Patents by Inventor Pen-Tien Liao

Pen-Tien Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for manufacturing a conductive wire suitable for use in semiconductor packages
    Patent number: 6711925
    Abstract: In a process for manufacturing a conductive wire that is suitable for use in semiconductor packages, a core wire of an extensible metal other than gold is first prepared to have a diameter ranging from 300 &mgr;m to 500 &mgr;m. Thereafter, a gold-containing outer layer having a thickness ranging from 2.5 &mgr;m to 25 &mgr;m is plated onto an outer surface of the core wire so as to form a gold-plated core wire. Subsequently, the gold-plated core wire is drawn to result in the conductive wire having a diameter ranging from 1 &mgr;m to 50 &mgr;m.
    Type: Grant
    Filed: December 17, 2001
    Date of Patent: March 30, 2004
    Assignee: Asep Tec Co., Ltd.
    Inventor: Pen-Tien Liao
  • Process for manufacturing a conductive wire suitable for use in semiconductor packages
    Publication number: 20030113574
    Abstract: In a process for manufacturing a conductive wire that is suitable for use in semiconductor packages, a core wire of an extensible metal other than gold is first prepared to have a diameter ranging from 300 &mgr;m to 500 &mgr;m. Thereafter, a gold-containing outer layer having a thickness ranging from 2.5 &mgr;m to 25 &mgr;m is plated onto an outer surface of the core wire so as to form a gold-plated core wire. Subsequently, the gold-plated core wire is drawn to result in the conductive wire having a diameter ranging from 1 &mgr;m to 50 &mgr;m.
    Type: Application
    Filed: December 17, 2001
    Publication date: June 19, 2003
    Applicant: Asep Tec Co., Ltd.
    Inventor: Pen-Tien Liao