Abstract: The present disclosure provides a three-dimensionally arranged nanoparticle film and a preparation method and use thereof, and belongs to the technical field of nanophotonics. The preparation method includes the following steps: coating nanoparticles with hydrophobic molecules, and dispersing in an organic solvent to obtain a modified nanoparticle dispersion; conducting a surface treatment on a three-dimensional template to obtain a hydrophilic three-dimensional template; and adding water to a surface of the hydrophilic three-dimensional template to form a water film, adding the modified nanoparticle dispersion dropwise on a surface of the water film to conduct self-assembly, and removing the water film to obtain a three-dimensionally arranged nanoparticle film with an array structure.

Abstract: The present invention discloses a package structure for reducing warpage of plastic package wafer, including an adapter board, a chip mounted on the adapter board, and a first plastic package layer covering the chip, through-silicon-vias are disposed on the adapter board, the first and second surfaces of the adapter board are respectively provided with external connection solder balls and/or external connection solder pads electrically connected with the through-silicon-vias. The process of manufacturing the package structure includes: after the first surface process of the adapter board is completed, bonding the first carrier on its first surface, then cutting the first carrier to expose the chip-mounting area, and then carrying out subsequent processes such as chip mounting, and finally cutting and removing the first carrier to complete the package.