Yi CHEN, Tzu-Yuan LIN, Wei-Chiang HU, Pei-Hsuan LAN, Min-Hsun HSIEH
  • Publication number: 20240095467
    Abstract: Translating applications to a target language includes extracting program integrated information (PII) to be translated and creating translation context datasets based on interpretation of accessibility information associated with particular strings of PII. Translation pairs include PII and corresponding context datasets for context-based translation of application components. A two-stage index contains PII strings for first stage lookup and context datasets for distinguishing duplicate PII strings as a second stage lookup. Real-time translation is facilitated by the two-stage index, which is established by translation pairs and resulting translations.
    Type: Application
    Filed: September 16, 2022
    Publication date: March 21, 2024
    Inventors: CHIH-YUAN LIN, Jin Shi, Shu-Chih Chen, PEI-YI LIN, Chao Yuan Huang
  • Publication number: 20240096781
    Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.
    Type: Application
    Filed: March 20, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
  • Publication number: 20240069912
    Abstract: A method for identifying hard-coded strings in source code is disclosed. In one embodiment, such a method parses source code and associated localization resource files to identify hard-coded strings and their associated context. The method provides a confidence score for each hard-coded string that indicates whether the hard-coded string is translatable or non-translatable. Based on the confidence score for each hard-coded string, the method transforms each hard-coded string into a single equivalence word. The method then prepares training data by tagging the hard-coded strings in the source code and associated localization resource files as one of translatable and non-translatable. The method then trains a parts-of-speech (POS) tagging model using the training data. At runtime, the method fetches potential hard-coded strings and tags each hard-coded string as one of translatable and non-translatable using the POS tagging model. A corresponding system and computer program product are also disclosed.
    Type: Application
    Filed: August 27, 2022
    Publication date: February 29, 2024
    Applicant: International Business Machines Corporation
    Inventors: Jin Shi, Chih-Yuan Lin, Shu-Chih Chen, Pei-Yi Lin, Chao Yuan Huang
  • Publication number: 20240055805
    Abstract: An electrical connector includes an insulation body, a terminal assembly mounted in the insulation body, and two shielding pieces. The terminal assembly includes a plurality of grounding terminals, a plurality of signal terminals and two locating blocks. The plurality of the grounding terminals and the plurality of the signal terminals are mounted in the two locating blocks. The two locating blocks together with the plurality of the grounding terminals and the signal terminals are arranged in two rows. The two shielding pieces are disposed at an upper surface and a lower surface of a front end of the insulation body. Each shielding piece has a fixing piece. Two sides of a rear edge of the fixing piece extend rearward to form two first shielding portions. The first shielding portions of the two shielding pieces shield the signal terminals of two sides of the terminal assembly.
    Type: Application
    Filed: February 1, 2023
    Publication date: February 15, 2024
    Inventors: PEI-YI LIN, CHUAN-HUNG LIN, SHENG-NAN YU
  • Patent number: 11894632
    Abstract: A high-speed connector includes an insulating housing, and a first terminal assembly mounted in the insulating housing. The first terminal assembly includes a plurality of first terminals, a first base body and a first conductive film. The plurality of the first terminals include at least two first grounding terminals and at least two first signal terminals. At least one portion of a bottom of the first base body extends downward to form at least one first protruding portion. The at least two first signal terminals penetrate through the at least one first protruding portion. The first conductive film is covered to the at least one first protruding portion. The first conductive film has a first metal layer. The first metal layer is electrically connected with the at least two first grounding terminals to form a grounding structure.
    Type: Grant
    Filed: January 3, 2022
    Date of Patent: February 6, 2024
    Assignee: CHENG UEI PRECISION INDUSTRY CO., LTD.
    Inventors: Sheng-Yuan Huang, Chun-Fu Lin, Yun-Chien Lee, Pei-Yi Lin, Yi-Ching Hsu
  • Publication number: 20230399693
    Abstract: The present application provides a method for determining a gene alteration, such as a gene fusion. The present application also provides a kit for determining a gene alteration. The present application further provides a method for treating a subject by determining whether a subject is at risk for a particular cancer type or genotype and administering proper treatment.
    Type: Application
    Filed: November 2, 2021
    Publication date: December 14, 2023
    Inventors: Yi-Hsuan LAI, Yu-Ling CHEN, An HSU, Pei-Yi LIN, Hua-Chien CHEN, Shu-Jen CHEN
  • Publication number: 20230402801
    Abstract: An electrical connector includes an insulating housing, an upper terminal assembly fastened in the insulating housing, a center grounding plate fastened in the insulating housing, and an outer shell disposed to a top surface of the insulating housing. A rear end of the insulating housing has two first penetrating grooves. The upper terminal assembly includes an upper base portion. A rear end of the upper base portion defines two second penetrating grooves. The two second penetrating grooves are aligned with the two first penetrating grooves. Two opposite sides of a rear end of a top surface of the outer shell extend towards the insulating housing to form two elastic arms, respectively. The two elastic arms pass through the two first penetrating grooves and the two second penetrating grooves, and then the two elastic arms contact with two outermost upper grounding terminals of the upper terminal assembly.
    Type: Application
    Filed: April 4, 2023
    Publication date: December 14, 2023
    Inventors: PEI-YI LIN, YU-HUNG SU, SHENG-YUAN HUANG
  • Publication number: 20230283025
    Abstract: An electrical connector includes an insulating body, a plurality of conductive terminals, a plurality of grounding terminals and two shielding elements. The plurality of the conductive terminals are mounted in the insulating body. The plurality of the grounding terminals are mounted in the insulating body. The plurality of the grounding terminals are located adjacent to two outer sides of the plurality of the conductive terminals. The two shielding elements are disposed at a front end of an upper surface and a front end of a lower surface of the insulating body. Each shielding element has a base frame. Two sides of a rear edge of the base frame are connected with two contact portions. The contact portions of the two shielding elements contact with the plurality of the grounding terminals.
    Type: Application
    Filed: October 20, 2022
    Publication date: September 7, 2023
    Inventors: PEI-YI LIN, CHUAN-HUNG LIN, SHENG-NAN YU, SHENG-YUAN HUANG, CHUN-FU LIN
  • Patent number: 11675744
    Abstract: Embodiments relate to a system, method and program product for performing code conversions. In one embodiment the method includes determining size of encoding space for a source file and a target file upon receipt of a code conversion request and generating a main conversion file upon determination that a target encoding space associated with said target file is smaller than a source encoding space associated with the source file. Subsequently an extension converted file is generated from the source file according to a pre-established mapping table of code conversion stored in a memory. The code conversion request is completed by using the main conversion file and said extension file together so that the source file does not need to be truncated in order to fit into the target conversion space.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: June 13, 2023
    Assignee: International Business Machines Corporation
    Inventors: Albert Hsieh, Elaine I H. Liao, Chih-Yuan Lin, Pei-Yi Lin
  • Publication number: 20230144251
    Abstract: A high-speed connector includes an insulating housing, a first terminal assembly received in the insulating housing, a second terminal assembly received in the insulating housing, a third terminal assembly received in the insulating housing, and a fourth terminal assembly received in the insulating housing. The second terminal assembly is opposite to the first terminal assembly along an up-down direction. The third terminal assembly is disposed between the first terminal assembly and the second terminal assembly. The fourth terminal assembly is corresponding to the third terminal assembly. The fourth terminal assembly is disposed between the second terminal assembly and the third terminal assembly.
    Type: Application
    Filed: August 24, 2022
    Publication date: May 11, 2023
    Inventors: YUN-CHIEN LEE, YI-CHING HSU, PEI-YI LIN, YU-HUNG SU, SHENG-YUAN HUANG, CHUN-FU LIN
  • Patent number: 11581688
    Abstract: A high-speed connector includes an insulating housing, and a first terminal assembly mounted in the insulating housing. The first terminal assembly includes a plurality of first terminals including a plurality of first grounding terminals, a first base body, and a first shielding plate disposed under the first base body. The plurality of the first terminals are fastened to the first base body. The first shielding plate has a first base plate, a first metal layer and a plurality of first ribs. Several portions of a top surface of the first base plate extend upward to form the plurality of the first ribs. The first metal layer is a pattern with a plurality of pores. Several of the first grounding terminals contact with the first metal layer which is attached to top surfaces of the plurality of the first ribs to form a grounding structure.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: February 14, 2023
    Assignee: CHENG UEI PRECISION INDUSTRY CO., LTD.
    Inventors: Pei-Yi Lin, Yi-Ching Hsu, Sheng-Yuan Huang, Chun-Fu Lin
  • Patent number: 11502928
    Abstract: A fuzz testing apparatus transmits a plurality of packets to the device under test (DUT), and calculates a probability of abnormal state, a normal response time and an abnormal-state-processing time of the DUT for the packets. Then, the fuzz testing apparatus estimates a maximum quantity of packets that can be sent to the DUT according to the probability of abnormal state the normal response time and the abnormal-state-processing time corresponding to the standby time of the DUT. Finally, the fuzz testing apparatus determines a plurality of test packets from a plurality of candidate test packets according to the maximum quantity of packets.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: November 15, 2022
    Assignee: INSTITUTE FOR INFORMATION INDUSTRY
    Inventors: Pei-Yi Lin, Chih-Wei Chen, Chia-Wei Tien, Chin-Wei Tien
  • Publication number: 20220344877
    Abstract: A high-speed connector includes an insulating housing, and a first terminal assembly mounted in the insulating housing. The first terminal assembly includes a plurality of first terminals including a plurality of first grounding terminals, a first base body, and a first shielding plate disposed under the first base body. The plurality of the first terminals are fastened to the first base body. The first shielding plate has a first base plate, a first metal layer and a plurality of first ribs. Several portions of a top surface of the first base plate extend upward to form the plurality of the first ribs. The first metal layer is a pattern with a plurality of pores. Several of the first grounding terminals contact with the first metal layer which is attached to top surfaces of the plurality of the first ribs to form a grounding structure.
    Type: Application
    Filed: September 13, 2021
    Publication date: October 27, 2022
    Inventors: PEI-YI LIN, YI-CHING HSU, SHENG-YUAN HUANG, CHUN-FU LIN
  • Publication number: 20220344854
    Abstract: A high-speed connector includes an insulating housing, and a first terminal assembly mounted in the insulating housing. The first terminal assembly includes a plurality of first terminals, a first base body and a first conductive film. The plurality of the first terminals include at least two first grounding terminals and at least two first signal terminals. At least one portion of a bottom of the first base body extends downward to form at least one first protruding portion. The at least two first signal terminals penetrate through the at least one first protruding portion. The first conductive film is covered to the at least one first protruding portion. The first conductive film has a first metal layer. The first metal layer is electrically connected with the at least two first grounding terminals to form a grounding structure.
    Type: Application
    Filed: January 3, 2022
    Publication date: October 27, 2022
    Inventors: SHENG-YUAN HUANG, CHUN-FU LIN, YUN-CHIEN LEE, PEI-YI LIN, YI-CHING HSU
  • Publication number: 20220259671
    Abstract: Provided is a kit for detecting MET fusion, including MET gene fusion and MET exon 14 skipping. The kit includes a set of MET fusion-specific primer pairs and a set of MET fusion-specific probes. Also provided is a method for detecting MET fusion, including generating an amplified target cDNA to hybridize with the set of MET fusion-specific probes in a single reaction and detecting the probe-bound product to identify all possible MET fusions in a biological sample.
    Type: Application
    Filed: August 28, 2020
    Publication date: August 18, 2022
    Inventors: AN HSU, PEI-YI LIN, WAN-TING HUANG, DATSEN GEORGE WEI, SHU-JEN CHEN, HUA-CHIEN CHEN
  • Patent number: 11397664
    Abstract: A system for producing test data produces fuzzing data at least according to first test data which is used for testing at least one first device and second test data which is used for testing a second device. Then, the system transmits the fuzzing data to the second device so as to test the second device.
    Type: Grant
    Filed: November 29, 2019
    Date of Patent: July 26, 2022
    Assignee: INSTITUTE FOR INFORMATION INDUSTRY
    Inventors: Pei-Yi Lin, Ting-Chun Huang, Tsung-Ta Tsai, Chia-Wei Tien
  • Publication number: 20220166699
    Abstract: A fuzz testing apparatus transmits a plurality of packets to the device under test (DUT), and calculates a probability of abnormal state, a normal response time and an abnormal-state-processing time of the DUT for the packets. Then, the fuzz testing apparatus estimates a maximum quantity of packets that can be sent to the DUT according to the probability of abnormal state the normal response time and the abnormal-state-processing time corresponding to the standby time of the DUT. Finally, the fuzz testing apparatus determines a plurality of test packets from a plurality of candidate test packets according to the maximum quantity of packets.
    Type: Application
    Filed: December 8, 2020
    Publication date: May 26, 2022
    Inventors: Pei-Yi LIN, Chih-Wei CHEN, Chia-Wei TIEN, Chin-Wei TIEN
  • Patent number: 11303587
    Abstract: A computer-implemented method, a computer system, and a computer program product are proposed. According to the method, chat information of a chatbot is obtained in response to receiving one or more chat messages from the chatbot. Then a matching data object of a matching data model from one or more data models is determined based on the chat information. And a data value of the matching data object is obtained as a response to the one or more chat messages.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: April 12, 2022
    Assignee: International Business Machines Corporation
    Inventors: Louis Huang, Chih-Yuan Lin, Jin Shi, Sharon Chen, Pei-Yi Lin