Patents by Inventor Peihua Li

Peihua Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230185439
    Abstract: Disclosed herein are system, method, and computer program product embodiments for generating a graphical user interface (GUI) with a consolidated user incident report. In some embodiments, a server receives a set of data comprising a first set of data elements. The server incorporates the set of data on a graphical user interface (GUI). The set of data is rendered in a first portion of the GUI and the different set of data is rendered in a second portion of the GUI. The server further receives a request to delete one or more data elements of the set of data or the different set of data from the GUI. As such, the server consolidates the first and second portion into a combined portion on the GUI. The combined portion comprises the set of data and the different set of data excluding the one or more data elements.
    Type: Application
    Filed: December 13, 2021
    Publication date: June 15, 2023
    Inventors: Bizhong YE, Peihua Li, Yuchi Zhang, Wen Wang
  • Patent number: 10959319
    Abstract: A cooling package in a power module comprises a first side for placing one or more semiconductor components; one or more holes for placing one or more magnetic components; and a second side with one or more connection parts. Therefore, all components of a power module which need to dissipate the heat have two thermal dissipation paths, therefore the heat inside the module can be greatly reduced.
    Type: Grant
    Filed: October 25, 2016
    Date of Patent: March 23, 2021
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Tai Ma, Peihua Li
  • Publication number: 20200068700
    Abstract: A cooling package in a power module (401,503) comprises a first side for placing one or more semiconductor components (406,501); one or more holes for placing one or more magnetic components (305); and a second side with one or more connection parts. Therefore, all components of a power module (401,503) which need to dissipate the heat have two thermal dissipation paths, therefore the heat inside the module can be greatly reduced.
    Type: Application
    Filed: October 25, 2016
    Publication date: February 27, 2020
    Applicant: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Tai MA, Peihua LI
  • Patent number: 10333238
    Abstract: A surface mount contact (100) for coupling to an electronic device (200, 300), comprising: a conductive pin (10) having an elongated pin body (12), the pin body (12) comprising a first end (122) and a second end (124) opposing to the first end (122); and a heat re-flowable bonding member (20) coupled to the first end (122); wherein the pin body (12) is integrally provided with a support portion (14) in a region of the pin body (12) adjacent to the heat re-flowable bonding member (20). The cost and time of manufacture is reduced.
    Type: Grant
    Filed: August 6, 2015
    Date of Patent: June 25, 2019
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventor: Peihua Li
  • Publication number: 20180219311
    Abstract: A surface mount contact (100) for coupling to an electronic device (200, 300), comprising: a conductive pin (10) having an elongated pin body (12), the pin body (12) comprising a first end (122) and a second end (124) opposing to the first end (122); and a heat re-flowable bonding member (20) coupled to the first end (122); wherein the pin body (12) is integrally provided with a support portion (14) in a region of the pin body (12) adjacent to the heat re-flowable bonding member (20). The cost and time of manufacture is reduced.
    Type: Application
    Filed: August 6, 2015
    Publication date: August 2, 2018
    Inventor: Peihua Li