Patents by Inventor Pei-Wen Hung

Pei-Wen Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11955379
    Abstract: A metal adhesion layer may be formed on a bottom and a sidewall of a trench prior to formation of a metal plug in the trench. A plasma may be used to modify the phase composition of the metal adhesion layer to increase adhesion between the metal adhesion layer and the metal plug. In particular, the plasma may cause a shift or transformation of the phase composition of the metal adhesion layer to cause the metal adhesion layer to be composed of a (111) dominant phase. The (111) dominant phase of the metal adhesion layer increases adhesion between the metal adhesion layer.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Pei-Wen Wu, Chun-I Tsai, Chi-Cheng Hung, Jyh-Cherng Sheu, Yu-Sheng Wang, Ming-Hsing Tsai
  • Patent number: 11540297
    Abstract: The present invention provides a wireless communication method of a wireless device, wherein the wireless device includes a first wireless module and a second wireless module, and the wireless communication method includes the steps of: using the first wireless module to receive frame exchange information from the second wireless module, wherein the frame exchange information comprises timing of signal transmission and signal reception of the second wireless module; and scheduling signal transmission and signal reception of the first wireless module according to the frame exchange information of the second wireless module.
    Type: Grant
    Filed: May 6, 2020
    Date of Patent: December 27, 2022
    Assignee: MEDIATEK INC.
    Inventors: Tsai-Yuan Hsu, Pei-Wen Hung
  • Patent number: 11324048
    Abstract: A communications apparatus includes a plurality of communications circuits and a coexistence management circuit. Each communications circuit is configured to provide wireless communications services in compliance with a protocol. The coexistence management circuit is configured to manage radio activities of the communications circuits. In response to a detection result of at least two radio activities to occur in a subsequent packet time, the coexistence management circuit is configured to determine whether an interference signal related to said at least two radio activities falls in a predetermined frequency band, and when the interference signal falls in the predetermined frequency band, the coexistence management circuit is configured to adjust a transmission power or an execution time of one of said at least two radio activities.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: May 3, 2022
    Assignee: MEDIATEK INC.
    Inventors: Yu-Ming Lai, Kai-Hsiang Yang, Wen-Ying Chien, Tsai-Yuan Hsu, Yu-Hsien Chang, Yu-Ming Wen, Ying-Che Hung, Pei-Wen Hung
  • Publication number: 20200413448
    Abstract: A communications apparatus includes a plurality of communications circuits and a coexistence management circuit. Each communications circuit is configured to provide wireless communications services in compliance with a protocol. The coexistence management circuit is configured to manage radio activities of the communications circuits. In response to a detection result of at least two radio activities to occur in a subsequent packet time, the coexistence management circuit is configured to determine whether an interference signal related to said at least two radio activities falls in a predetermined frequency band, and when the interference signal falls in the predetermined frequency band, the coexistence management circuit is configured to adjust a transmission power or an execution time of one of said at least two radio activities.
    Type: Application
    Filed: June 17, 2020
    Publication date: December 31, 2020
    Inventors: Yu-Ming Lai, Kai-Hsiang Yang, Wen-Ying Chien, Tsai-Yuan Hsu, Yu-Hsien Chang, Yu-Ming Wen, Ying-Che Hung, Pei-Wen Hung
  • Publication number: 20200374895
    Abstract: The present invention provides a wireless communication method of a wireless device, wherein the wireless device includes a first wireless module and a second wireless module, and the wireless communication method includes the steps of: using the first wireless module to receive frame exchange information from the second wireless module, wherein the frame exchange information comprises timing of signal transmission and signal reception of the second wireless module; and scheduling signal transmission and signal reception of the first wireless module according to the frame exchange information of the second wireless module.
    Type: Application
    Filed: May 6, 2020
    Publication date: November 26, 2020
    Inventors: Tsai-Yuan Hsu, Pei-Wen Hung
  • Publication number: 20050113153
    Abstract: A flip mobile phone includes a main body, a cover and a conducting device having a turning portion. The main body has a first pivot portion, and the cover has a second pivot portion. The second pivot portion is coupled with the first pivot portion so that the cover is able to rotate with respect to the main body. In the interior of the first pivot portion and the second pivot portion, there is a hollow portion used for receiving the conducting device which electrically connects the main body and the cover. The conducting device has a transiting component which is equipped on the turning portion, and has a first wire end and a second wire end which is connected to the main body and the cover respectively. The first wire end and the second wire end are electrically connected to the transiting component respectively.
    Type: Application
    Filed: November 8, 2004
    Publication date: May 26, 2005
    Inventors: Pei-Wen Hung, Jen-Cheng Lai, Yu-Chuan Chang
  • Patent number: D660732
    Type: Grant
    Filed: February 23, 2011
    Date of Patent: May 29, 2012
    Assignee: Nest Labs, Inc.
    Inventors: Fred Bould, John Benjamin Filson, Brian Huppi, David Sloo, Erik Charlton, Matthew Lee Rogers, Michael James Matas, Pei-Wen Hung, Shigefumi Honjo, Anthony Michael Fadell