Abstract: Disclosed are a convex-linear bi-plane probe and its application method in prostate volume calculation. The present invention adopts the following technical solution: comprising a probe housing and a probe assembly contained in the probe housing, the probe assembly comprising a linear probe and a convex probe contained at the end of the linear probe, with the linear element inside the linear probe and the convex element inside the convex probe connected as one piece. The benefits of the present invention are that: by setting a convex probe at the end of the linear probe, and by connecting the linear element and the convex element as one, the volume of the probe can be significantly reduced. Furthermore, the use of convex-linear biplane probe and its integrated design collect two orthogonal ultrasound images of the prostate, which improves the accuracy of prostate volume calculation.

Abstract: The technology relates in part to production (i.e., expression) of recombinant viral fusion glycoproteins and nucleic acids that encode such viral fusion glycoproteins. In some embodiments, human respiratory syncytial virus fusion protein (RSV-F) and human parainfluenza virus 3 fusion protein (hPIV3-F) are expressed.

Abstract: A method of forming printed circuit boards and packaging substrates. After blind vias are created in a dielectric layer, a first seed layer is provided in the vias and on the dielectric layer. Copper is applied to fill the vias and to form a copper layer over the vias and over the first seed layer. The first seed layer and the copper layer are removed and a second seed layer is formed on the dielectric layer and the exposed surfaces of the vias. A wire pattern is then formed using a photo-sensitive thin film applied to the second seed layer, and the wires in the wire pattern are thickened. The photo-sensitive thin film and the exposed portions of the second seed layer are removed to form a first conductive pattern of wires. The process may be repeated to form a second conductive pattern of wires on the first pattern.

Abstract: A method of forming printed circuit boards and packaging substrates for integrated circuits based on filling-vias plating and a semi-additive process, comprising the following steps: (1) providing a dielectric layer on a substrate; (2) providing blind vias on said dielectric layer; (3) providing a first seed layer after providing blind vias; (4) providing solid conductive vias by a filling-vias plating process after providing a first seed layer, and also providing a copper layer covering the first seed layer during the filling-vias plating process; (5) removing said first seed layer as well as the copper layer formed thereon, and retaining solid copper pillars in the conductive vias; (6) providing a second seed layer which is used to form wires by a semi-additive process; (7) providing a photo-sensitive thin film, and providing a plating resistant layer by image-transfer to expose a wire pattern; (8) thickening wires; (9) removing the photo-sensitive thin film; (10) removing the exposed second seed layer and