Patents by Inventor Peng-Huei Wang

Peng-Huei Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHODS OF TSV FORMATION FOR ADVANCED PACKAGING
    Publication number: 20240087958
    Abstract: The present disclosure relates to through-via structures with dielectric shielding of interconnections for advanced wafer level semiconductor packaging. The methods described herein enable the formation of high thickness dielectric shielding layers within low aspect ratio through-via structures, thus facilitating thin and small-form-factor package structures having high I/O density with improved bandwidth and power.
    Type: Application
    Filed: November 14, 2023
    Publication date: March 14, 2024
    Inventors: Peng SUO, Ying W. WANG, Guan Huei SEE, Chang Bum YONG, Arvind SUNDARRAJAN
  • Multimedia player
    Patent number: D541812
    Type: Grant
    Filed: December 30, 2005
    Date of Patent: May 1, 2007
    Assignee: Micro-Star Int'l Co., Ltd.
    Inventor: Peng-Huei Wang