Patents by Inventor Peifeng SI

Peifeng SI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10180710
    Abstract: Apparatuses, methods and storage media associated with a plurality of cooling devices thermally coupled to a plurality of heat-generating components of an electronic device, such as a server, a configured rack of servers, or a configured rack of server elements, are disclosed herein. Each cooling device may be associated with a unique cooling zone for the components. Logic may be coupled with the plurality of cooling devices, and the logic may be configured to cause a first cooling zone of a first cooling device to overlap a second cooling zone of a second cooling device. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: August 11, 2014
    Date of Patent: January 15, 2019
    Assignee: Intel Corporation
    Inventors: Yanbing Sun, Yongkang Wu, Jeff King, Peifeng Si
  • Publication number: 20170160775
    Abstract: Apparatuses, methods and storage media associated with a plurality of cooling devices thermally coupled to a plurality of heat-generating components of an electronic device, such as a server, a configured rack of servers, or a configured rack of server elements, are disclosed herein. Each cooling device may be associated with a unique cooling zone for the components. Logic may be coupled with the plurality of cooling devices, and the logic may be configured to cause a first cooling zone of a first cooling device to overlap a second cooling zone of a second cooling device. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: August 11, 2014
    Publication date: June 8, 2017
    Inventors: Yanbing SUN, Yongkang WU, Jeff KING, Peifeng SI