Patents by Inventor Pei-Liang Wang

Pei-Liang Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dual-layer flexible printed circuit
    Patent number: 8319110
    Abstract: A dual-layer flexible printed circuit is disclosed. The dual-layer flexible printed circuit includes an inner flexible printed circuit and an outer flexible printed circuit which overlaps the inner flexible printed circuit. The inner flexible printed circuit can be bent and forms a protrusion offset from the outer flexible printed circuit. The dual-layer flexible printed circuit further includes a fixing element to secure the protrusion to prevent the protrusion from extruding along a longitudinal direction of the dual-layer flexible printed circuit.
    Type: Grant
    Filed: June 11, 2010
    Date of Patent: November 27, 2012
    Assignee: Chi Mei Communication Systems, Inc.
    Inventor: Pei-Liang Wang
  • DUAL-LAYER FLEXIBLE PRINTED CIRCUIT
    Publication number: 20110114370
    Abstract: A dual-layer flexible printed circuit is disclosed. The dual-layer flexible printed circuit includes an inner flexible printed circuit and an outer flexible printed circuit which overlaps the inner flexible printed circuit. The inner flexible printed circuit can be bent and forms a protrusion offset from the outer flexible printed circuit. The dual-layer flexible printed circuit further includes a fixing element to secure the protrusion to prevent the protrusion from extruding along a longitudinal direction of the dual-layer flexible printed circuit.
    Type: Application
    Filed: June 11, 2010
    Publication date: May 19, 2011
    Applicant: CHI MEI COMMUNICATION SYSTEMS, INC.
    Inventor: PEI-LIANG WANG