Patents by Inventor Peng Feng
Peng Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12046308Abstract: A One Time Programmable (OTP) memory can have a memory cell, which includes two series diodes as a fuse structure.Type: GrantFiled: January 12, 2022Date of Patent: July 23, 2024Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.Inventors: Xiong Li, Huangxia Zhu, Peng Feng
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Publication number: 20240243225Abstract: A device includes a light emitting diode (LED) configured to emit light characterized by a peak wavelength, a lower wavelength band extending across lower wavelengths than the peak wavelength, and a higher wavelength band extending across higher wavelengths than the peak wavelength. The device also includes a reflector positioned in a first direction from the LED. The device also includes a distributed Bragg reflector (DBR) having a lower reflectance than the reflector, positioned in a second direction from the LED opposite the first direction, and configured to block light within a stopband overlapping a portion of the lower wavelength band or a portion of the higher wavelength band but not overlapping the peak wavelength, such that the DBR propagates filtered light in the second direction.Type: ApplicationFiled: December 6, 2023Publication date: July 18, 2024Inventors: Peng Feng, Jack Haggar, Nicolas Poyiatzis, Ye Tian, Xiang Yu
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Publication number: 20240243232Abstract: A method of fabricating a semiconductor device having a distributed Bragg reflector (DBR) includes depositing, above a DBR deposition surface, a plurality of DBR layers to form a DBR, forming at least one aperture extending through the plurality of DBR layers to expose each DBR layer, and applying electrochemical etching to the plurality of DBR layers via the at least one aperture, thereby transforming at least one DBR layer of the plurality of DBR layers into a nanoporous structure.Type: ApplicationFiled: December 6, 2023Publication date: July 18, 2024Inventors: Ye Tian, Xiang Yu, Peng Feng, Nicolas Poyiatzis, Jack Haggar
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Publication number: 20240243226Abstract: A method of fabricating a semiconductor device includes forming, above a substrate surface, a plurality of distributed Bragg reflector (DBR) layers to form a DBR; forming, above the DBR, a first light emitting diode (LED) configured to emit light; and forming, above the first LED, a first reflector having a higher reflectance than the DBR, such that the first reflector and the DBR define a first resonant cavity having a length effective to collimate a first wavelength of the light emitted by the first LED and propagate the collimated light of the first wavelength through the DBR.Type: ApplicationFiled: December 6, 2023Publication date: July 18, 2024Inventors: Ye Tian, Xiang Yu, Peng Feng, Nicolas Poyiatzis, Jack Haggar
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Patent number: 12038195Abstract: An air conditioning system, comprising an outdoor unit and an indoor heat exchange mechanism. The indoor heat exchange mechanism comprises an air conditioner indoor unit and a first heat exchange mechanism used for at least one among water cooling, water heating and space heating. The present air conditioning system integrates various functions into one, such as air-conditioning refrigeration, air-conditioning heating, producing household cold water, producing household hot water, and home heating by means of connecting indoor units for cooling and heating, a water cooling mechanism, a water heating mechanism and a device for floor heating located indoors to one outdoor unit. Moreover, the system directly utilizes high-temperature refrigerant to heat water for floor heating.Type: GrantFiled: December 14, 2018Date of Patent: July 16, 2024Assignee: Gree Electric Appliances, Inc. of ZhuhaiInventors: Shiqiang Zhang, Lianfa Wu, Limin Li, Huachao Jiao, Tao Feng, Bing Zhou, Peng Cao
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Patent number: 11985593Abstract: Embodiments of this application relate to a data processing method and a terminal. The method includes: obtaining a first network wakeup parameter, where the first network wakeup parameter is used to wake up an application program; performing reconfiguration processing on the first network wakeup parameter based on a preset first configuration condition to obtain a second network wakeup parameter; and configuring a driver of the terminal based on the second network wakeup parameter. The second network wakeup parameter is written into Wi-Fi firmware, so that the Wi-Fi firmware directly performs processing without waking up the application program when the first network wakeup parameter is received next time. Therefore, power consumption of the terminal is reduced, and a standby time of the terminal is prolonged.Type: GrantFiled: March 7, 2023Date of Patent: May 14, 2024Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Peng Feng, Bin Luo
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Publication number: 20240142512Abstract: A semiconductor device testing system, with a platform for supporting a semiconductor substrate, a light emitting system directed toward the platform, a controller, coupled to the light emitting system and adapted to selectively alter an operational parameter of the light emitting system, and a tester configured to characterize an electrical parameter of an electrical device formed in or over the semiconductor substrate while the electrical device is illuminated by one or more wavelengths of light emitted by the light emitting system under direction of the controller.Type: ApplicationFiled: October 31, 2022Publication date: May 2, 2024Inventors: Zhi Peng Feng, Ren Hui Fan, Alfred Griffin, He Lin
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Publication number: 20240120368Abstract: A method of fabricating an integrated circuit includes etching trenches in a first surface of a semiconductor layer. A trench dielectric layer is formed over the first surface and over bottoms and sidewalls of the trenches and a doped polysilicon layer is formed over the trench dielectric layer and within the trenches. The doped polysilicon layer is patterned to form a polysilicon bridge that connects to the polysilicon within the filled trenches and a blanket implant of a first dopant is directed to the polysilicon bridge and to the first surface. The blanket implant forms a contact region extending from the first surface into the semiconductor layer.Type: ApplicationFiled: December 18, 2023Publication date: April 11, 2024Inventors: Jing Hu, ZHI PENG Feng, Chao Zuo, Dongsheng Liu, Yunlong Liu, Manoj K Jain, Shengpin Yang
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Patent number: 11888021Abstract: A method of fabricating an integrated circuit includes etching trenches in a first surface of a semiconductor layer. A trench dielectric layer is formed over the first surface and over bottoms and sidewalls of the trenches and a doped polysilicon layer is formed over the trench dielectric layer and within the trenches. The doped polysilicon layer is patterned to form a polysilicon bridge that connects to the polysilicon within the filled trenches and a blanket implant of a first dopant is directed to the polysilicon bridge and to the first surface. The blanket implant forms a contact region extending from the first surface into the semiconductor layer.Type: GrantFiled: September 29, 2021Date of Patent: January 30, 2024Assignee: Texas Instruments IncorporatedInventors: Jing Hu, Zhi Peng Feng, Chao Zuo, Dongsheng Liu, Yunlong Liu, Manoj K Jain, Shengpin Yang
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Patent number: 11829696Abstract: A connection analysis method for a multi-port nested model and a medium. The method includes: acquiring instance information and nested relationships of a multi-port nested model, and building an instance relationship tree; reading port information and connection information of instances, and adding the port information and the connection information to the instance relationship tree; acquiring the port information and the connection information of the instances of each node layer by layer according to the instance relationship tree to build a connection dictionary; and acquiring port-to-port connection information of the instances by retrieving the connection dictionary to perform connection analysis on the multi-port nested model.Type: GrantFiled: September 30, 2021Date of Patent: November 28, 2023Assignee: INSPUR SUZHOU INTELLIGENT TECHNOLOGY CO., LTD.Inventors: Peng Feng, Xinwu Shen, Ruizhen Wu, Fang Wang
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Patent number: 11788829Abstract: A simultaneous phase-shift point diffraction interferometer and method for detecting wave aberration. The interferometer comprises an ideal spherical wave generation module, an optical system to be measured, an image plane mask, a polarization phase shift module, a two-dimensional polarization imaging photodetector and a data processing unit. Single photodetector is adopted to realize simultaneous detection of more than three phase shift interference patterns, and has the advantages that environmental interference suppression, a flexible optical path, high measurement accuracy, and calibration of system errors of the interferometer may be realized.Type: GrantFiled: April 25, 2022Date of Patent: October 17, 2023Assignee: Shanghai Institute of Optics And Fine Mechanics, Chinese Academy of SciencesInventors: Peng Feng, Zhongliang Li, Xiangzhao Wang, Yang Bu
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Publication number: 20230284137Abstract: Embodiments of this application relate to a data processing method and a terminal. The method includes: obtaining a first network wakeup parameter, where the first network wakeup parameter is used to wake up an application program; performing reconfiguration processing on the first network wakeup parameter based on a preset first configuration condition to obtain a second network wakeup parameter; and configuring a driver of the terminal based on the second network wakeup parameter. The second network wakeup parameter is written into Wi-Fi firmware, so that the Wi-Fi firmware directly performs processing without waking up the application program when the first network wakeup parameter is received next time. Therefore, power consumption of the terminal is reduced, and a standby time of the terminal is prolonged.Type: ApplicationFiled: March 7, 2023Publication date: September 7, 2023Inventors: Peng Feng, Bin Luo
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Publication number: 20230229838Abstract: A connection analysis method for a multi-port nested model and a medium. The method includes: acquiring instance information and nested relationships of a multi-port nested model, and building an instance relationship tree; reading port information and connection information of instances, and adding the port information and the connection information to the instance relationship tree; acquiring the port information and the connection information of the instances of each node layer by layer according to the instance relationship tree to build a connection dictionary; and acquiring port-to-port connection information of the instances by retrieving the connection dictionary to perform connection analysis on the multi-port nested model.Type: ApplicationFiled: September 30, 2021Publication date: July 20, 2023Inventors: Peng FENG, Xinwu SHEN, Ruizhen WU, Fang WANG
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Publication number: 20230160684Abstract: A simultaneous phase-shift point diffraction interferometer and method for detecting wave aberration. The interferometer comprises an ideal spherical wave generation module, an optical system to be measured, an image plane mask, a polarization phase shift module, a two-dimensional polarization imaging photodetector and a data processing unit. Single photodetector is adopted to realize simultaneous detection of more than three phase shift interference patterns, and has the advantages that environmental interference suppression, a flexible optical path, high measurement accuracy, and calibration of system errors of the interferometer may be realized.Type: ApplicationFiled: April 25, 2022Publication date: May 25, 2023Inventors: Peng FENG, Zhongliang Li, Xiangzhao Wang, Yang Bu
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Publication number: 20230152895Abstract: Disclosed are method for changing displayed scene, intelligent display screen and readable storage medium. The method includes: determining (201) a plurality of candidate signal transmitting devices and a distance between each candidate signal transmitting device and the intelligent display screen based on a plurality of received signals; determining (202) a target signal transmitting device closest to the intelligent display screen from a plurality of candidate signal transmitting devices and a target area to which the target signal transmitting device belongs; and determining (203) a target scene corresponding to the target area in a layout diagram displayed by the intelligent display screen and changing the displayed scene of the intelligent display screen to the target scene. Therefore, a displayed scene of the intelligent display screen can be automatically changed in real time, and the efficiency and effectiveness of changing the displayed scene of the intelligent display screen can be improved.Type: ApplicationFiled: November 4, 2020Publication date: May 18, 2023Inventor: Peng Feng
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Patent number: 11627527Abstract: A data processing method includes obtaining a first network wakeup parameter, where the first network wakeup parameter is used to wake up an application program. The data processing method further includes performing reconfiguration processing on the first network wakeup parameter based on a preset first configuration condition to obtain a second network wakeup parameter, and configuring a driver of the terminal based on the second network wakeup parameter. The second network wakeup parameter is written into Wi-Fi firmware so that the Wi-Fi firmware directly performs processing without waking up the application program when the first network wakeup parameter is received next time.Type: GrantFiled: June 28, 2021Date of Patent: April 11, 2023Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Peng Feng, Bin Luo
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Publication number: 20220416014Abstract: In a described example, a method of forming a capacitor includes forming a doped polysilicon layer over a semiconductor substrate. The method also includes forming a dielectric layer on the doped polysilicon layer. The method also includes forming an undoped polysilicon layer on the dielectric layer.Type: ApplicationFiled: October 27, 2021Publication date: December 29, 2022Inventors: Furen Lin, Yunlong Liu, Zhi Peng Feng, Rui Liu, Rui Song, Manoj K. Jain
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Publication number: 20220406885Abstract: A method of fabricating an integrated circuit includes etching trenches in a first surface of a semiconductor layer. A trench dielectric layer is formed over the first surface and over bottoms and sidewalls of the trenches and a doped polysilicon layer is formed over the trench dielectric layer and within the trenches. The doped polysilicon layer is patterned to form a polysilicon bridge that connects to the polysilicon within the filled trenches and a blanket implant of a first dopant is directed to the polysilicon bridge and to the first surface. The blanket implant forms a contact region extending from the first surface into the semiconductor layer.Type: ApplicationFiled: September 29, 2021Publication date: December 22, 2022Inventors: Jing Hu, Zhi Peng Feng, Chao Zuo, Dongsheng Liu, Yunlong Liu, Manoj K. Jain, Shengpin Yang
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Publication number: 20220343987Abstract: A One Time Programmable (OTP) memory can have a memory cell, which includes two series diodes as a fuse structure.Type: ApplicationFiled: January 12, 2022Publication date: October 27, 2022Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.Inventors: Xiong LI, Huangxia ZHU, Peng FENG
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Patent number: RE49297Abstract: An immersion lithographic apparatus is provided having a substrate table including a drain configured to receive immersion fluid which leaks into a gap between an edge of a substrate on the substrate table and an edge of a recess in which the substrate is located. A thermal conditioning system is provided to thermally condition at least the portion of the recess supporting the substrate by directing one or more jets of fluid onto a reverse side of the section supporting the substrate.Type: GrantFiled: October 18, 2019Date of Patent: November 15, 2022Assignee: ASML Netherlands B.V.Inventors: Hrishikesh Patel, Johannes Henricus Wilhelmus Jacobs, Gerardus Adrianus Antonius Maria Kusters, Thibault Simon Mathieu Laurent, Marcio Alexandre Cano Miranda, Ruud Hendricus Martinus Johannes Bloks, Peng Feng, Johan Gertrudis Cornelis Kunnen