Patents by Inventor Pei Pei Chen

Pei Pei Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220366121
    Abstract: A method includes the following operations: identifying a layer of a first layout based on a first violation generated on the layer; generating a metal density value associated with the layer; when the metal density value is larger than or equal to a preset value, classifying the first violation into a first class corresponding to routing congestions of the first layout; when the first violation is classified into the first class, assigning, to the first violation, a first operation of a plurality of first pre-stored operations corresponding to the first class; and performing the first operation to the first layout to generate a second layout.
    Type: Application
    Filed: July 27, 2022
    Publication date: November 17, 2022
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., TSMC NANJING COMPANY LIMITED
    Inventors: Yi-Lin CHUANG, Song LIU, Pei-Pei CHEN, Heng-Yi LIN, Shih-Yao LIN, Chin-Hsien WANG
  • Patent number: 11481536
    Abstract: A method includes the following operations: receiving design rule violations of a first layout; classifying, according to first chip features of the first layout, a first violation of the design rule violations into a first class of predefined classes; generating a first vector array for at least one of the first chip features of the first layout, that is associated with the first violation; selecting, according to the first vector array, first operations from pre-stored operations; generating a second layout based on the first layout and the first operations.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: October 25, 2022
    Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., TSMC NANJING COMPANY LIMITED
    Inventors: Yi-Lin Chuang, Song Liu, Pei-Pei Chen, Heng-Yi Lin, Shih-Yao Lin, Chin-Hsien Wang
  • Publication number: 20220147691
    Abstract: A method includes the following operations: receiving design rule violations of a first layout; classifying, according to first chip features of the first layout, a first violation of the design rule violations into a first class of predefined classes; generating a first vector array for at least one of the first chip features of the first layout, that is associated with the first violation; selecting, according to the first vector array, first operations from pre-stored operations; generating a second layout based on the first layout and the first operations.
    Type: Application
    Filed: December 8, 2020
    Publication date: May 12, 2022
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPNAY, LTD., TSMC NANJING COMPANY LIMITED
    Inventors: Yi-Lin CHUANG, Song LIU, Pei-Pei CHEN, Heng-Yi LIN, Shih-Yao LIN, Chin-Hsien WANG
  • Publication number: 20090308585
    Abstract: An improved method for manufacturing tube and fin heat exchangers that, according to a preferred embodiment, includes a process for increasing the stiffness and rigidity of heat exchanger fins. Stiffer fins have a greater tendency to maintain proper alignment within a stack of fins, which aids in lacing long stacks of fins with small (e.g., 5 mm) diameter tubing. Preferably, fin stiffness is increased by forming a plurality of longitudinal ribs within the fin during the fin stamping process. More preferably still, two ribs for each longitudinal row of collared holes are provided. The preferred embodiment also includes a slotted heat exchanger fin that is dimensioned and arranged for optimized thermodynamic performance when used with small diameter tubing, thus reducing the space required for a given heat exchanger system.
    Type: Application
    Filed: June 15, 2009
    Publication date: December 17, 2009
    Inventors: Pei Pei Chen, Russell Tharp
  • Patent number: D632374
    Type: Grant
    Filed: June 13, 2008
    Date of Patent: February 8, 2011
    Assignee: Goodman Global, Inc.
    Inventors: Pei Pei Chen, Russell Tharp