Patents by Inventor Peng-Chih Wang

Peng-Chih Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240079409
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a first fin structure. The semiconductor device structure includes a first source/drain structure over the first fin structure. The semiconductor device structure includes a first dielectric layer over the first source/drain structure and the substrate. The semiconductor device structure includes a first conductive contact structure in the first dielectric layer and over the first source/drain structure. The semiconductor device structure includes a second dielectric layer over the first dielectric layer and the first conductive contact structure. The semiconductor device structure includes a first conductive via structure passing through the second dielectric layer and connected to the first conductive contact structure. A first width direction of the first conductive contact structure is substantially parallel to a second width direction of the first conductive via structure.
    Type: Application
    Filed: November 6, 2023
    Publication date: March 7, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jyun-De WU, Te-Chih HSIUNG, Yi-Chun CHANG, Yi-Chen WANG, Yuan-Tien TU, Peng WANG, Huan-Just LIN
  • Patent number: 8352924
    Abstract: The present invention discloses a method for multi-core instruction-set simulation. The proposed method identifies the shared data segment and the dependency relationship between the different cores and thus effectively reduces the number of sync points and lowers the synchronization overhead, allowing multi-core instruction-set simulation to be performed more rapidly while ensuring that the simulation results are accurate. In addition, the present invention also discloses a device for multi-core instruction-set simulation.
    Type: Grant
    Filed: October 13, 2009
    Date of Patent: January 8, 2013
    Assignee: National Tsing Hua University
    Inventors: Meng-Huan Wu, Cheng-Yang Fu, Peng-Chih Wang, Ren-Song Tsay
  • Publication number: 20120197625
    Abstract: In the present disclosure, the DOM approach for the simulation of OS preemptive scheduling has presented and demonstrated. By maintaining the data-dependency between the software tasks, and guaranteeing the order of shared variable accesses, it can accurately simulate the preemption effect. Moreover, the proposed DOM OS model is implemented to enable preemptive scheduling in SystemC.
    Type: Application
    Filed: January 28, 2011
    Publication date: August 2, 2012
    Applicant: National Tsing Hua University
    Inventors: Peng-Chih WANG, Meng-Huan Wu, Ren-Song Tsay
  • Publication number: 20100269103
    Abstract: The present invention discloses a method for multi-core instruction-set simulation. The proposed method identifies the shared data segment and the dependency relationship between the different cores and thus effectively reduces the number of sync points and lowers the synchronization overhead, allowing multi-core instruction-set simulation to be performed more rapidly while ensuring that the simulation results are accurate. In addition, the present invention also discloses a device for multi-core instruction-set simulation.
    Type: Application
    Filed: October 13, 2009
    Publication date: October 21, 2010
    Applicant: National Tsing Hua University
    Inventors: Meng-Huan Wu, Cheng-Yang Fu, Peng-Chih Wang, Ren-Song Tsay