Patents by Inventor Peng Choe

Peng Choe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Automated Ball Mounting Process with Solder Ball Testing
    Publication number: 20080101433
    Abstract: An automated ball mounting process is disclosed in which solder balls are tested by heating the solder balls to a temperature between the eutectic temperature of lead-tin and the melting temperature of a lead free solder ball. If the heated solder balls melt they are standard solder balls. If they do not melt they are lead free solder balls. Solder balls that are input into the automated ball mounting process are automatically tested to determine solder ball type. When the test indicates that the wrong type of solder ball is being used an error message is indicated and the solder ball mounting process stops.
    Type: Application
    Filed: October 31, 2007
    Publication date: May 1, 2008
    Inventors: Kong Song, Peng Choe, Tic Medina
  • Automated ball mounting process and system with solder ball testing
    Publication number: 20050279813
    Abstract: An automated ball mounting process and system are disclosed In which solder balls are tested by heating the solder balls to a temperature between the eutectic temperature of lead-tin and the melting temperature of a lead free solder ball. If the heated solder balls melt they are standard solder balls. If they do not melt they are lead free solder balls. Solder balls that are input into the automated ball mounting process are automatically tested to determine solder ball type. When the test indicates that the wrong type of solder ball is being used an error message is indicated and the solder ball mounting process stops.
    Type: Application
    Filed: November 16, 2004
    Publication date: December 22, 2005
    Inventors: Kong Song, Peng Choe, Tic Medina