Abstract: A video frame extraction method includes uploading a video through an online access link and locally caching the video to a local database; generating a local access link of the video according to the online access link that includes a local cache identifier and a local video identifier; in response to a video frame extraction request for the video, obtaining a playback time of target video frame of the video for extracting and triggering an access request and carrying the playback time of target video frame; forwarding the access request to the local database in response to identifying the local cache identifier from the local access link, to enable the local database to return a locally cached video that matches based on the local video identifier; and obtaining the locally cached video returned by the local database and extracting a video frame matching the playback time of target video frame.

Abstract: This application discloses a channel sounding method and a communication apparatus. One example method includes: generating, by a first access point, a construction frame, wherein the construction frame indicates a second access point to perform channel sounding, the construction frame comprises identifier information of the second access point, identifier information of at least one station, and a first sounding dialog token number, the at least one station is associated with the first access point, and the first sounding dialog token number is used to identify the construction frame; and sending, by the first access point, the construction frame.

Abstract: The present application provides chip package structures and manufacturing methods thereof. In one example, the chip package structure includes: a base board including a grounding pad; a chip assembly located at a first surface of the base board; a package body covering the chip assembly, wherein a side wall of the package body is located in an extension direction of a side wall of the base board, and the side wall of the package body and the first surface of the base board have an acute included angle therebetween; and a shielding layer covering the side walls of the package body and the base board and electrically connected with the grounding pad.

Abstract: A micro LED element, a micro LED display panel, and a display device are provided. The micro LED display panel includes a micro LED chip including a driving layer and a micro LED array disposed on the driving layer, the driving layer being configured to receive signals for driving the micro LED array; a flexible circuit board (FCB) disposed adjacent to the micro LED chip and configured to couple to the micro LED chip; a molded layer disposed to join the micro LED chip and the FCB together, to leave an open region above the micro LED array; and a transparent cover disposed within the open region to shield a top surface of the micro LED array.

Abstract: A micro LED element, a micro LED display panel, and a display device are provided. The micro LED display panel includes a micro LED chip including a driving layer and a micro LED array disposed on the driving layer, the driving layer including a signal zone on which the micro LED array is not disposed and being configured to receive signals for driving the micro LED array; a flexible circuit board (FCB) disposed adjacent to the signal zone, the FCB being configured to couple to the signal zone of the driving layer; and a molded layer disposed to join the micro LED chip and the FCB together, and leave an open region above the micro LED array.

Abstract: A micro LED element, a micro LED display panel, and a display device are provided. The micro LED display panel includes a micro LED chip including a driving layer; a micro LED array disposed on the driving layer; and a transparent protective layer disposed on the micro LED array, wherein the driving layer is configured to receive signals for driving the micro LED array; a flexible circuit board (FCB) disposed adjacent to the micro LED chip and configured to couple to the micro LED chip; and a molded layer disposed to join the micro LED chip and the FCB together.

Abstract: A micro LED element, a micro LED display panel, and a display device are provided. The micro LED display panel includes a micro LED chip including a driving layer and a micro LED array disposed on the driving layer, the driving layer being configured to receive signals for driving the micro LED array; a substrate layer disposed on a back surface of the driving layer, the substrate layer including a reception structure not covered by the micro LED chip; and a molded layer disposed on the micro LED chip and the substrate layer, and disposed into the reception structure to collaboratively enclose a periphery of the micro LED chip with the substrate layer, leaving an open region above the micro LED array.

Abstract: A micro LED element, a micro LED display panel, and a display device are provided. The micro LED display panel includes a micro LED chip including a driving layer and a micro LED array disposed on the driving layer, the driving layer being configured to receive signals for driving the micro LED array; a substrate layer disposed around the micro LED chip; a flexible circuit board (FCB) disposed on the substrate layer and adjacent to the micro LED chip and configured to couple to the micro LED chip; and a molded layer disposed on the micro LED chip, the substrate layer, and the FCB to join the micro LED chip and the FCB together, leaving an open region above the micro LED array.

Abstract: A micro LED element, a micro LED display panel, and a display device are provided. The micro LED display panel includes a micro LED chip including a driving layer and a micro LED array disposed on the driving layer, the driving layer being configured to receive signals for driving the micro LED array; a flexible circuit board (FCB) disposed adjacent to the micro LED chip and configured to couple to the micro LED chip; and a molded layer disposed on the micro LED chip and the FCB to join the micro LED chip and the FCB together, wherein the molded layer includes an inclined sidewall and a vertical sidewall together forming an open region above the micro LED array, the open region outwardly widening from a bottom to a top of the inclined sidewall, the inclined sidewall connects to the vertical sidewall at the top of the inclined sidewall, and the bottom of the inclined sidewall is adjacent to the micro LED chip around the micro LED array.

Abstract: A micro LED display panel, and a display device are provided. The micro LED display panel includes a micro LED chip including a driving layer and a micro LED array disposed on the driving layer, the driving layer including a signal zone, on which the micro LED array is not disposed, configured to receive signals for driving the micro LED array; a flexible circuit board (FCB) disposed adjacent to the signal zone, the FCB being configured to couple to the signal zone of the driving layer; a molded layer disposed to join the micro LED chip and the FCB together, and leave an open region above the micro LED array; and a substrate layer disposed cooperatively with the molded layer to join the micro LED chip and at least a portion of the FCB, wherein the molded layer, the micro LED chip, and the FCB are disposed on a front surface of the substrate layer, the substrate layer including an edge on which the molded layer is not disposed.

Abstract: The present disclosure relates to the technical field of communications, and relates to a signal transmission method, apparatus and system.

Abstract: A wiring module, a combiner box and a converter are provided. In the wiring module, a side of a first switch thereof serves as a positive input terminal and is connected to a positive electrode of at least one direct-current power supply, a side of a second switch thereof serves as a negative input terminal and is connected to a negative electrode of at least one direct-current power supply, and a direct-current power supply which any of the positive input terminal is connected and to which any of the negative input terminal is connected is in a quantity of less than or equal to 1, that is, different direct-current power supplies are not connected in parallel.

Abstract: An active optical cable, comprising an optical cable assembly (10) and an optical module (20). The optical cable assembly (10) comprises a first insertion core (11), the optical module (20) comprises a second insertion core (221), and the first insertion core (11) and the second insertion core (221) are joined in an insertion cavity (31) of an adapter (30), so as to achieve optical signal interaction between the optical cable assembly (10) and the optical module (20). The adapter (30) further has a first adjustment structure (32), a housing further has a second adjustment structure (212), and the first adjustment structure (32) and the second adjustment structure (212) are used for acting in concert to adjust the position of the adapter (30) in a mounting cavity (211), so as to adjust the bending of a connecting optical fiber (222).

Abstract: A method for determining material-cage stacking, a computer device, and a storage medium are provided. The method includes the following. A material-cage image is obtained by photographing a first stacking apparatus of a first material cage and a second stacking apparatus of a second material cage. The stacking apparatuses of the two material cages in the material-cage image can be recognized respectively with two detection models. The first stacking result is obtained by obtaining location information of the stacking apparatuses of the two material cages with the first detection model, and the second stacking result is obtained with the second detection model.

Abstract: The present disclosure relates to a communication method, system, base station, and terminal. The method includes: sending, by a first BS, a broadcast message, wherein the broadcast message comprising: one or more CAG IDs and one or more PLMN IDs supported by the first BS; receiving, by the first BS, a connection request sent from a terminal; establishing, by the first BS, a RRC connection with the terminal according to the connection request; receiving, by the first BS, a RRC connection setup complete message sent from the terminal, wherein the RRC connection setup complete message carries a CAG ID and a PLMN ID, which correspond to a CAG cell that the terminal selects to access; and allowing, by the first BS, the terminal to access the CAG cell that the terminal selects to access, according to the RRC connection setup complete message.

Abstract: A color film substrate includes a first base substrate, a color film layer disposed at one side of the first base substrate, a protective layer disposed at one side of the color film layer away from the first base substrate, and a plurality of first spacers disposed corresponding to the plurality of first grooves. In the non-display region, a plurality of first grooves are provided at one surface of the protective layer away from the first base substrate. A part of the first spacer is disposed in the first groove.

Abstract: Provided are a method and apparatus for determining a faulty device, a non-volatile computer readable storage medium, and an electronic device. The method for determining the faulty device includes: acquiring a target device Identifier (ID) of a target faulty device; searching preset link information for link information which comprises the target device ID; when link information that includes the target device ID is found indication information in link information indicates that a first switch is present on the device link, determining whether the target faulty device on the device link is located between the processor and the first switch; and when the target faulty device is not located between the processor and the first switch, determining whether the target faulty device is a device on a switch board according to preset record item information and the target device ID.