Abstract: A method for manufacturing a semiconductor structure includes: forming a semiconductor device on a main region of the device substrate, the device substrate having a peripheral region surrounding the main region; forming a first filling layer on the peripheral region of the device substrate; forming a second filling layer over the first filling layer and the semiconductor device after forming the first filling layer, the second filling layer having a polishing rate different from that of the first filling layer; performing a planarization process over the second filling layer to remove a portion of the second filling layer so that a remaining portion of the second filling layer has a planarized surface opposite to the device substrate; and bonding the device substrate to a carrier substrate through the first filling layer and the remaining portion of the second filling layer.

Abstract: A circuit board includes a substrate and a metallic layer. A first area and at least one second area are defined on a portion of the substrate, the second area is located outside the first area. The metallic layer includes first test lines disposed on the first area and second test lines disposed on the second area. A first test pad of each of the first test lines has a first width, and a second test pad of each of the second test lines has a second width. The second width is greater than the first width such that probes of an electrical testing tool can contact the first and second test pads on the circuit board correctly during electrical testing.

Abstract: A dual-layer flexible printed circuit is disclosed. The dual-layer flexible printed circuit includes an inner flexible printed circuit and an outer flexible printed circuit which overlaps the inner flexible printed circuit. The inner flexible printed circuit can be bent and forms a protrusion offset from the outer flexible printed circuit. The dual-layer flexible printed circuit further includes a fixing element to secure the protrusion to prevent the protrusion from extruding along a longitudinal direction of the dual-layer flexible printed circuit.

Abstract: A dual-layer flexible printed circuit is disclosed. The dual-layer flexible printed circuit includes an inner flexible printed circuit and an outer flexible printed circuit which overlaps the inner flexible printed circuit. The inner flexible printed circuit can be bent and forms a protrusion offset from the outer flexible printed circuit. The dual-layer flexible printed circuit further includes a fixing element to secure the protrusion to prevent the protrusion from extruding along a longitudinal direction of the dual-layer flexible printed circuit.