Abstract: An enclosed vertical rack is provided for storing and transporting large substrates. The enclosed vertical rack comprises a movable base, an enclosure on the movable base for accommodating substrates, an alignment facility in the enclosure for receiving substrates, and a sealable door for enclose the enclosure. The enclosure has a gas inlet, and the enclosure or the door has a gas outlet.

Abstract: The present invention generally provides an apparatus and method for processing and transferring substrates in a multi-chamber processing system that has the capability of receiving and performing single substrate processing steps performed in parallel, while using the many favorable aspects of batch processing. Embodiments of the invention described herein are adapted to maximize system throughput, reduce system cost, reduce cost per substrate during processing, increase system reliability, improve the device yield on the processed substrates, and reduce system footprint. In one embodiment, the cluster tool is adapted to perform a wet/clean process sequence in which various substrate cleaning processes are performed on a substrate in the cluster tool.

Abstract: The present invention generally provides an apparatus and method for processing and transferring substrates in a multi-chamber processing system that has the capability of receiving and performing single substrate processing steps performed in parallel, while using the many favorable aspects of batch processing. Embodiments of the invention described herein are adapted to maximize system throughput, reduce system cost, reduce cost per substrate during processing, increase system reliability, improve the device yield on the processed substrates, and reduce system footprint. In one embodiment, the cluster tool is adapted to perform a wet/clean process sequence in which various substrate cleaning processes are performed on a substrate in the cluster tool.

Abstract: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The present invention generally provides an apparatus and method for processing and transferring substrates in a multi-chamber processing system (e.g., a cluster tool) that has the capability of receiving and performing substrate processing steps in any substrate orientation. The various embodiments of the cluster tool may utilize one or more robots that are adapted to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates.