Abstract: Microneedle (100, 200, 300, 720) comprising an elongated body (110, 210, 310) extending along a longitudinal axis from a top end to a bottom end on a substrate (300, 710), where the elongated body comprises an upper portion (120, 220, 320) and a lower portion (130, 230, 330). The lower portion (130, 230, 330) comprises an internal capillary bore hole (260, 730) extending into the substrate (300, 710). The upper portion (120, 220, 320) of the elongated body (110, 210, 310) has a semi-enclosed internal void space (140, 240) formed by at least three body sides whereof two body sides join at a sharp edge and a third body side is provided with an opening slit (150, 250, 350) extending from the lower portion (130, 230, 330) of the elongated body (110, 210, 310) to the upper end of the third body side. The top end of the elongated body (110, 210, 310) is configured as a bevel to create a sharp tip at the top of said edge, said bevel extending to the third body side.

Abstract: Sensor assembly comprising a first substrate, a second substrate and a sensor. The first substrate comprises at least one plurality of capillary bores defining a fluid path. The fluid path is extending through said first substrate from a top side to a fluid channel on a bottom side of said first substrate. The second substrate is arranged in connection with the first substrate and the fluid channel of the first substrate is in fluid communication with a first metallised via and a second metallised via formed in the second substrate. Thereby extending the fluid path through the first metallised via and the second metallised via. The sensor comprise a first electrode and a second electrode. The first electrode and the second electrode are arranged on the second substrate in fluid communication with the fluid channel of the first substrate. The first electrode is in electric contact with the first metallised via and the second electrode is in electric contact with the second metallised via.

Abstract: A suction applying device (10) for applying suction to a sampling unit (50) for sampling bodily fluid, wherein the suction applying device comprises a syringe body (12) with a hollow interior (14) and a piston (20) movable inside the hollow interior of the syringe body. The syringe body has a rear end (16) through which a piston rod (21) connected to the piston extends outside of the syringe body and by means of which the piston can be moved, and a front end (18) opposite the rear end. The suction applying device further comprises a connection arrangement (130) configured for connection of a sampling unit, wherein the connection arrangement is located at the front end of the syringe body.

Abstract: A microneedle and a chip are disclosed for extraction fluids. The microneedle is provided on a substrate and comprises an elongated body extending from a distal end with a bevel to a proximal end on the substrate along a longitudinal axis. The elongated body comprises a capillary bore extending in a longitudinal direction thereof and defines a fluid path. The proximal end is integrally connected with the substrate and the capillary bore is in fluid communication with a fluid channel of the substrate. The cross-sectional area of the capillary bore in the distal end is larger than the cross-sectional area of the capillary bore in the proximal end.

Abstract: A microneedle and a chip are disclosed for extraction of fluids. The microneedle (101) provided on a substrate (102), comprises an elongated body (503) extending from a distal end (504) with a bevel (505) to a proximal end (506) on the substrate along a longitudinal axis; the elongated body comprises a capillary bore (507) extending in a longitudinal direction thereof and defines a fluid path (508); the proximal end is integrally connected with the substrate and the capillary bore is in fluid communication with a fluid channel (309) of the substrate. The cross-sectional area of the capillary bore in the distal end is larger than the cross-sectional area of the capillary bore in the proximal end.

Abstract: The present invention relates to a method for analysing susceptibility of a glucose metabolizing microorganism to at least one antibiotic agent, comprising cultivating the microorganism in a culture medium in the presence and absence of antibiotic agent and measuring the rate of change in glucose concentration in the respective media. The invention further relates to a method for assessing efficacy of a candidate antibiotic agent in treatment of a medical condition caused or complicated by an infection by using the method according to the invention, as well as a culture medium suitable for use in the methods.

Abstract: A suction applying device (10) for applying suction to a sampling unit (50) for sampling bodily fluid, wherein the suction applying device comprises a syringe body (12) with a hollow interior (14) and a piston (20) movable inside the hollow interior of the syringe body. The syringe body has a rear end (16) through which a piston rod (21) connected to the piston extends outside of the syringe body and by means of which the piston can be moved, and a front end (18) opposite the rear end. The suction applying device further comprises a connection arrangement (130) configured for connection of a sampling unit, wherein the connection arrangement is located at the front end of the syringe body.

Abstract: A microneedle and a chip are disclosed for extraction of fluids. The microneedle (101) provided on a substrate (102), comprises an elongated body (503) extending from a distal end (504) with a bevel (505) to a proximal end (506) on the substrate along a longitudinal axis; the elongated body comprises a capillary bore (507) extending in a longitudinal direction thereof and defines a fluid path (508); the proximal end is integrally connected with the substrate and the capillary bore is in fluid communication with a fluid channel (309) of the substrate. The cross-sectional area of the capillary bore in the distal end is larger than the cross-sectional area of the capillary bore in the proximal end.

Abstract: A micromechanical pressure relief valve arrangement comprises a stack of wafers. An active pressure relief valve is realized within the stack of wafers. A passive pressure relief valve is also realized within the stack of wafers, arranged in parallel to the active pressure relief valve. A check valve, also realized within the stack of wafers, is arranged in series with both the active pressure relief valve and the passive pressure relief valve.

Abstract: A wafer assembly (30) includes a substrate (71), in turn including a wafer (70) or a stack of wafers. The wafer assembly (30) further includes an electrical connection (32) arranged through at least a part of the substrate (71). The electrical connection (32) is made by low-resistance silicon. The electrical connection (32) is positioned in a hole (84) penetrating at least a part of the substrate (71). A surface (78) of the substrate (71) confining the hole (84) is electrically insulating. The electrical connection (32) has at least one protrusion (75), which protrudes transversally to a main extension (83) of the hole (84) and the protrusion (75) protrudes outside a minimum hole diameter (85), as projected in the main extension (83) of the hole (84). Preferably, the protrusion (75) is supported by a support surface (81) of the substrate (71). A manufacturing method is also disclosed.

Abstract: An isolation valve system includes a main body (32), an actuator body (34) and a sealing membrane (307) arranged at a high pressure portion (36) of the isolation valve system. The sealing membrane mechanically attaches the actuator body to the main body. The sealing membrane further seals the high pressure portion from a low pressure portion (38). A burst plug (315) is arranged against the main body and supports the actuator body. An activation arrangement (50) is arranged for allowing an at least partial displacement of the burst plug, typically causing a phase transition. The sealing membrane is dimensioned to break when the actuator body is moved due to the displacement of the burst plug. The isolation valve system includes preferably a stack (30) of substrates (301-304) being bonded together. The substrates have micromechanical structures, which form at least the actuator body and the sealing membrane.

Abstract: A micromechanical pressure relief valve arrangement (10) comprises a stack of wafers (13). An active pressure relief valve (20) is realized within the stack of wafers (13). A passive pressure relief valve (30) is also realized within said stack of wafers (13), arranged in parallel to the active pressure relief valve (20). A check valve (50), also realized within the stack of wafers (13), is arranged in series with both the active pressure relief valve (20) and the passive pressure relief valve (30).

Abstract: A wafer assembly (30) includes a substrate (71), in turn including a wafer (70) or a stack of wafers. The wafer assembly (30) further includes an electrical connection (32) arranged through at least a part of the substrate (71). The electrical connection (32) is made by low-resistance silicon. The electrical connection (32) is positioned in a hole (84) penetrating at least a part of the substrate (71). A surface (78) of the substrate (71) confining the hole (84) is electrically insulating. The electrical connection (32) has at least one protrusion (75), which protrudes transversally to a main extension (83) of the hole (84) and the protrusion (75) protrudes outside a minimum hole diameter (85), as projected in the main extension (83) of the hole (84). Preferably, the protrusion (75) is supported by a support surface (81) of the substrate (71). A manufacturing method is also disclosed.

Abstract: A method of making an electrical connection between a first (top) and a second (bottom) surface of a conducting or semi-conducting substrate includes creating a trench in the first surface, and establishing an insulating enclosure entirely separating a portion of the substrate, defined by the trench. Also described is a product usable as a starting substrate for the manufacture of micro-electronic and/or micro-mechanic devices, including a flat substrate of a semi-conducting or conducting material, and having a first and a second surface and at least one electrically conducting member extending through the substrate. The electrically conducting member is insulated from surrounding material of the flat substrate by a finite layer of an insulating material, and includes the same material as the substrate, i.e. it is made from the wafer material.

Abstract: An isolation valve system includes a main body (32), an actuator body (34) and a sealing membrane (307) arranged at a high pressure portion (36) of the isolation valve system. The sealing membrane mechanically attaches the actuator body to the main body. The sealing membrane further seals the high pressure portion from a low pressure portion (38). A burst plug (315) is arranged against the main body and supports the actuator body. An activation arrangement (50) is arranged for allowing an at least partial displacement of the burst plug, typically causing a phase transition. The sealing membrane is dimensioned to break when the actuator body is moved due to the displacement of the burst plug. The isolation valve system includes preferably a stack (30) of substrates (301-304) being bonded together. The substrates have micromechanical structures, which form at least the actuator body and the sealing membrane.

Abstract: In manufacturing a pressure sensor a recess that will form part of the sensor cavity is formed in a lower silicon substrate. An SOI-wafer having a monocrystalline silicon layer on top of a substrate is bonded to the lower silicon substrate closing the recess and forming the cavity. The supporting substrate of the SOI-wafer is then etched away, the portion of the monocrystalline layer located above the recess forming the sensor diaphragm. The oxide layer of the SOI-wafer here acts as an “ideal” etch stop in the case where the substrate wafer is removed by dry (plasma) or wet etching using e.g. KOH. This is due to high etch selectivity between silicon and oxide for some etch processes and it results in a diaphragm having a very accurately defined and uniform thickness. The cavity is evacuated by forming a opening to the cavity and then sealing the cavity by closing the opening using LPCVD. Sensor paths for sensing the deflection of the diaphragm are applied on the outer or inner surface of the diaphragm.

Abstract: A method of making an electrical connection between a first (top) and a second (bottom) surface of a conducting or semi-conducting substrate includes creating a trench in the first surface, and establishing an insulating enclosure entirely separating a portion of the substrate, defined by the trench. Also described is a product usable as a starting substrate for the manufacture of micro-electronic and/or micro-mechanic devices, including a flat substrate of a semi-conducting or conducting material, and having a first and a second surface and at least one electrically conducting member extending through the substrate. The electrically conducting member is insulated from surrounding material of the flat substrate by a finite layer of an insulating material, and includes the same material as the substrate, i.e. it is made from the wafer material.

Abstract: A miniaturized X-ray source is disclosed. It comprises an anode structure (43) and a cathode structure (41), each having an essentially pointed portion (44, 42), wherein at least the pointed portions being directed towards each other and enclosed in a vacuum cavity (49). The anode structure has an essentially dome shaped structure having a first essentially flat part (46) surrounded by a second essentially flat part (48), connected by a wall section (47), such that said first and second parts are located at different levels. The pointed portion is provided on said first flat portion and having an extension such that the apex of said pointed portion does not extend beyond the level of said second essentially flat part. A method of making an X-ray source is also disclosed.

Abstract: In manufacturing a pressure sensor a recess that will form part of the sensor cavity is formed in a lower silicon substrate. An SOI-wafer having a monocrystalline silicon layer on top of a substrate is bonded to the lower silicon substrate closing the recess and forming the cavity. The supporting substrate of the SOI-wafer is then etched away, the portion of the monocrystalline layer located above the recess forming the sensor diaphragm. The oxide layer of the SOI-wafer here acts as an “ideal” etch stop in the case where the substrate wafer is removed by dry (plasma) or wet etching using e.g. KOH. This is due to high etch selectivity between silicon and oxide for some etch processes and it results in a diaphragm having a very accurately defined and uniform thickness. The cavity is evacuated by forming a opening to the cavity and then sealing the cavity by closing the opening using LPCVD. Sensor paths for sensing the deflection of the diaphragm are applied on the outer or inner surface of the diaphragm.

Abstract: In manufacturing a pressure sensor a recess that will form part of the sensor cavity is formed in a lower silicon substrate. An SOI-wafer having a monocrystalline silicon layer on top of a substrate is bonded to the lower silicon substrate closing the recess and forming the cavity. The supporting substrate of the SOI-wafer is then etched away, the portion of the monocrystalline layer located above the recess forming the sensor diaphragm. The oxide layer of the SOI-wafer here acts as an “ideal” etch stop in the case where the substrate wafer is removed by dry (plasma) or wet etching using e.g. KOH. This is due to high etch selectivity between silicon and oxide for some etch processes and it results in a diaphragm having a very accurately defined and uniform thickness. The cavity is evacuated by forming a opening to the cavity and then sealing the cavity by closing the opening using LPCVD. Sensor paths for sensing the deflection of the diaphragm are applied on the outer or inner surface of the diaphragm.