Patents by Inventor Pei You

Pei You has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240161314
    Abstract: A method of estimating an optical flow includes processing, using an image processing pass, a first image and a second image separately, and estimating the optical flow based on a second image attention feature map of the first image and a second image attention feature map of the second image. The processing using the image processing pass includes extracting a feature map by encoding an image, outputting a first image fusion attention feature map by fusing row relationship information of the image with the image feature map, outputting a first image attention feature map of the image based on the first image fusion attention feature map and the image feature map, outputting a second image fusion attention feature map by fusing column relationship information of the image with the first image attention feature map, and generating a second image attention feature map of the image based on the second image fusion attention feature map and the first image attention feature map.
    Type: Application
    Filed: November 14, 2023
    Publication date: May 16, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Zhaohui Lv, Pei You, Penghui Sun, Feng Zhu, Ran Yang, Huisi Wu, Wende Xie, Jingyin Lin, Zebin Zhao, Dong Kyung Nam, Jingu Heo
  • Publication number: 20240096781
    Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.
    Type: Application
    Filed: March 20, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
  • Patent number: 11917804
    Abstract: A manufacturing method of a SRAM memory device includes forming two transistors on a substrate, forming an inner dielectric layer covering the two transistors, forming contacts in the inner dielectric layer for coupling to source nodes of the two transistors, forming a metal interconnect structure on the inner dielectric layer, wherein a portion of an n-th metal layer of the metal interconnect structure is utilized as a lower metal layer, wherein n?1. An opening is formed in the metal interconnect structure to expose the lower metal layer, and then a capacitor is formed in the opening. The capacitor includes the lower metal layer, a first electrode layer, a dielectric layer, a second electrode layer, and an upper metal layer from bottom to top. The upper metal layer is a portion of an m-th metal layer of the metal interconnect structure, wherein m?n+1.
    Type: Grant
    Filed: September 15, 2022
    Date of Patent: February 27, 2024
    Assignee: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Shou-Zen Chang, Yi-Hsung Wei, Pei-Hsiu Tseng, Jia-You Lin
  • Publication number: 20220286696
    Abstract: An image compression method includes obtaining a hidden variable of an input image using a coding network of a deep learning neural network comprising at least one downsampling back projection module including performing downsampling transformation on a first feature map of the input image input to the downsampling back projection module to obtain a second feature map, obtaining a third feature map having a same resolution as a resolution of the first feature map by reconstructing the second feature map, and obtaining a fourth feature map as an optimization result of the second feature map, based on a difference value between the first feature map and the third feature map; and obtaining a bitstream file of a compressed image by performing entropy coding based on the hidden variable obtained based on the fourth feature map of a last downsampling back projection module.
    Type: Application
    Filed: February 28, 2022
    Publication date: September 8, 2022
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ge GAO, Pei YOU, Rong PAN
  • Patent number: D862424
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: October 8, 2019
    Assignee: DONGGUANG TINGBEI ELECTRONIC TECHNOLOGY CO.
    Inventor: Pei You
  • Patent number: D864166
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: October 22, 2019
    Assignee: DONGGUANG TINGBEI ELECTRONIC TECHNOLOGY CO., LTD.
    Inventor: Pei You