Patents by Inventor Penelope J. V. Luc

Penelope J. V. Luc has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4668581
    Abstract: Bonds between a contact area of a circuit of a semiconductor and a conductor are formed by applying a rotating tool to an opposed surface of the conductor or to an intervening material superposed on it. The conductor may be laminated to one or more layers of insulant material and when that material is for example polyester, the bond may be formed without prior removal of the insulant from between the contact area and the conductor; it is displaced by the effect of the tool. The areas and conductors may be in an array and the tool be brought across the members of the array in succession.
    Type: Grant
    Filed: January 22, 1985
    Date of Patent: May 26, 1987
    Assignee: Luc Technologies Limited
    Inventors: Penelope J. V. Luc, Patrick B. Ryan
  • Patent number: 4628150
    Abstract: There is disclosed a method of permanently joining conductive electrical components comprising placing portions of the two components in surface to surface contact and passing a rapidly rotating wheel across a surface of one of the portions opposed to the said surface in contact, whereby instantaneously a high energy level is created at the surfaces in contact and a bond is formed between them. Particular importance for the method is in the attachment of flexible conductors to the terminal pads of printed circuit boards. The method can also be used in resoldering components together, and in cable-jointing operations. The electrical components thus bonded together are novel products.
    Type: Grant
    Filed: July 25, 1983
    Date of Patent: December 9, 1986
    Assignee: Luc Technologies Limited
    Inventor: Penelope J. V. Luc
  • Patent number: 4355199
    Abstract: A conductive connection between a metallized outer surface of a film of plastics material, such as a polyimide film and a metal or metallized surface of a substrate to which the film is attached. The connection comprises a flexible conductor secured to the substrate and a second film of plastics material which is bonded to the metallized surface of the first film material and to the flexible conductor to effect a conductive connection between the metallized surface of the first film and the substrate. The second film may be so arranged that it holds the flexible conductor in close contact with the metallized layer on the first film to effect an electrical connection but is preferably metallized whereby an additional electrical connection is effected by way of its metallized surface and the flexible conductor.
    Type: Grant
    Filed: January 4, 1980
    Date of Patent: October 19, 1982
    Inventor: Penelope J. V. Luc