Abstract: This invention provides inexpensively hermetically packaged optoelectronic chips. Multiple similar or dissimilar optoelectronic chips can be produced according to the present methods. Additionally, the chips may include a heat sink for efficient thermal management and elements for wavelength conversion without compromising their efficiency or quality. Furthermore, optical structures are provided to allow optimization of optical performance.

Abstract: Provided is a method for applying a security marking to an object and a hyper-spectral imaging device to readout the embedded information in the security marking to verify the object's authenticity. The present invention relates generally to the field of security markings and anti-counterfeiting technologies. More particularly to optical product authentication methods, which are based on photoactive nanoparticles emitting in visible and near-infrared wavelengths when excited with ultra violet or near infrared light.