Patents by Inventor Peipei WANG
Peipei WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240124576Abstract: The present invention provides a preparation of a Siglec-15 binding protein and the use thereof, and specifically relates to an isolated antigen-binding protein, which comprises HCDR3. Provided is the use of the antigen-binding protein in the prevention and treatment of diseases.Type: ApplicationFiled: February 22, 2022Publication date: April 18, 2024Inventors: Xinxiu Yang, Chunyin GU, Zongda WANG, Xiaodan CAO, Xiaowu LIU, Peipei LIU, Lu YANG, Sujun DENG, Zhongzong PAN, Xueping WANG
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Publication number: 20240117034Abstract: Provided is an GARP protein antibody, and a cell comprising or expressing the GA RP protein antibody. The GARP protein antibody binds to human GARP/human TGF-?1 complex with a KD value of about 1.0E-12 or less. Also provided are a pharmaceutical combination comprising the GARP protein antibody and an immune checkpoint inhibitor and use thereof.Type: ApplicationFiled: January 17, 2022Publication date: April 11, 2024Applicants: SHANGHAI JEMINCARE PHARMACEUTICAL CO., LTD., JIANGXI JEMINCARE GROUP CO., LTD.Inventors: Jianjian ZHANG, Zhongzong PAN, Xinxiu YANG, Xiaowu LIU, Lu YANG, Peipei LIU, Xiaodan CAO, Sujun DENG, Xueping WANG
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Publication number: 20240112930Abstract: A chamber arrangement includes a chamber body, a substrate support, and a laser source. The substrate support is arranged within the chamber body and supported for rotation about a rotation axis relative to the chamber body. The laser source is arranged outside of the chamber body and optically coupled to the substrate support along a lasing axis. The lasing axis intersects the substrate support at a location radially outward from an outer periphery of a substrate seated on the substrate support. A semiconductor processing system and a material layer deposition method are also described.Type: ApplicationFiled: September 27, 2023Publication date: April 4, 2024Inventors: Fan Gao, Peipei Gao, Wentao Wang, Kai Zhou, Kishor Patil, Han Ye, Xing Lin, Alexandros Demos
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Publication number: 20240103961Abstract: A Peripheral Component Interconnect express (PCIe) fault auto-repair method is provided. According to the method, when a PCIe link in a system runs, an operation state of the system is monitored by acquiring a Correctable Error (CE) error count and an Uncorrectable Error (UCE) error count in the PCIe link; when the CE error count reaches a corresponding error threshold value, or the UCE error count reaches a corresponding error threshold value, an error device is removed from the system to avoid continuous adverse influence of the error device on operation of the system. Moreover, an SI parameter register of the error device is modified according to pre-stored optimization parameters of all PCIe devices in a server, the SI parameter of the error device is automatically optimized, and the error device is re-accessed to the system after the PCIe fault repair.Type: ApplicationFiled: April 28, 2022Publication date: March 28, 2024Applicant: SHANDONG YINGXIN COMPUTER TECHNOLOGIES CO., LTD.Inventor: Peipei WANG
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Publication number: 20240071805Abstract: Methods, systems, and assemblies suitable for gas-phase processes are disclosed. An exemplary assembly includes a susceptor ring and at least one injector tube. The injector tube can be disposed within the susceptor ring to provide a gas to a lower chamber area of a reactor. Methods, systems, and assemblies can be used to obtain desired etching and purging of the lower chamber area.Type: ApplicationFiled: August 28, 2023Publication date: February 29, 2024Inventors: Han Ye, Peipei Gao, Wentao Wang, Aniket Chitale, Xing Lin, Alexandros Demos, Yanfu Lu
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Publication number: 20240071804Abstract: Methods, systems, and assemblies suitable for gas-phase processes are disclosed. An exemplary assembly includes a susceptor ring and at least one injector tube. The injector tube can be disposed within the susceptor ring to provide a gas to a peripheral region of a substrate. Methods, systems, and assemblies can be used to obtain desired (e.g. composition and/or thickness) profiles of material on a substrate surface.Type: ApplicationFiled: August 28, 2023Publication date: February 29, 2024Inventors: Peipei Gao, Wentao Wang, Han Ye, Kai Zhou, Fan Gao, Xing Lin
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Publication number: 20230331949Abstract: Environmentally friendly, sustainable, and high-performance ultralight composite foams are disclosed. The composite foams are prepared from cellulose nanomaterial, polymeric material, and a crosslinking agent. The fabrication process is simple and uses only water. The composite foams exhibit an elastic strain exceeding the values reported for known nanocellulose-based foams with no reinforcement. The foams exhibit a thermal conductivity superior to that of traditional insulating materials and retain structural integrity after burning.Type: ApplicationFiled: June 21, 2023Publication date: October 19, 2023Inventors: Xiao Zhang, Aboutaleb Ameli, Peipei Wang
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Publication number: 20230295144Abstract: The present invention provides a 2-polysubstituted aromatic ring-pyrimidine derivative and an optical isomer thereof, or a pharmaceutically acceptable salt or solvate thereof, the compound, and an optical isomer thereof or a pharmaceutically thereof acceptable salts or solvates can be used in the preparation of anti-tumor drugs. The invention designs and synthesizes a series of novel small molecule Chk1 inhibitors by using N-substituted pyridin-2-aminopyrimidine obtained by structure-based virtual screening as a lead compound, and carries out Chk1 kinase inhibitory activity test. The experiment confirmed that said compounds possess potent anticancer activity, Chk1 kinase inhibitory activity, and are promising Chk1 inhibitors, and can be used as new cancer therapeutic drugs, which can be applied to treat solid tumors or hematologic tumors related to proliferative disease of human or animal.Type: ApplicationFiled: January 24, 2023Publication date: September 21, 2023Inventors: Tao Liu, Jia Li, Yongzhou Hu, Yubo Zhou, Xiaowu Dong, Anhui Gao, Pinrao Song, Peipei Wang, Lexian Tong, Xiaobei Hu, Mingbo Su
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Patent number: 11725091Abstract: Environmentally friendly, sustainable, and high-performance ultralight composite foams are disclosed. The composite foams are prepared from cellulose nanomaterial, polymeric material, and a crosslinking agent. The fabrication process is simple and uses only water. The composite foams exhibit an elastic strain exceeding the values reported for known nanocellulose-based foams with no reinforcement. The foams exhibit a thermal conductivity superior to that of traditional insulating materials and retain structural integrity after burning.Type: GrantFiled: June 12, 2020Date of Patent: August 15, 2023Assignee: Washington State UniversityInventors: Xiao Zhang, Aboutaleb Ameli, Peipei Wang
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Publication number: 20230245999Abstract: Embodiments of the present disclosure provide a microelectronic assembly comprising: a first integrated circuit (IC) die in a first layer; an interposer in a second layer not coplanar with the first layer, the first layer coupled to the second layer by interconnects having a pitch of less than 10 micrometers between adjacent interconnects; and a first conductive pathway and a second conductive pathway in the interposer coupling the first IC die and a second IC die. The first IC die is configured to transmit at a first supply voltage through the first conductive pathway to a second IC die, the second IC die is configured to transmit to the first IC die through the second conductive pathway at a second supply voltage simultaneously with the first die transmitting at the first supply voltage, and the first supply voltage is different from the second supply voltage.Type: ApplicationFiled: January 31, 2022Publication date: August 3, 2023Applicant: Intel CorporationInventors: Gerald S. Pasdast, Peipei Wang, Adel A. Elsherbini
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Publication number: 20230230923Abstract: A microelectronic device, a semiconductor package including the device, an IC device assembly including the package, and a method of making the device. The device includes a substrate; physical layer (PHY) circuitry on the substrate including a plurality of receive (RX) circuits and a plurality of transmit (TX) circuits; electrical contact structures at a bottom surface of the device; signal routing paths extending between the electrical contact structures on one hand, and, on another hand, at least some of the RX circuits or at least some of the TX circuits; and electrical pathways leading to the PHY circuitry and configured such that at least one of: an enable signal input to the device is to travel through at least some of the electrical pathways to enable a portion of the PHY circuitry; or a disable signal input to the device is to travel through at least some of the electrical pathways to disable a corresponding portion of the PHY circuitry.Type: ApplicationFiled: May 26, 2022Publication date: July 20, 2023Applicant: Intel CorporationInventors: Gerald Pasdast, Zhiguo Qian, Sathya Narasimman Tiagaraj, Lakshmipriya Seshan, Peipei Wang, Debendra Das Sharma, Srikanth Nimmagadda, Zuoguo Wu, Swadesh Choudhary, Narasimha Lanka
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Publication number: 20230210779Abstract: An ibuprofen controlled-release tablet and a method for preparing same are provided. The controlled-release tablet is composed of a drug-containing immediate-release layer and a drug-containing sustained-release layer, wherein a mass of ibuprofen in the drug-containing sustained-release layer is greater than a mass of ibuprofen in the drug-containing immediate-release layer, and a ratio of the mass of the ibuprofen in the drug-containing sustained-release layer to the mass of the ibuprofen in the drug-containing immediate-release layer is ?7. The tablet of the present disclosure has an effective analgesic effect for 24 h after administration.Type: ApplicationFiled: March 8, 2023Publication date: July 6, 2023Applicant: OVERSEAS PHARMACEUTICALS, LTD.Inventors: Xiaoguang WEN, Xiaofeng HUANG, Dachuan ZHAO, Jun FAN, Chenliang ZHANG, Peipei WANG, Min LI
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Publication number: 20230197675Abstract: Embodiments of the present disclosure provide a microelectronic assembly comprising: a first integrated circuit (IC) die, the first IC die comprising an input/output (IO) circuit; and a plurality of IC dies, the plurality of IC dies comprising a second IC die, the second IC die comprising a microcontroller circuit to control the IO circuit, wherein the first IC die and the plurality of IC dies are coupled with interconnects having a pitch of less than 10 micrometers between adjacent ones of the interconnects.Type: ApplicationFiled: December 16, 2021Publication date: June 22, 2023Applicant: Intel CorporationInventors: Gerald S. Pasdast, Yidnekachew Mekonnen, Adel A. Elsherbini, Peipei Wang, Vivek Kumar Rajan, Georgios Dogiamis
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Publication number: 20230197676Abstract: A microelectronic assembly is provided, comprising: a first integrated circuit (IC) die having a first connection to a first serializer/deserializer (SERDES) circuit and a second connection to a second SERDES circuit; a second IC die having the first SERDES circuit; and a third IC die having the second SERDES circuit, in which the first IC die is in a first layer, the second IC die and the third IC die are in a second layer not coplanar with the first layer, the first layer and the second layer are coupled by interconnects having a pitch of less than 10 micrometers between adjacent ones of the interconnects, and the first SERDES circuit and the second SERDES circuit are coupled by a conductive pathway.Type: ApplicationFiled: December 21, 2021Publication date: June 22, 2023Applicant: Intel CorporationInventors: Gerald S. Pasdast, Adel A. Elsherbini, Nevine Nassif, Carleton L. Molnar, Vivek Kumar Rajan, Peipei Wang, Shawna M. Liff, Tejpal Singh, Johanna M. Swan
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Patent number: 11681135Abstract: A structured illumination microscopic imaging system includes a structured illumination source. A beam shaping lens, an excitation optical filter and a dichroic mirror are provided on the emission light path of the structured illumination source in sequence. An objective lens and a sample are provided on the first optical path of the dichroic mirror in sequence. An emission optical filter, a tube lens, and a detector are provided on the second optical path of the dichroic mirror in sequence. The super-resolution microscopic images with a higher signal-to-noise ratio and higher contrast can be obtained under the premise of lowering the installation and processing precision requirements of the structured illumination microscopic imaging system. Compared to a structured light microscopic imaging system based on digital micromirror arrays or gratings, the system cost is reduced and the system stability is higher.Type: GrantFiled: June 20, 2017Date of Patent: June 20, 2023Assignee: Suzhou Institute of Biomedical Engineering and Technology, Chinese Academy of SciencesInventors: Daxi Xiong, Xibin Yang, Peipei Wang
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Patent number: 11591325Abstract: The present invention provides a 2-polysubstituted aromatic ring-pyrimidine derivative and an optical isomer thereof, or a pharmaceutically acceptable salt or solvate thereof, the compound, and an optical isomer thereof or a pharmaceutically thereof acceptable salts or solvates can be used in the preparation of anti-tumor drugs. The invention designs and synthesizes a series of novel small molecule Chk1 inhibitors by using N-substituted pyridin-2-aminopyrimidine obtained by structure-based virtual screening as a lead compound, and carries out Chk1 kinase inhibitory activity test. The experiment confirmed that said compounds possess potent anticancer activity, Chk1 kinase inhibitory activity, and are promising Chk1 inhibitors, and can be used as new cancer therapeutic drugs, which can be applied to treat solid tumors or hematologic tumors related to proliferative disease of human or animal.Type: GrantFiled: November 8, 2017Date of Patent: February 28, 2023Assignees: ZHEJIANG UNIVERSITY, SHANGHAI INSTITUTE OF MATERIA MEDICA, CHINESE ACADEMY OF SCIENCESInventors: Tao Liu, Jia Li, Yongzhou Hu, Yubo Zhou, Xiaowu Dong, Anhui Gao, Pinrao Song, Peipei Wang, Lexian Tong, Xiaobei Hu, Mingbo Su
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Publication number: 20220393672Abstract: Embodiments herein relate to a clock interpolation system. The system may be configured to identify, at a change in logical state of a recovered clock signal, a logical state of a first signal when the first signal is delayed by a delay value. The system may be further configured to identify, at a change in logical state of a second signal, a logical state of the clock signal when the clock signal is delayed by the delay value. Based on the two identifications, the delay value and/or a timing of the clock signal may be adjusted. Other embodiments may be described and/or claimed.Type: ApplicationFiled: August 17, 2022Publication date: December 8, 2022Inventors: Jayen Desai, Gerald Pasdast, Peipei Wang, Debendra Das Sharma
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Publication number: 20220327276Abstract: In one embodiment, an apparatus includes a first die comprising: a die-to-die adapter to communicate with protocol layer circuitry and physical layer circuitry, where the die-to-die adapter is to receive first information of a first interconnect protocol; and the physical layer circuitry coupled to the die-to-die adapter. The physical layer circuitry is configured to receive and output the first information to a second die via an interconnect and comprises: a first plurality of transmitters to transmit data via a first plurality of data lanes; and at least one redundant transmitter. The physical layer circuitry may be configured to remap a first data lane of the first plurality of data lanes to the at least one redundant transmitter. Other embodiments are described and claimed.Type: ApplicationFiled: June 20, 2022Publication date: October 13, 2022Inventors: Lakshmipriya Seshan, Gerald Pasdast, Peipei Wang, Narasimha Lanka, Swadesh Choudhary, Zuoguo Wu, Debendra Das Sharma
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Patent number: 11428730Abstract: A method includes receiving data characterizing an output of a sensor coupled to an industrial equipment. The output can include a sum of a first secondary coil and a voltage of a second secondary coil. The first secondary coil can be included in a first circuit and the second secondary coil can be included in second circuit configured within the sensor. The method can also include determining an integrity state of a circuit configured within the sensor. The integrity state can be determined based on the received data. The integrity state can identify a state of operation of the circuit configured within the sensor. The method can further include providing the integrity state. Related systems, techniques, and non-transitory computer readable mediums are also described.Type: GrantFiled: July 2, 2020Date of Patent: August 30, 2022Assignee: BAKER HUGHES OILFIELD OPERATIONS LLCInventors: Jianjun Jiang, Guijun Zhang, Peipei Wang, Daniel Zahi Abawi
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Publication number: 20220271912Abstract: Embodiments herein may relate to a die for use in a multi-die package. The die may include clock circuitry that is able to identify a phase of a data signal to be transmitted and a phase of a clock signal to be transmitted on a die-to-die (D2D) link. The clock circuitry may further be configured adjust the phase of the clock signal such that the phase of the clock signal is approximately 90 degrees from the phase of the data signal such that the clock signal and the data signal are received by a receiver die of the D2D link with a 90 degree phase difference. Other embodiments may be described and claimed.Type: ApplicationFiled: May 12, 2022Publication date: August 25, 2022Inventors: Gerald Pasdast, Peipei Wang, Lakshmipriya Seshan, Juan Zeng, Zuoguo Wu, Zhiguo Qian, Narasimha Lanka, Debendra Das Sharma, Swadesh Choudhary