Abstract: Embodiments of this application provide a heat dissipation structure, a vehicle-mounted device, and a terminal device, which are used in the field of heat dissipation technologies. The heat dissipation structure includes a heat sink; a circuit board including at least one chip mounting region and at least one first position located outside the chip mounting region; at least one fixed connection structure located in the at least one first position and fastens the circuit board to the heat sink; and at least one elastic connection structure configured to provide an elastic force toward the heat sink for the chip mounting region.

Abstract: An electronic device includes a housing assembly, a circuit board, an electronic component, and a floating support assembly that are assembled together. Installation space is formed in the housing assembly. The circuit board, the electronic component, and the floating support assembly are all accommodated in the installation space. The circuit board is installed in the housing assembly. The electronic component is supported by the circuit board and is in signal communication with the circuit board. The floating support assembly is disposed on the circuit board to support the electronic component or disposed in the housing assembly to support the circuit board, so that the electronic component abuts against the housing assembly under an action of a pre-loading force of the floating support assembly.