Patents by Inventor Peikang Liu
Peikang Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9520509Abstract: Various methods for preparing and/or processing electrically conductive aluminum members such as used in electronic circuits and components are described. Also described are various sheet assemblies using patterned aluminum conductive elements as components of electric circuitry. The sheet assemblies can be used as backsheets for back contact photovoltaic cells or as antennas for RFID tags.Type: GrantFiled: March 12, 2012Date of Patent: December 13, 2016Assignee: AVERY DENNISON RETAIL INFORMATION SERVICES, LLCInventors: Kourosh Kian, Peikang Liu, Stephen Li
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Publication number: 20150180094Abstract: A battery assembly includes a battery, an outer layer, and a power indicator apparatus. The battery includes a first terminal and a second terminal. The power indicator apparatus comprises an electrical conductor and a mechanical switch. The electrical conductor is configured to be in continuous electrical communication with the first terminal. The mechanical switch is configured to be actuated by an application of pressure at a single location, and upon actuation, to place the electrical conductor in electrical communication with the second terminal such that the power indicator apparatus can facilitate a reading of a potential energy stored in the battery. Methods of assembly and methods of determining a potential energy stored in the battery are also provided herein.Type: ApplicationFiled: July 18, 2013Publication date: June 25, 2015Inventors: Jamie Rieg, Anne Shim, John Walsh, Peikang Liu, Paul Janousek
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Publication number: 20140166098Abstract: Various methods for preparing and/or processing electrically conductive aluminum members such as used in electronic circuits and components are described. Also described are various sheet assemblies using patterned aluminum conductive elements as components of electric circuitry. The sheet assemblies can be used as backsheets for back contact photovoltaic cells or as antennas for RFID tags.Type: ApplicationFiled: March 12, 2012Publication date: June 19, 2014Applicant: Avery Dennison CorporationInventors: Kourosh Kian, Peikang Liu, Stephen Li
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Patent number: 8072333Abstract: A radio frequency identification (RIFD) inlay includes an electrical connection between a chip and an antenna. The electrical connection includes conductive interposer leads and a capacitive connection. The capacitive connection may involve putting the antenna and the interposer leads into close proximity, with dielectric pads therebetween, to allow capacitive coupling between the antenna and the interposer leads. The dielectric pads may include a non-conductive adhesive and a high dielectric material, such as a titanium oxide. The connections provide a convenient, fast, and effective way to operatively couple antennas and interposers. The RFID inlay may be part of an RFID label or RFID tag.Type: GrantFiled: May 23, 2007Date of Patent: December 6, 2011Assignee: Avery Dennison CorporationInventors: Scott Wayne Ferguson, David N. Edwards, Peikang Liu, Jason Munn, Ian J. Forster, Samuel A. Linder, Thomas Craig Weakley, David Puleston, Steven C. Kennedy, Christine U. Dang
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Patent number: 7477194Abstract: A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.Type: GrantFiled: December 5, 2005Date of Patent: January 13, 2009Assignee: Avery Dennison CorporationInventors: James P. Coleman, Scott Wayne Ferguson, Jaime C. Grunlan, Ian J. Forster, Andrew W. Holman, Peikang Liu
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Publication number: 20080060750Abstract: A method for assembling a semiconductor device from a plurality of chips is disclosed. The method includes providing a penetrable carrier having a penetrable carrier substrate and an adhesive layer; providing a plurality of chips disposed on a surface of the adhesive layer; providing a second substrate; bringing the surface of the adhesive layer of the penetrable carrier close to the second substrate; pinning the plurality of chips against the second substrate through the penetrable carrier; and, moving the penetrable carrier away from the second substrate such that the plurality of pinned chips are removed from the surface of the adhesive layer on the penetrable carrier.Type: ApplicationFiled: August 31, 2006Publication date: March 13, 2008Applicant: AVERY DENNISON CORPORATIONInventors: Haochuan Wang, Ali Mehrabi, Stephen Li, Kouroche Kian, Xiaoming He, Peikang Liu
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Patent number: 7333061Abstract: A radio frequency identification (RFID) device includes a conductive pattern, such as an antenna, on one side of a substrate, and a chip, such as part of a strap, electrically coupled to the conductive pattern, and either on an opposite side of the substrate or on the same side of the substrate as the antenna. A method of fabricating the RFID device may include crimping the strap onto the substrate, in contact with a seed layer, which is subsequently used in forming the antenna or other conductive pattern by plating. The seed layer may be a patterned conductive ink layer. Alternatively, the seed layer may be a layer of conductive material deposited on the substrate, such as by vacuum deposition. Parts of the deposited layer may be covered with a patterned mask in order to form the desired configuration of the conductive pattern.Type: GrantFiled: September 13, 2006Date of Patent: February 19, 2008Assignee: Avery Dennison CorporationInventors: Peikang Liu, Steven C. Kennedy, Christine U. Dang, Scott Wayne Ferguson, Jason D. Munn
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Publication number: 20070216534Abstract: A radio frequency identification (RIFD) inlay includes an electrical connection between a chip and an antenna. The electrical connection includes conductive interposer leads and a capacitive connection. The capacitive connection may involve putting the antenna and the interposer leads into close proximity, with dielectric pads therebetween, to allow capacitive coupling between the antenna and the interposer leads. The dielectric pads may include a non-conductive adhesive and a high dielectric material, such as a titanium oxide. The connections provide a convenient, fast, and effective way to operatively couple antennas and interposers. The RFID inlay may be part of an RFID label or RFID tag.Type: ApplicationFiled: May 23, 2007Publication date: September 20, 2007Inventors: Scott Ferguson, David Edwards, Peikang Liu, Jason Munn, Ian Forster, Samuel Linder, Thomas Weakley, David Puleston, Steven Kennedy, Christine Dang
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Patent number: 7224280Abstract: A radio frequency identification (RFID) inlay includes an electrical connection between a chip and an antenna. The electrical connection includes conductive interposer leads and a capacitive connection. The capacitive connection may involve putting the antenna and the interposer leads into close proximity, with dielectric pads therebetween, to allow capacitive coupling between the antenna and the interposer leads. The dielectric pads may include a non-conductive adhesive and a high dielectric material, such as a titanium oxide. The connections provide a convenient, fast, and effective way to operatively couple antennas and interposers. The RFID inlay may be part of an RFID lable or RFID tag.Type: GrantFiled: June 18, 2004Date of Patent: May 29, 2007Assignee: Avery Dennison CorporationInventors: Scott Wayne Ferguson, David N. Edwards, Peikang Liu, Jason Munn, Ian J. Forster, Samuel A. Linder, Thomas Craig Weakley, David Puleston, Steven C. Kennedy, Christine U. Dang
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Publication number: 20070008238Abstract: A radio frequency identification (RFID) device includes a conductive pattern, such as an antenna, on one side of a substrate, and a chip, such as part of a strap, electrically coupled to the conductive pattern, and either on an opposite side of the substrate or on the same side of the substrate as the antenna. A method of fabricating the RFID device may include crimping the strap onto the substrate, in contact with a seed layer, which is subsequently used in forming the antenna or other conductive pattern by plating. The seed layer may be a patterned conductive ink layer. Alternatively, the seed layer may be a layer of conductive material deposited on the substrate, such as by vacuum deposition. Parts of the deposited layer may be covered with a patterned mask in order to form the desired configuration of the conductive pattern.Type: ApplicationFiled: September 13, 2006Publication date: January 11, 2007Inventors: Peikang Liu, Steven Kennedy, Christine Dang, Scott Ferguson, Jason Munn
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Publication number: 20060283005Abstract: A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.Type: ApplicationFiled: August 25, 2006Publication date: December 21, 2006Inventors: James Coleman, Scott Ferguson, Jaime Grunlan, Ian Forster, Andrew Holman, Peikang Liu
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Patent number: 7120987Abstract: A radio frequency identification (RFID) device includes a conductive pattern, such as an antenna, on one side of a substrate, and a chip, such as part of a strap, electrically coupled to the conductive pattern, and either on an opposite side of the substrate or on the same side of the substrate as the antenna. A method of fabricating the RFID device may include crimping the strap onto the substrate, in contact with a seed layer, which is subsequently used in forming the antenna or other conductive pattern by plating. The seed layer may be a patterned conductive ink layer. Alternatively, the seed layer may be a layer of conductive material deposited on the substrate, such as by vacuum deposition. Parts of the deposited layer may be covered with a patterned mask in order to form the desired configuration of the conductive pattern.Type: GrantFiled: August 5, 2003Date of Patent: October 17, 2006Assignee: Avery Dennison CorporationInventors: Peikang Liu, Steven C. Kennedy, Christine U. Dang, Scott Wayne Ferguson, Jason D. Munn
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Patent number: 7102520Abstract: A radio frequency identification (RIFD) inlay includes an interposer that has a chip, and an antenna on an antenna substrate. The antenna substrate has a recess or hole, and the chip is at least partially in the recess or hole. By placing the chip or the interposer face down and at least partially in a recess or hole, thickness of the inlay may be reduced.Type: GrantFiled: June 18, 2004Date of Patent: September 5, 2006Assignee: Avery Dennison CorporationInventors: Peikang Liu, Jason Munn, Thomas Craig Weakley, Ian J. Forster
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Publication number: 20060076422Abstract: A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.Type: ApplicationFiled: December 5, 2005Publication date: April 13, 2006Inventors: James Coleman, Scott Ferguson, Jaime Grunlan, Ian Forster, Andrew Holman, Peikang Liu
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Patent number: 6867983Abstract: A device, such as a radio frequency identification (RFID) inlay structure for an RFID tag or label, includes a microstructure element, with leads coupling the microstructure element to other electrical or electronic components of the device. The leads may be electroless-plated leads, and may contact connectors of the microstructure element without the need for an intervening planarization layer.Type: GrantFiled: August 7, 2002Date of Patent: March 15, 2005Assignee: Avery Dennison CorporationInventors: Peikang Liu, Scott Wayne Ferguson, Dave N. Edwards, Yukihiko Sasaki
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Publication number: 20050035924Abstract: A radio frequency identification (RIFD) inlay includes an interposer that has a chip, and an antenna on an antenna substrate. The antenna substrate has a recess or hole, and the chip is at least partially in the recess or hole. By placing the chip or the interposer face down and at least partially in a recess or hole, thickness of the inlay may be reduced.Type: ApplicationFiled: June 18, 2004Publication date: February 17, 2005Inventors: Peikang Liu, Jason Munn, Thomas Weakley, Ian Forster
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Publication number: 20050032267Abstract: A radio frequency identification (RFID) device includes a conductive pattern, such as an antenna, on one side of a substrate, and a chip, such as part of a strap, electrically coupled to the conductive pattern, and either on an opposite side of the substrate or on the same side of the substrate as the antenna. A method of fabricating the RFID device may include crimping the strap onto the substrate, in contact with a seed layer, which is subsequently used in forming the antenna or other conductive pattern by plating. The seed layer may be a patterned conductive ink layer. Alternatively, the seed layer may be a layer of conductive material deposited on the substrate, such as by vacuum deposition. Parts of the deposited layer may be covered with a patterned mask in order to form the desired configuration of the conductive pattern.Type: ApplicationFiled: August 5, 2003Publication date: February 10, 2005Inventors: Peikang Liu, Steven Kennedy, Christine Dang, Scott Ferguson, Jason Munn
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Publication number: 20050001785Abstract: A radio frequency identification (RIFD) inlay includes an electrical connection between a chip and an antenna. The electrical connection includes conductive interposer leads and a capacitive connection. The capacitive connection may involve putting the antenna and the interposer leads into close proximity, with dielectric pads therebetween, to allow capacitive coupling between the antenna and the interposer leads. The dielectric pads may include a non-conductive adhesive and a high dielectric material, such as a titanium oxide. The connections provide a convenient, fast, and effective way to operatively couple antennas and interposers.Type: ApplicationFiled: June 18, 2004Publication date: January 6, 2005Inventors: Scott Ferguson, David Edwards, Peikang Liu, Jason Munn, Ian Forster, Samuel Linder, Thomas Weakley, David Puleston, Steven Kennedy, Christine Dang
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Publication number: 20040200061Abstract: A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.Type: ApplicationFiled: April 11, 2003Publication date: October 14, 2004Inventors: James P. Coleman, Ian J. Forster, Scott Wayne Ferguson, Jaime C. Grunlan, Andrew W. Holman, Peikang Liu
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Patent number: 6692873Abstract: An electrode active material forming composition, a separator forming composition and a manufacturing method of a lithium secondary battery using the compositions are provided.Type: GrantFiled: August 1, 2000Date of Patent: February 17, 2004Assignee: SKC Co., Ltd.Inventors: Chi-kyun Park, Archana Kakirde, Peikang Liu, Venkatesan Manivannan, Chul Chai, Dong-joon Ihm, Jon-ha Lee, Kwon-sun Roh