Patents by Inventor Peiwang CHEN

Peiwang CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HINGE MECHANISM FOR ELECTRONIC DEVICE
    Publication number: 20230244280
    Abstract: Various embodiments relate to an electronic device with a first panel and a second panel coupled by a hinge mechanism. The electronic device may include a first wire that communicatively couples components of the first panel with components of the second panel. The wire may pass through the hinge mechanism, and be tensioned by a tensioning mechanism that provides tension to the first wire when the electronic device is in an open position and a closed position. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: January 28, 2022
    Publication date: August 3, 2023
    Inventors: Denica N. Larsen, Ming-Chia Lee, Naoki Matsumura, Prosenjit Ghosh, Jordan E. Maslov, Peiwang Chen
  • SEMI-FINISHED PRODUCT FOR THE PRODUCTION OF CONNECTION SYSTEMS FOR ELECTRONIC COMPONENTS
    Publication number: 20200305279
    Abstract: A semi-finished product for the production of connection systems for electronic components including two groups (A, B) of alternately applied conductive layers and insulating layers, wherein first layers (2, 2?) of the two groups (A, B) are facing each other to form a separation area for the groups (A, B) to be separated from each other to yield connection systems and the separation area is overlapped and sealed on all sides thereof at least by the two insulating layers (4, 4?) following the separation area.
    Type: Application
    Filed: June 10, 2020
    Publication date: September 24, 2020
    Inventors: Peiwang CHEN, Nikolaus BAUER-OPPINGER
  • Semi-finished product for the production of connection systems for electronic components and method
    Patent number: 10729013
    Abstract: A semi-finished product for the production of connection systems for electronic components comprises two groups (A, B) of alternately applied conductive layers and insulating layers, wherein outer layers (2, 2?) of the two groups (A, B) are facing each other to form a separation area for the groups (A, B) to be separated from each other to yield connection systems for electronic components and the separation area is overlapped and sealed on all sides thereof at least by the two insulating layers (4, 4?) following the separation area.
    Type: Grant
    Filed: May 14, 2015
    Date of Patent: July 28, 2020
    Assignee: AT&S (CHINA) (CO., LTD.
    Inventors: Peiwang Chen, Nikolaus Bauer-Oppinger
  • SEMI-FINISHED PRODUCT FOR THE PRODUCTION OF CONNECTION SYSTEMS FOR ELECTRONIC COMPONENTS AND METHOD
    Publication number: 20170079145
    Abstract: A semi-finished product for the production of connection systems for electronic components comprises two groups (A, B) of alternately applied conductive layers and insulating layers, wherein outer layers (2, 2?) of the two groups (A, B) are facing each other to form a separation area for the groups (A, B) to be separated from each other to yield connection systems for electronic components and the separation area is overlapped and sealed on all sides thereof at least by the two insulating layers (4, 4?) following the separation area.
    Type: Application
    Filed: May 14, 2015
    Publication date: March 16, 2017
    Inventors: Peiwang CHEN, Nikolaus BAUER-OPPINGER