Patents by Inventor Peng-Jen Weng

Peng-Jen Weng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dual-band dual-feed antenna
    Publication number: 20090213011
    Abstract: An antenna includes an open loop conductor, a pair of feeding points, and a conductive arm. The open loop conductor includes a loop element that has opposite first and second ends, and first and second feeding elements, each of which is connected to a respective one of first and second ends of the loop element. Each of the feeding points is provided on a respective one of the first and second feeding elements. The conductive arm extends from the open loop conductor.
    Type: Application
    Filed: September 4, 2008
    Publication date: August 27, 2009
    Applicant: Quanta Computer Inc.
    Inventors: Tiao-Hsing Tsai, Chieh-Ping Chiu, Chih-Wei Liao, Peng-Jen Weng
  • Low-Profile Antenna
    Publication number: 20090195478
    Abstract: An antenna includes a dielectric substrate, feeding and grounding elements, a base element, a radiating element, and an interconnecting element. The feeding and grounding elements are formed on the dielectric substrate. The base element is mounted on the dielectric substrate such that the base element is in electrical contact with the feeding and grounding elements. The radiating element is spaced apart from the dielectric substrate. The interconnecting element interconnects the base element and the radiating element.
    Type: Application
    Filed: July 16, 2008
    Publication date: August 6, 2009
    Applicant: Quanta Computer Inc.
    Inventors: Tiao-Hsing Tsai, Chieh-Ping Chiu, Chih-Wei Liao, Peng-Jen Weng
  • Capacitively loaded antenna
    Publication number: 20090179802
    Abstract: An antenna includes a dielectric substrate, a radiating element, feeding and grounding elements, and a screw. The radiating element is formed on the dielectric substrate. Each of the feeding and grounding elements is formed on the dielectric substrate and is connected electrically to the radiating element. The screw extends through the dielectric substrate and is connected electrically to the radiating element.
    Type: Application
    Filed: September 3, 2008
    Publication date: July 16, 2009
    Applicant: Quanta Computer Inc.
    Inventors: Tiao-Hsing Tsai, Chieh-Ping Chiu, Peng-Jen Weng