Patents by Inventor Pek Chuan Quek

Pek Chuan Quek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8563874
    Abstract: An electromagnetic interference shielding arrangement comprises a first and a second electro-conductive components that are arranged to be joined. The first electro-conductive component includes a first electro-conductive contact surface. The second electro-conductive component includes a second electro-conductive contact surface and a shielding member extending from the second electro conductive component at a location adjacent the second electro-conductive surface. The arrangement is such that, in the joined configuration of the first and the second electro-conductive components the first and the second electro-conductive surfaces abut to create an electro conductive engagement region that is adjacent the shielding member.
    Type: Grant
    Filed: April 20, 2010
    Date of Patent: October 22, 2013
    Assignee: Amtek Precision Technology Pte Ltd.
    Inventors: Pek Chuan Quek, Mun Ping Wong
  • Publication number: 20130025928
    Abstract: An electromagnetic interference shielding arrangement comprises a first and a second electro-conductive components that are arranged to be joined. The first electro-conductive component includes a first electro-conductive contact surface. The second electro-conductive component includes a second electro-conductive contact surface and a shielding member extending from the second electro conductive component at a location adjacent the second electro-conductive surface. The arrangement is such that, in the joined configuration of the first and the second electro-conductive components the first and the second electro-conductive surfaces abut to create an electro conductive engagement region that is adjacent the shielding member.
    Type: Application
    Filed: April 20, 2010
    Publication date: January 31, 2013
    Inventors: Pek Chuan Quek, Mun Ping Wong
  • Publication number: 20070197056
    Abstract: A computer system includes a first circuit board and a second circuit board which is detachably coupled to the first circuit board via a specially designed I/O connector. When coupled together, the main board and the I/O card are positioned within a same plane by which, a computer system is configured with easy customizable printed circuit boards without substantially increase of the overall physical dimension. In the event that the first circuit board or the second circuit board needs to be modified, the two circuit boards can be detached from each other and after the modification, the two circuit boards can be coupled together again with the same connector to resume the functions of the computer system. Embodiments of the present invention provide effective and convenient solutions for reconfiguration, upgrading, addition and/or removal of external I/O ports in computer systems without redesigning and/or replacing the whole motherboard.
    Type: Application
    Filed: February 13, 2007
    Publication date: August 23, 2007
    Inventors: Jian Huang, Yew Heng Seow, Pek Chuan Quek