Patents by Inventor Peipei Dong

Peipei Dong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal material with thermodynamic anisotropy and a method of preparing the same
    Patent number: 11802345
    Abstract: A metal material having thermodynamic anisotropy has an X-axis hardness of 160-180 HV, an X-axis hardness thermal expansion coefficient of 5×10?6-100×10?6 K?1; a Y-axis hardness of 160-180 HV, a Y-axis hardness thermal expansion coefficient of 5×10?6-100×10?6 K?1; and a Z-axis hardness of 180-250 HV, a Z-axis hardness thermal expansion coefficient of 50×10?6-1000×10?6 K?1. A method for preparing a metal material having thermodynamic anisotropy is also disclosed.
    Type: Grant
    Filed: January 7, 2022
    Date of Patent: October 31, 2023
    Assignee: SUZHOU SHINHAO MATERIALS LLC
    Inventors: Yun Zhang, Jing Wang, Peipei Dong, Xingxing Zhang
  • METHOD FOR ELECTROPLATING NANOGRAINED COPPER
    Publication number: 20230257896
    Abstract: A method of electroplating nanograined copper on a substrate includes: providing the substrate; providing an electroplating bath that includes a copper salt, an acid, a leveler, a chlorine compound, an accelerator, a suppressor; and water; and electroplating the substrate in the electroplating bath to form the nanograined copper at room temperature. The suppressor is a ployether polyol compound, the nanograined copper has an average grain size of about 100 nm, and the nanograined copper has a resistivity of about 1.78-1.90 ?Ohm·cm. A nanograined copper prepared according to the method is also disclosed.
    Type: Application
    Filed: May 23, 2022
    Publication date: August 17, 2023
    Inventors: Yun ZHANG, Peipei DONG, Jing WANG
  • METAL MATERIAL WITH THERMODYNAMIC ANISOTROPY AND A METHOD OF PREPARING THE SAME
    Publication number: 20220127742
    Abstract: A metal material having thermodynamic anisotropy has an X-axis hardness of 160-180 HV, an X-axis hardness thermal expansion coefficient of 5×10-6-100×10-6 K?1; a Y-axis hardness of 160-180 HV, a Y-axis hardness thermal expansion coefficient of 5×10-6-100×10-6 K?1; and a Z-axis hardness of 180-250 HV, a Z-axis hardness thermal expansion coefficient of 50×10-6-1000×10-6 K?1. A method for preparing a metal material having thermodynamic anisotropy is also disclosed.
    Type: Application
    Filed: January 7, 2022
    Publication date: April 28, 2022
    Inventors: Yun ZHANG, Jing WANG, Peipei DONG, Xingxing ZHANG
  • METHOD OF ELECTROPLATING STRESS-FREE COPPER FILM
    Publication number: 20220064813
    Abstract: A method of electroplating a stress-free copper film on a substrate includes: providing the substrate; providing an electroplating bath that includes a copper salt, an acid, a leveler, a chlorine compound, an accelerator, a suppressor; and water; heating the electroplating bath to 25 to 60° C.; and electroplating the substrate in the electroplating bath to form the stress-free copper film while maintaining the electroplating bath at 25 to 60° C. The leveler is an organic compound containing an amine group. The method further includes annealing the stress-free copper film at 60-260° C. for 0.5 to 2 hours, or at 60-120° C. for 0.5 to 2 hours. A stress-free electroplated copper film is also disclosed.
    Type: Application
    Filed: February 3, 2021
    Publication date: March 3, 2022
    Inventors: Yun ZHANG, Xingxing ZHANG, Volker WOHLFARTH, Jing WANG, Peipei DONG, Wei ZHAO
  • Metal material with thermodynamic anisotropy and a method of preparing the same
    Patent number: 11242607
    Abstract: A metal material having thermodynamic anisotropy has an X-axis hardness of 160-180 HV, an X-axis hardness thermal expansion coefficient of 5×10-6-100×10-6 K?1; a Y-axis hardness of 160-180 HV, a Y-axis hardness thermal expansion coefficient of 5×10-6-100×10-6 K?1; and a Z-axis hardness of 180-250 HV, a Z-axis hardness thermal expansion coefficient of 50×10-6-1000×10-6 K?1. A method for preparing a metal material having thermodynamic anisotropy is also disclosed.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: February 8, 2022
    Assignee: SUZHOU SHINHAO MATERIALS LLC
    Inventors: Yun Zhang, Jing Wang, Peipei Dong, Xingxing Zhang
  • A METAL MATERIAL WITH THERMODYNAMIC ANISOTROPY AND A METHOD OF PREPARING THE SAME
    Publication number: 20210017660
    Abstract: A metal material having thermodynamic anisotropy has an X-axis hardness of 160-180 HV, an X-axis hardness thermal expansion coefficient of 5×10-6-100×10-6 K?1; a Y-axis hardness of 160-180 HV, a Y-axis hardness thermal expansion coefficient of 5×10-6-100×10-6 K?1; and a Z-axis hardness of 180-250 HV, a Z-axis hardness thermal expansion coefficient of 50×10-6-1000×10-6 K?1. A method for preparing a metal material having thermodynamic anisotropy is also disclosed.
    Type: Application
    Filed: March 1, 2019
    Publication date: January 21, 2021
    Inventors: Yun ZHANG, Jing WANG, Peipei DONG, Xingxing ZHANG
  • Leveler, leveler composition and method for electrodeposition of metals in microelectronics
    Patent number: 10683275
    Abstract: The present application discloses a levelling compound for electrodepositing metals.
    Type: Grant
    Filed: April 20, 2019
    Date of Patent: June 16, 2020
    Assignee: SHINHAO MATERIALS LLC
    Inventors: Yun Zhang, Tao Ma, Peipei Dong, Zifang Zhu, Chen Chen
  • LEVELER, LEVELER COMPOSITION AND METHOD FOR ELECTRODEPOSITION OF METALS IN MICROELECTRONICS
    Publication number: 20190263773
    Abstract: The present application discloses a levelling compound for electrodepositing metals.
    Type: Application
    Filed: April 20, 2019
    Publication date: August 29, 2019
    Inventors: Yun ZHANG, Tao MA, Peipei DONG, Zifang ZHU, Chen CHEN
  • Leveler, leveler composition and method for electrodeposition of metals in microelectronics
    Patent number: 10323015
    Abstract: The present disclosure relates to a leveling compound for electrodepositing metals.
    Type: Grant
    Filed: June 14, 2016
    Date of Patent: June 18, 2019
    Assignee: Shinhao Materials LLC
    Inventors: Yun Zhang, Tao Ma, Peipei Dong, Zifang Zhu, Chen Chen
  • Leveling composition and method for electrodeposition of metals in microelectronics
    Patent number: 9920023
    Abstract: The present disclosure relates to a leveling composition for electrodepositing metals.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: March 20, 2018
    Assignee: Suzhou Shinhao Materials LLC
    Inventors: Yun Zhang, Tao Ma, Peipei Dong
  • LEVELING COMPOSITION AND METHOD FOR ELECTRODEPOSITION OF METALS IN MICROELECTRONICS
    Publication number: 20170101389
    Abstract: The present disclosure relates to a leveling composition for electrodepositing metals.
    Type: Application
    Filed: December 22, 2016
    Publication date: April 13, 2017
    Applicant: Shinhao Materials LLC
    Inventors: Yun Zhang, Tao Ma, Peipei Dong
  • Leveler, Leveler Composition and Method for Electrodeposition of Metals in Microelectronics
    Publication number: 20170029400
    Abstract: The present disclosure relates to a leveling compound for electrodepositing metals.
    Type: Application
    Filed: June 14, 2016
    Publication date: February 2, 2017
    Applicant: Shinhao Materials LLC
    Inventors: Yun Zhang, Tao Ma, Peipei Dong, Zifang Zhu, Chen Chen
  • Leveling composition and method for electrodeposition of metals in microelectronics
    Patent number: 9551081
    Abstract: The present disclosure relates to a leveling composition for electrodepositing metals.
    Type: Grant
    Filed: May 5, 2014
    Date of Patent: January 24, 2017
    Assignee: Shinhao Materials LLC
    Inventors: Yun Zhang, Tao Ma, Peipei Dong
  • LEVELING COMPOSITION AND METHOD FOR ELECTRODEPOSITION OF METALS IN MICROELECTRONICS
    Publication number: 20150368819
    Abstract: The present disclosure relates to a leveling composition for electrodepositing metals.
    Type: Application
    Filed: May 5, 2014
    Publication date: December 24, 2015
    Inventors: Yun Zhang, Tao Ma, Peipei Dong